Isidingo se-adhesive glue for potting electronics
Isidingo se-glue yokunamathisela ye-potting electronics Ukubumba kuhilela ukugcwaliswa okwenziwa kusetshenziswa i-adhesive noma i-potting compound. Uma lokhu sekwenziwe, izingxenye ngokuvamile ziba sekhefu noma ezindlini okufanele zigcwaliswe nge-adhesive. Abakhiqizi beglue be-epoxy abangcono kakhulu be-structural epoxy adhesive e-china Kungani kudingeka Amabhodi wesiyingi ane...