umhlinzeki weglue wemikhiqizo ye-elekthronikhi.
I-Epoxy Based Conductive Silver Adhesive
I-DeepMaterial Conductive silver adhesive iyingxenye eyodwa elungisiwe ye-epoxy/silicone adhesive ethuthukiswe ukuze kuhlanganiswe isekethe yephakeji kanye nemithombo yokukhanya emisha ye-LED, izimboni ze-flexible circuit board (FPC). Ngemuva kokwelashwa, umkhiqizo uba ne-conductivity ephezulu kagesi, ukuqhutshwa kokushisa, ukumelana nokushisa okuphezulu nokunye ukusebenza okuthembekile okuphezulu. Umkhiqizo ulungele ukusabalalisa ngesivinini esikhulu, ukusabalalisa ukuvikelwa kohlobo oluhle, akukho deformation, akukho ukuwa, akukho ukusabalalisa; Impahla ephulukisiwe imelana nomswakama, ukushisa nokushisa okuphezulu. Ingasetshenziselwa ukupakishwa kwekristalu, ukupakishwa kwe-chip, i-LED eqinile ye-crystal bonding, izinga lokushisa eliphansi lokushisela, ukuvikela i-FPC nezinye izinjongo.
I-Conductive Silver Adhesive Product Selection
| Umkhiqizo womkhiqizo | Igama Product | Isicelo Esijwayelekile Somkhiqizo |
| I-Conductive Silver Adhesive | EA-7110 | Isetshenziswa kakhulu ku-IC chip bonding. Isikhathi sokunamathela sifushane kakhulu, futhi ngeke kube nezinkinga zokudweba umsila noma ngocingo. Umsebenzi wokuhlanganisa ungaqedwa ngesilinganiso esincane kunazo zonke sokunamathisela, okusindisa kakhulu izindleko zokukhiqiza kanye nemfucuza. Ilungele ukukhishwa kwe-adhesive okuzenzakalelayo, inesivinini esihle sokuphuma kwe-adhesive, futhi ithuthukisa umjikelezo wokukhiqiza. |
| EA-7130 | Isetshenziswa kakhulu ekuxhumaneni kwe-chip ye-LED. Ukusebenzisa umthamo omncane wokunamathisela kanye nesikhathi esincane sokuhlala sokunamathela amakristalu ngeke kubangele izinkinga zokudweba umsila noma ngocingo, konga kakhulu izindleko zokukhiqiza kanye nokumosha. Ilungele ukusabalalisa okunamathelayo okuzenzakalelayo, ngesivinini esihle kakhulu sokuphuma kwe-adhesive, futhi ithuthukisa isikhathi somjikelezo wokukhiqiza. Uma isetshenziswa embonini yokupakisha ye-LED, izinga lokukhanya elifile liphansi, izinga lokukhiqiza liphezulu, ukubola kokukhanya kuhle, futhi izinga lokukhipha i-degumming liphansi kakhulu. | |
| EA-7180 | Isetshenziswa kakhulu ku-IC chip bonding. Idizayinelwe izinhlelo zokusebenza ezizwela ukushisa ezidinga ukwelapha izinga lokushisa eliphansi. Isikhathi sokunamathela sifushane kakhulu, futhi ngeke kube nezinkinga zokudweba umsila noma ngocingo. Umsebenzi wokuhlanganisa ungaqedwa ngesilinganiso esincane kunazo zonke sokunamathisela, okusindisa kakhulu izindleko zokukhiqiza kanye nemfucuza. Ilungele ukukhishwa kwe-adhesive okuzenzakalelayo, inesivinini esihle sokuphuma kwe-adhesive, futhi ithuthukisa umjikelezo wokukhiqiza. |
Ishidi Ledatha Yomkhiqizo Onamathelisa Wesiliva Okuqhubayo
| Umkhiqizo womkhiqizo | Series Series | Igama Product | Colour | I-Viscosity evamile (cps) | Isikhathi sokuphumula | Indlela yokwelapha | Ukungazweli Ivolumu(Ω.cm) | TG/°C | Isitolo /°C/M |
| I-epoxy esekelwe | I-Conductive Silver Adhesive | EA-7110 | Silver | 10000 | @175°C 60min | Ukwelapha ukushisa | 〈2.0×10-4 | 115 | -40/6M |
| EA-7130 | Silver | 12000 | @175°C 60min | Ukwelapha ukushisa | 〈5.0×10-5 | 120 | -40/6M | ||
| EA-7180 | Silver | 8000 | @80°C 60min | Ukwelapha ukushisa | 〈8.0×10-5 | 110 | -40/6M |
