DeepMaterial, as an industrial epoxy adhesive manufacturer, we do lost of research about underfill epoxy, non conductive glue for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Base on that, we have the latest technology of industrial epoxy adhesive.
DeepMaterial has developed industrial adhesives for chip packaging and testing, circuit board-level adhe- sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.
To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance.
DeepMaterial offer different kinds of products about industrial adhesive for electric, UV curing UV adhesive series, reactive type of hot melt adhesive and pressure sensitive hot melt adhesiveseries, epoxy-based chip underfill and COB encapsulation materials series, circuit board protection potting and conformal coating adhesive series, epoxy based conductive silver adhesive series, structural bonding adhesive series, functional protective film series, semiconductor protective film series.
DeepMaterial is best one component epoxy underfill encapsulants suppliers company in china,supply on part underfill epoxy for flip chip devices ball grid arrays chip scale packaging csp bga wlcsp lga,low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material,non conductive epoxy adhesive sealant glue for underfill pcb electronic components,semiconductor adhesives for electronic assembly. and so on