Izinamathiselo Zezinga Le-Chip

I-DeepMaterial, njengomkhiqizi wokunamathisela we-epoxy wezimboni, silahlekelwe ucwaningo mayelana ne-underfill epoxy, ingcina ye-non conductive ye-electronics, i-non conductive epoxy, izinamathiselo zokuhlanganiswa kwe-electronic, okunamathelayo okungagcwali, i-epoxy ephezulu ye-refractive index. Ngokusekelwe kulokho, sinobuchwepheshe bakamuva bokunamathela kwe-epoxy yezimboni.

I-DeepMaterial ithuthukise izinto ezinamathelayo zezimboni zokupakisha nokuhlola ama-chip, izinto zokunamathisela ezingeni lebhodi lesifunda, nezinamatheliso zemikhiqizo kagesi. Ngokusekelwe ezintweni ezinamathelayo, ithuthukise amafilimu okuvikela, izigcwalisi ze-semiconductor, nezinto zokupakisha zokucubungula i-wafer ye-semiconductor kanye nokupakishwa nokuhlolwa kwe-chip.

Ukuhlinzeka ngezinto zokunamathisela zikagesi kanye nefilimu encane ye-elekthronikhi imikhiqizo kanye nezixazululo zezinkampani zokugcina ukuxhumana, izinkampani zikagesi zabathengi, izinkampani ezipakishwayo ze-semiconductor kanye nokuhlola, nabakhiqizi bemishini yezokuxhumana, ukuxazulula amakhasimende ashiwo ngenhla ekuvikelweni kwenqubo, ukubopha komkhiqizo ngokunemba okuphezulu. , nokusebenza kukagesi.

I-DeepMaterial inikezela ngezinhlobo ezahlukahlukene zemikhiqizo emayelana nokunamathela kwezimboni zikagesi, uchungechunge lwe-UV oluphilisayo lwe-UV, uhlobo olusebenzayo lwe-adhesive enamathelayo encibilikayo eshisayo kanye ne-adhesiveseries ezwelayo encibilikayo encibilikayo, i-epoxy-based chip underfill kanye nochungechunge lwempahla ye-COB encapsulation, ibhodwe lokuvikela ibhodi lesifunda kanye ne-conformal coating adhesive. uchungechunge, i-epoxy based conductive silver adhesive series, i-structural bonding adhesive series, uchungechunge lwefilimu oluvikelayo olusebenzayo, uchungechunge lwefilimu yokuvikela i-semiconductor.

I-Deepmaterial iyiglue enamathelayo engangeni manzi engaphezulu kwepulasitiki kumkhiqizi wensimbi kanye nengilazi, hlinzeka ngeglue enamathelayo engaphenduki e-epoxy enamathelayo yezingxenye ze-elekthronikhi ezingagcwali, izinamatheliso ze-semiconductor zomhlangano we-elekthronikhi, izinga lokushisa eliphansi lokwelapha i-bga flip chip underfill pcb epoxy process adhesive glue material nokunye. ku.