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DeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology of industrial epoxy adhesive.
Deepmaterial is reactive hot melt pressure sensitive adhesive manufacturer and supplier,manufacturing one component epoxy underfill adhesives,hot melt adhesives glue,uv curing adhesives,high refractive index optical adhesive,magnet bonding adhesives,best top waterproof structural adhesive glue for plastic to metal and glass,electronic adhesives glue for electric motor and micro motors in home appliance
DeepMaterial is focus on the latest technology of semiconductor, and we always develop the epoxy adhesive for the latest electric products packaging and testing.
UV dual cure silicone adhesive sealant product ranges UV cure silicone adhesives offer a high-speed cure within low temperatures. Crosslinking is initiated by the light through photochemical reactions instead of heat. This adhesive can be processed through injection molding or extrusion. UV cure silicone adhesive can be used in different applications....
Is potting electronics with hot glue ideal? Hot glue can be a good choice if your potting needs involve the protection of spruced wire. When you decide to pot with hot melt, there are several advantages that you can enjoy over other options. However, things have to be done correctly...
The best epoxy resin manufacturer in china for high-quality electronic products Synthetic epoxy resin can be used for different purposes. This is usually made by mixing a hardener and a resin that match one another in a given ratio. After they are mixed, a chemical reaction is initiated. The curing...
UV curable pressure-sensitive adhesives for fabricating semiconductors unbreakable bonds UV cure adhesives are becoming very popular today because of their superiority. The polymer, in this case, is usually made of polyurethane epoxy, silicone, or other polymers that can dry clear after exposure to light. In this case, UV wavelength acts...
PCB potting compound choices for electronic components from potting material manufacturers In many electronic components, it is important to achieve reliable and long-term protection. It is one of the ways in which premature failure can be prevented. The rising circuit density and small systems have led to much high operating...
How to find the right chip bonding adhesive for smart card chip and microchip In flip chip mounting, the chip has to be inverted so that the adhesive is in contact directly with the circuit board. This allows smaller chip assembly as well as direct signal density. In chip assembly,...
An Overview Of BGA Underfill Process And Non Conductive Via Fill Flip chip packaging exposes chips to mechanical stress because of extensive coefficient thermal expansion mismatch between the silicon chips and the substrate. When there is a high thermal load, the mismatch stresses the chips, thus making reliability a concern....
Potting electronics with silicone for better performance If you want your electronics to give you great performances and to last, you should use silicones for encapsulation and potting. There are more electronics all around us today than ever before. These electronics have become a part of our daily lives in...
How to use a smt underfill epoxy adhesive in various applications Underfill is a liquid polymer type applied to PCBs after going through a reflow process. After the underfill is placed, it is then allowed to cure, encapsulating the bottom side of a chip covering fragile interconnected pads between the...
The need of adhesives glue for potting electronics Potting involves fillings done using an adhesive or potting compound. When this is done, the components are usually in a recess or housing that has to be filled with adhesive. Best structural epoxy adhesive glue manufacturers in china Why it’s needed Circuit boards have several...
Flip Chip Packaging Underfill Bonding Adhesive Die Attach And Its Advantages Flip chip is a method used to attach die. In this attachment method, the electrical connections between substrate and the chip are directly made through the inversion of the die with face down onto the package. Conductive bumps are...
Potting electronics pcb with epoxy potting compound and epoxy resin conformal coating Electronic assemblies have to be protected from a wide range of factors, such as corrosive agents, moisture thermal dissipation, shock, and vibration. The protection is achieved when we do pot. This process involves filling electronic assemblies with compounds...
