Chip Underfill / Packaging
Chip Manufacturing Process Application of DeepMaterial Adhesive Products
Semiconductor technology, especially the packaging of semiconductor devices, has never touched more applications than it does today. As every aspect of everyday life becomes increasingly digital—from automobiles to home security to smartphones and 5G infrastructure—semiconductor packaging innovations are at the heart of responsive, reliable, and powerful electronic capabilities.
Thinner wafers, smaller dimensions, finer pitches, package integration, 3D design, wafer-level technologies and economies of scale in mass production require materials that can support innovation ambitions. Henkel’s total solutions approach leverages extensive global resources to deliver superior semiconductor packaging material technology and cost-competitive performance. From die attach adhesives for traditional wire bond packaging to advanced underfills and encapsulants for advanced packaging applications, Henkel provides the cutting-edge materials technology and global support required by leading microelectronics companies.
Flip Chip Underfill
The underfill is used for mechanical stability of the flip chip. This is especially important when soldering ball grid array (BGA) chips. To reduce the coefficient of thermal expansion (CTE), the adhesive is partially filled with nanofillers.
Adhesives used as chip underfills have capillary flow properties for quick and easy application. A dual-cure adhesive is usually used: the edge areas are held in place by UV curing before the shaded areas are thermally cured.
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