I-Epoxy Underfill

I-DeepMaterial, njengomkhiqizi wokunamathisela we-epoxy wezimboni, silahlekelwe ucwaningo mayelana ne-underfill epoxy, ingcina ye-non conductive ye-electronics, i-non conductive epoxy, izinamathiselo zokuhlanganiswa kwe-electronic, okunamathelayo okungagcwali, i-epoxy ephezulu ye-refractive index. Ngokusekelwe kulokho, sinobuchwepheshe bakamuva bokunamathela kwe-epoxy yezimboni.

I-DeepMaterial ithuthukise izinto ezinamathelayo zezimboni zokupakisha nokuhlola ama-chip, izinto zokunamathisela ezingeni lebhodi lesifunda, nezinamatheliso zemikhiqizo kagesi. Ngokusekelwe ezintweni ezinamathelayo, ithuthukise amafilimu okuvikela, izigcwalisi ze-semiconductor, nezinto zokupakisha zokucubungula i-wafer ye-semiconductor kanye nokupakishwa nokuhlolwa kwe-chip.

Ukuhlinzeka ngezinto zokunamathisela zikagesi kanye nefilimu encane ye-elekthronikhi imikhiqizo kanye nezixazululo zezinkampani zokugcina ukuxhumana, izinkampani zikagesi zabathengi, izinkampani ezipakishwayo ze-semiconductor kanye nokuhlola, nabakhiqizi bemishini yezokuxhumana, ukuxazulula amakhasimende ashiwo ngenhla ekuvikelweni kwenqubo, ukubopha komkhiqizo ngokunemba okuphezulu. , nokusebenza kukagesi.

I-DeepMaterial inikezela ngezinhlobo ezahlukahlukene zemikhiqizo emayelana nokunamathela kwezimboni zikagesi, uchungechunge lwe-UV oluphilisayo lwe-UV, uhlobo olusebenzayo lwe-adhesive enamathelayo encibilikayo eshisayo kanye ne-adhesiveseries ezwelayo encibilikayo encibilikayo, i-epoxy-based chip underfill kanye nochungechunge lwempahla ye-COB encapsulation, ibhodwe lokuvikela ibhodi lesifunda kanye ne-conformal coating adhesive. uchungechunge, i-epoxy based conductive silver adhesive series, i-structural bonding adhesive series, uchungechunge lwefilimu oluvikelayo olusebenzayo, uchungechunge lwefilimu yokuvikela i-semiconductor.

I-DeepMaterial ingcono kakhulu ingxenye eyodwa ye-epoxy underfill encapsulants abahlinzeki benkampani e-china, ukuhlinzeka ngokwengxenye underfill epoxy for flip chip amadivayisi ibhola grid arrays chip scale ukupakisha csp bga wLCsp Lga, lokushisa eliphansi lokushisa bga flip chip underfill pcb epoxy inqubo adhesive gluenon conduction epoxy glue, ingcina ye-adhesive sealant glue yezingxenye ze-elektroniki ze-pcb ezingagcwali, izinamatheliso ze-semiconductor zomhlangano we-elekthronikhi. njalo njalo