Epoxy underfill chip level adhesives
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Product Specification Parameters
|Reusable||Rapid curing at moderate temperatures|
|Higher glass transition temperature and higher fracture toughness||Ultra-low viscosity for most underfill applications|
It is a reusable CSP (FBGA) or BGA filler used to protect solder joints from mechanical stress in handheld electronic devices. It cures quickly as soon as it is heated. It is designed to provide good protection against failure due to mechanical stress. Low viscosity allows gaps to be filled under CSP or BGA.