Icala E-USA: Isixazululo Sokugcwalisa I-Chip Sozakwethu WaseMelika
Njengezwe lobuchwepheshe obuphezulu, kunezinkampani eziningi ze-BGA, CSP noma i-Flip Chip e-USA, ngakho-ke izinto zokunamathisela ezingagcwalisi kahle zidingeka kakhulu.
Elinye lamakhasimende ethu elivela ezinkampanini zobuchwepheshe obuphezulu zase-USA, lisebenzisa isixazululo sokugcwalisa i-DeepMaterial ukuze lingagcwali phansi i-chip, futhi isebenza kahle kakhulu.
I-DeepMaterial inikezela ngezinto ezisebenza kahle kakhulu ze-Sintering and Die Attach, i-Surface Mount, nezinhlelo zokusebenza ze-Wave Soldering. Ububanzi bemikhiqizo buhlanganisa iSilver Sinter Technologies, Solder Paste, Solder Preforms, Underfills kanye ne-Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, kanye namaStencil.
Uchungechunge lwe-DeepMaterial Chip Underfill Adhesive luyingxenye eyodwa, izinto ezilapheka ngokushisa. Izinto ezisetshenziswayo zenzelwe ukugcwala kwe-capillary underfill nokusebenza kabusha. Lezi zinto ezisekelwe ku-epoxy zingasatshalaliswa emaphethelweni edivayisi ye-BGA, CSP noma ye-Flip Chip. Lokhu okubalulekile kuzogeleza ngokulandelayo ukugcwalisa isikhala ngaphansi kwalezi zingxenye.
Njengoba iqukethe ingxenye eyodwa ye-capillary underfill eyenzelwe ukuvikela amaphakheji e-chip ahlanganisiwe kumabhodi esekethe aphrintiwe.
Izinga lokushisa lengilazi eliphezulu [Tg] kanye nokunwetshwa okushisayo kwe-coefficient ephansi [CTE]. Lezi zici ziphumela kusixazululo esinokwethenjelwa okuphezulu.
Izici Product
· Inikeza ukumbozwa okugcwele kwengxenye lapho ikhishwa ku-substrate eshisiwe kuqala ku-70 - 100°C
· Amanani aphezulu we-Tg kanye ne-Low CTE athuthukisa kakhulu amandla okuphasa isimo sokuhlolwa kwe-Thermal Cycling esiqinile
· Ukusebenza Okuhle Kakhulu Kwe-Thermal Cycling
I-Halogen-free futhi ithobelana ne-RoHS Directive 2015/863/EU
I-Underfill For Exceptional Thermal Fatigue Resistance
Ima wodwa amajoyinti e-SAC e-BGA kanye ne-CSP ajwayele ukuntengantenga ezinhlelweni zezimoto ezinokhahlo. I-Tg ephezulu nephansi ye-CTE engaphansi [UF] iyisixazululo sokuqinisa. Njengoba ukusebenza kabusha kungeyona imfuneko, lokhu kuvumela okuqukethwe kokugcwalisa okuphezulu ekwakhiweni ukuze kuthuthukiswe lezi zimfanelo.
Uchungechunge lwe-DeepMaterial Chip Underfill Adhesive lune-Tg ephezulu engu-165°C ne-CTE1/CTE2 ephansi engu-31 ppm/105 ppm, lapho ihlangene futhi ihlolwe ukuthi iphumelele imijikelezo engu-5000 -40 +125°C ukuhlolwa kokuhamba ngebhayisikili okushisayo. Ukuze uthole izinga lokugeleza elingcono, shisa kuqala ama-substrates ngesikhathi sokukhipha.
Sifuna futhi ukubambisana kwemikhiqizo enamathelayo yezimboni ye-DeepMaterial ozakwethu bomhlaba, uma ufuna ukuba yi-ejenti ye-DeepMaterial's:
Umphakeli weglue wezimboni eMelika,
Umhlinzeki weglue we-Industrial adhesive eYurophu,
Umhlinzeki weglue we-Industrial adhesive e-UK,
Umhlinzeki weglue we-Industrial adhesive eNdiya,
Umhlinzeki weglue we-Industrial adhesive e-Australia,
Umphakeli weglue wezimboni e-Canada,
Umhlinzeki weglue onamathela ezimbonini eNingizimu Afrika,
Umphakeli weglue wezimboni e-Japan,
Umhlinzeki weglue we-Industrial adhesive eYurophu,
Umhlinzeki weglue we-Industrial adhesive eKorea,
Umhlinzeki weglue we-Industrial adhesive eMalaysia,
Umphakeli weglue wezimboni e-Philippines,
Umphakeli weglue wezimboni eVietnam,
Umphakeli weglue wezimboni e-Indonesia,
Umhlinzeki weglue we-Industrial adhesive eRussia,
Umhlinzeki weglue we-Industrial adhesive eTurkey,
... ....
Xhumana nathi manje!
