Ikhaya > I-Epoxy Adhesives Glue
abakhiqizi abahamba phambili be-adhesive motor motor

Ingcina yeglue enamathelayo ye-epoxy engcono kakhulu yensimbi iye kumabhondi aqinile ensimbi

Ingcina yeglue enamathelayo ye-epoxy engcono kakhulu yensimbi iye kumabhondi aqinile Insimbi ingenye yezinto ezivame kakhulu ezisizungezile. Namuhla, isetshenziselwa ukwenza izinto zikagesi, imishini emikhulu, nezinto zokuhlobisa, phakathi kwezinye izinto. Ukuthola ingcina ye-epoxy engcono kakhulu yensimbi kubalulekile ukufeza isibopho esifanele. I-Epoxy...

Abakhiqizi beglue base-china abaphezulu kakhulu be-elekthronikhi

Uhlolojikelele Lwenqubo Yokugcwalisa Ngaphansi kwe-BGA Nokungaqhubi Nge-Fill

Uhlolojikelele Lwenqubo Yokungagcwalisi Ngaphansi Kwe-BGA Nokupakishwa Kwe-chip ye-Non Conductive Via Fill Flip kuveza ama-chips ekucindezelekeni komshini ngenxa yokungafani okubanzi kokwanda okushisayo okulinganayo phakathi kwama-silicon chips ne-substrate. Uma kunomthwalo oshisayo ophezulu, ukungafani kugcizelela ama-chips, ngaleyo ndlela kwenza ukwethembeka kube ukukhathazeka....

umkhiqizi omuhle kakhulu wokunamathisela we-electronics

Ungayisebenzisa kanjani i-smt underfill epoxy adhesive ezinhlelweni ezahlukahlukene

Isetshenziswa kanjani i-smt underfill epoxy adhesive ezinhlelweni ezahlukahlukene I-Underfill uhlobo oluwuketshezi lwe-polymer olusetshenziswa kuma-PCB ngemuva kokudlula inqubo yokugeleza kabusha. Ngemuva kokuthi i-underfill ibekwe, bese ivunyelwa ukuphulukisa, ihlanganise uhlangothi olungezansi lwe-chip emboza amaphedi axhumene abuthaka phakathi...

Okuhamba phambili kwe-photovoltaic solar panel bonding adhesive and sealants abakhiqizi

I-Flip Chip Packaging Underfill Bonding Adhesive Die Namathisela Nezinzuzo zayo

I-Flip Chip Packaging Underfill Bonding Adhesive Die Namathisela Kanye Nobuhle Bayo I-Flip chip iyindlela esetshenziselwa ukunamathisela ukufa. Kule ndlela yokunamathisela, ukuxhumana kukagesi phakathi kwe-substrate ne-chip kwenziwa ngokuqondile ngokuguqulwa kwefasi ubuso bubheke phansi kuphakheji. Amaqhuqhuva e-conductive...

Abakhiqizi beglue abahamba phambili abasuselwe emanzini

Ukusebenzisa i-PCB smt i-underfill epoxy kanye ne-bga underfill material yezinhlelo zokusebenza ezahlukene

Ukusebenzisa i-PCB smt i-underfill epoxy kanye ne-bga underfill material yezinhlelo zokusebenza ezahlukene Izinhlelo zokusebenza ezingagcwalisi kakhulu zisebenzisa izinhlanganisela ezinamathelayo ezihlukene ukuze kugcwaliswe izikhala ezikhona phakathi kwama-PCB namaphakheji e-microchip. Lokhu kubaluleke kakhulu ngoba amaphakheji e-chip ahlukene, njengamaphakheji esikali se-chip kanye nezinhlaka zegridi yebhola, kufanele...

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