Iphakheji ye-BGA i-Underfill Epoxy
High Fluidity
Ukuhlanzeka Okuphezulu
Izinselele
Imikhiqizo ye-elekthronikhi ye-aerospace nokuzulazula, izimoto, izimoto, ukukhanya kwe-LED yangaphandle, amandla elanga namabhizinisi ezempi anezidingo ezinokwethenjelwa okuphezulu, amadivaysi e-solder ball array (BGA/CSP/WLP/POP) kanye namadivayisi akhethekile kumabhodi wesekethe konke kubhekene nama-microelectronics. Ukuthambekela kwe-miniaturization, nama-PCB azacile anogqinsi olungaphansi kuka-1.0mm noma ama-substrates ahlanganayo anokuminyana okuphezulu, amalunga e-solder phakathi kwamadivayisi nama-substrates aba ntekenteke ngaphansi kwengcindezi yemishini neyokushisa.
Solutions
Emaphaketheni e-BGA, i-DeepMaterial inikeza isisombululo senqubo yokungagcwalisi kahle - ukugeleza kwe-capillary okusha. I-filler isatshalaliswa futhi isetshenziswe emaphethelweni edivayisi ehlanganisiwe, futhi "umphumela we-capillary" we-liquid usetshenziselwa ukwenza i-glue ingene futhi igcwalise phansi kwe-chip, bese iyashiswa ukuze ihlanganise isigcwalisi ne-chip substrate, amalunga e-solder ne-PCB substrate.
Izinzuzo zenqubo yokugcwaliswa phansi kwe-DeepMaterial
1. I-fluidity ephezulu, ukuhlanzeka okuphezulu, ingxenye eyodwa, ukugcwalisa ngokushesha kanye nekhono lokuphulukisa ngokushesha lezingxenye zephimbo elihle kakhulu;
2. Ingenza isendlalelo sokugcwalisa esingezansi esifana nesingenalutho, esingasusa ukucindezeleka okubangelwa impahla yokushisela, sithuthukise ukwethembeka kanye nezakhiwo zemishini yezingxenye, futhi inikeze ukuvikeleka okuhle kwemikhiqizo ekuweni, ukusonteka, ukudlidliza, umswakama. , njll.
3. Uhlelo lungalungiswa, futhi ibhodi lesifunda lingasetshenziswa kabusha, okusindisa kakhulu izindleko.
I-Deepmaterial iyikhambi lokushisa eliphansi lokushisa i-bga flip chip underfill pcb epoxy process adhesive glue material manufacturer kanye nabaphakeli bezinto zokumboza ezikwazi ukumelana nokushisa, banikeze ingxenye eyodwa ye-epoxy underfill compounds, i-epoxy underfill encapsulant, i-underfill encapsulation materials for flip chip in pcpoxy electronic circuit board. okusekelwe kwe-chip underfill kanye ne-cob encapsulation materials nokunye.
