I-Chip Underfill / Packaging
Ukusetshenziswa Kwenqubo Yokukhiqiza I-Chip Yemikhiqizo Enamathelayo Ye-DeepMaterial
I-Semiconductor Packaging
Ubuchwepheshe be-semiconductor, ikakhulukazi ukupakishwa kwamadivayisi we-semiconductor, akukaze kuthinte izinhlelo zokusebenza eziningi kunanamuhla. Njengoba yonke ingxenye yempilo yansuku zonke iya ngokuya idijithali—kusuka ezimotweni kuya ekuvikelekeni kwasekhaya kuye kuma-smartphones kanye nengqalasizinda ye-5G—izinto ezintsha eziqanjiwe zokupakisha ze-semiconductor zisenhliziyweni yamakhono e-elekthronikhi asabelayo, athembekile, nanamandla.
Ama-wafer azacile, izilinganiso ezincane, ama-pitches angcono, ukuhlanganiswa kwephakheji, idizayini ye-3D, ubuchwepheshe bezinga le-wafer kanye nomnotho wesilinganiso ekukhiqizeni ngobuningi kudinga izinto ezingasekela izifiso zokusungula. Indlela yezixazululo zikaHenkel isebenzisa izinsiza ezibanzi zomhlaba wonke ukuze ilethe ubuchwepheshe bezinto ezibonakalayo zokupakisha ze-semiconductor kanye nokusebenza okuncintisanayo. Kusukela kokunamathisela okunamathiselwe kwe-die kumaphakheji webhondi yezintambo zendabuko kuya kokugcwaliswa phansi okuthuthukisiwe nama-encapsulants wezinhlelo zokusebenza zokupakisha ezithuthukile, i-Henkel inikeza ubuchwepheshe bezinto ezisetshenziswayo ezisezingeni eliphezulu nokusekelwa komhlaba wonke okudingekayo izinkampani ezihamba phambili zama-microelectronics.
Flip Chip Underfill
I-underfill isetshenziselwa ukuzinza kwemishini ye-flip chip. Lokhu kubaluleke kakhulu uma uhlanganisa ama-chips egridi yebhola (BGA). Ukunciphisa i-coefficient of thermal expansion (CTE), i-adhesive igcwele ingxenye yama-nanofillers.
Izinamathiselo ezisetshenziswa njengama-chip underfill zinezakhiwo zokugeleza kwe-capillary ukuze zisetshenziswe ngokushesha futhi kulula. I-adhesive ye-double-therapy ivame ukusetshenziswa: izindawo ezisemaphethelweni zigcinwe endaweni yokwelashwa kwe-UV ngaphambi kokuba izindawo ezinomthunzi zelashwe ngokushisa.
I-Deepmaterial iyikhambi lokushisa eliphansi lokushisa i-bga flip chip underfill pcb epoxy process adhesive glue material manufacturer kanye nabaphakeli bezinto zokumboza ezikwazi ukumelana nokushisa, banikeze ingxenye eyodwa ye-epoxy underfill compounds, i-epoxy underfill encapsulant, i-underfill encapsulation materials for flip chip in pcpoxy electronic circuit board. okusekelwe kwe-chip underfill kanye ne-cob encapsulation materials nokunye.
