I-Miconductor-Packaging-&-Testing-UV-Viscosity-Reduction-Special-Film

I-Semiconductor Packaging & Testing UV Viscosity Reduction Special Film

Umkhiqizo usebenzisa i-PO njengento yokuvikela indawo engaphezulu, esetshenziselwa ukusika i-QFN, i-SMD microphone substrate cutting, i-FR4 substrate cutting (LED).

Isigaba:

Incazelo

Amapharamitha Wokucaciswa Komkhiqizo

Imodeli Yomkhiqizo Uhlobo lomkhiqizo Ubukhulu Peel Force Ngaphambi kwe-UV I-Peel Force Ngemva kwe-UV
I-DM-208A Ukunciphisa i-PO+UV tack 170μm 800gf/25mm 15gf/25mm
DM-208B Ukunciphisa i-PO+UV tack 170μm 1200gf/25mm 20gf/25mm
DM-208C Ukunciphisa i-PO+UV tack 170μm 1500gf/25mm 30gf/25mm