I-Inductor Bonding
Eminyakeni yakamuva, isidingo sokunciphisa usayizi wemikhiqizo ehlanganisiwe siholele ekwehleni okukhulu kosayizi wezingxenye zemikhiqizo ye-inductor, okuletha isidingo sobuchwepheshe obusezingeni eliphezulu bokukhweza lezi zingxenye ezincane kumabhodi wesekethe.
Onjiniyela benze ama-solder pastes, izinto zokunamathisela, nezinqubo zokuhlanganisa ezivumela ukunamathisela amatheminali e-inductor kuma-PCB ngaphandle kokusebenzisa izimbobo. Izindawo eziyisicaba (ezaziwa ngokuthi ama-pads) kumatheminali e-inductor zidayiswa ngqo ezindaweni zokujikeleza zethusi yingakho igama elithi surface mount inductor (noma i-transformer). Le nqubo iqeda isidingo sokumba izimbobo zezikhonkwane, ngaleyo ndlela kunciphisa izindleko zokukhiqiza i-PCB.
I-Adhesive bonding (gluing) iyindlela evame kakhulu yokunamathisela ama-concentrator kukhoyili yokungeniswa. Umsebenzisi kufanele aqonde ngokucacile izinhloso zokuhlanganisa: noma ngabe ukugcina isilawuli kukhoyili kuphela noma ukunikeza ukupholisa kwayo okujulile ngokudlulisela ukushisa kumakhoyili apholile amanzi.
Ukuxhumana ngomshini kuyindlela enembe kakhulu nethembekile yokunamathisela izilawuli kumakhoyili okungenisa. Iyakwazi ukumelana nokunyakaza okushisayo nokudlidliza kwezingxenye zekhoyili phakathi nenkonzo.
Kunezimo eziningi lapho izilawuli zingaxhunywanga ekujikeni kwekhoyili, kodwa ezingxenyeni zesakhiwo sokufakwa kokungeniswa okungeniswayo njengezindonga zegumbi, amafreyimu ezihlangu kazibuthe, njll.
Indlela yokufaka i-inductor ye-radial?
Ama-toroids angaxhunywa entabeni ngezinamatheliso noma izindlela zemishini. Izikhwebu ze-toroid ezimise okwenkomishi zingagcwaliswa ngembiza noma inhlanganisela ye-encapsulation ukuze kunamathele kokubili futhi kuvikeleke i-toroid yesilonda. Ukukhweza okuvundlile kunikeza iphrofayili ephansi kanye nendawo ephansi ye-gravity ezinhlelweni ezizothola ukushaqeka nokudlidliza. Njengoba ububanzi be-toroid buba bukhudlwana, ukukhwezwa okuvundlile kuqala ukusebenzisa indawo ethengiswayo yebhodi lesifunda elibalulekile. Uma kunendawo endaweni ebiyelwe, ukukhwezwa okuqondile kusetshenziselwa ukonga isikhala sebhodi.
Imikhondo ephuma ku-toroidal winding inamathiselwe kumatheminali entaba, ngokuvamile ngokusoda. Uma intambo yokusonta inkulu futhi iqinile ngokwanele, intambo "ingakwazi ukuzihola" futhi ibekwe kunhlokweni noma ikhwezwe ebhodini lesekethe eliphrintiwe. Inzuzo yokuzikhweza okuziholayo ukuthi izindleko nokuba sengozini koxhumano lwe-solder olwengeziwe olumaphakathi kuyagwenywa. Ama-toroids angaxhunywa entabeni nge-adhesives, izindlela zemishini noma nge-encapsulation. Izikhwebu ze-toroid ezimise okwenkomishi zingagcwaliswa ngembiza noma inhlanganisela ye-encapsulation ukuze kunamathele kokubili futhi kuvikeleke i-toroid yesilonda. Ukukhweza okuqondile kusindisa izindlu ezithengiswayo zebhodi lesifunda lapho ububanzi be-toroid buba bukhulu, kodwa kudala inkinga yobude bengxenye. Ukukhweza okuqondile futhi kuphakamisa isikhungo sengxenye yamandla adonsela phansi kuyenze ibe sengozini yokushaqeka nokudlidliza.
I-Adhesive Bonding
I-Adhesive bonding (gluing) iyindlela evame kakhulu yokunamathisela ama-concentrator kukhoyili yokungeniswa. Umsebenzisi kufanele aqonde ngokucacile izinhloso zokuhlanganisa: noma ngabe ukugcina isilawuli kukhoyili kuphela noma ukunikeza ukupholisa kwayo okujulile ngokudlulisela ukushisa kumakhoyili apholile amanzi.
Ikesi lesibili libaluleke kakhulu kumakhoyili alayishwe kakhulu kanye nomjikelezo omude wokushisisa njengasekuskeneni izinhlelo zokusebenza. Leli cala lidinga kakhulu futhi lizochazwa ngokuqhubekayo. Izinamatheliso ezihlukene zingase zisetshenziselwe ukunamathisela ngezinhlayiya ze-epoxy okuyizinamathiselo ezisetshenziswa kakhulu.
I-DeepMaterial adhesive kumele ibe nezici ezilandelayo:
· Amandla okunamathela aphezulu
· Good conductivity ezishisayo
· Ukumelana nezinga lokushisa eliphezulu uma indawo ehlangene kulindeleke ukuthi ishise. Khumbula ukuthi lapho kusetshenziswe amandla aphezulu ezinye izindawo zethusi zingafinyelela ku-200 C noma ngisho nangaphezulu naphezu kokupholisa okukhulu kwamanzi ekhoyili.
