umhlinzeki weglue wemikhiqizo ye-elekthronikhi.
I-Epoxy-Based Chip Underfill kanye nezinto ze-COB Encapsulation
I-DeepMaterial inikezela ngokugcwalisa okungaphansi kokugeleza kwe-capillary ku-flip chip, i-CSP namadivayisi e-BGA. I-DeepMaterial's new capillary flow underfills yi-fluidity ephezulu, ukuhlanzeka okuphezulu, izinto zokubumba zengxenye eyodwa ezakha umfaniswano, izendlalelo ezingenalutho ezingenalutho ezithuthukisa ukuthembeka kanye nezakhiwo zemishini zezingxenye ngokuqeda ukucindezeleka okubangelwa izinto ezithengiswayo. I-DeepMaterial inikeza ukwakheka kokugcwalisa ngokushesha izingxenye zezwi ezinhle kakhulu, amandla okwelapha ngokushesha, ukusebenza isikhathi eside nempilo yokuphila, kanye nokusebenza kabusha. Ukusebenza kabusha konga izindleko ngokuvumela ukususwa kokugcwalisa ukuze kusetshenziswe kabusha ibhodi.
Ukuhlanganiswa kwe-Flip chip kudinga ukukhululeka kwengcindezi komthungo wokushisela futhi ngokuguga okushisayo nempilo yomjikelezo. Ukuhlanganiswa kwe-CSP noma i-BGA kudinga ukusetshenziswa kokungagcwalisi kahle ukuze kuthuthukiswe ubuqotho bemishini yomhlangano ngesikhathi sokuhlola i-flex, vibration noma drop.
I-DeepMaterial's flip-chip underfill inokuqukethwe okuphezulu kwesigcwalisi ngenkathi igcina ukugeleza okusheshayo kuma-pitches amancane, enekhono lokuba nezinga lokushisa eliphezulu lokushintsha kwengilazi kanye ne-modulus ephezulu. Okungagcwalisi phansi kwe-CSP yethu kuyatholakala kumazinga ahlukahlukene wokugcwalisa, akhethelwe izinga lokushisa lengilazi lokushintsha kanye nemodulus yohlelo oluhlosiwe.
I-COB encapsulant ingasetshenziselwa ukubopha ngocingo ukuze kuhlinzekwe ukuvikelwa kwemvelo nokwandisa amandla emishini. Ukuvalwa kokuvikela kwama-chips ahlanganiswe ngocingo kufaka phakathi ukuhlanganisa okuphezulu, i-cofferdam, nokugcwaliswa kwegebe. Ama-adhesives anomsebenzi wokugeleza wokulungisa kahle ayadingeka, ngoba ikhono lawo lokugeleza kufanele liqinisekise ukuthi izintambo zihlanganisiwe, futhi okunamathelayo ngeke kugeleze ku-chip, futhi kuqinisekise ukuthi kungasetshenziswa emithonjeni emihle kakhulu ye-pitch.
I-DeepMaterial's COB encapsulating adhesives ingaba i-thermal or UV yelashwe i-DeepMaterial's COB encapsulation adhesive ingelapheka ukushisa noma yelashwe nge-UV ngokwethembeka okuphezulu kanye ne-thermal coefficient yokuvuvukala okuphansi, kanye nezinga lokushisa eliphezulu lokuguqulwa kwengilazi nokuqukethwe kwe-ion ephansi. I-DeepMaterial's COB encapsulating adhesives ivikela umkhondo kanye neplumbum, ama-chrome nama-silicon wafers avela endaweni yangaphandle, ukulimala komshini kanye nokugqwala.
I-DeepMaterial COB encapsulating adhesives yenziwe nge-heat-curing epoxy, i-UV-curing acrylic, noma i-silicone chemistries ukuze kufakwe kahle ugesi. I-DeepMaterial COB encapsulating adhesives inikeza ukuzinza okuhle kwezinga lokushisa eliphezulu kanye nokumelana nokushaqeka okushisayo, izakhiwo zokuvikela ugesi ngaphezu kwebanga lokushisa elibanzi, kanye nokuncipha okuphansi, ukucindezeleka okuphansi, nokumelana namakhemikhali lapho welashwa.
I-Deepmaterial iyi-glue enamathelayo engangeni manzi engaphezulu kwepulasitiki kumkhiqizi wensimbi nengilazi, hlinzeka ngeglue enamathelayo engaphenduki ye-epoxy enamathelayo yezingxenye ze-elekthronikhi ezingagcwali, izinamatheliso ze-semiconductor zomhlangano we-elekthronikhi, izinga lokushisa eliphansi lokwelapha i-bga flip chip underfill pcb epoxy process adhesive glue material nokunye. ku
I-DeepMaterial Epoxy Resin Base Chip Phansi Ukugcwaliswa kanye Nethebula Lokukhetha Lokukhetha Lokupakisha I-Cob
Izinga Lokushisa Eliphansi Lokwelapha I-Epoxy Adhesive Product Selection
| Series Series | Igama Product | Uhlelo lokusebenza olujwayelekile lomkhiqizo |
| I-adhesive yokwelapha izinga lokushisa eliphansi | EA-6108 |
Izinga lokushisa eliphansi lokunamathisela okunamathelayo, izinhlelo zokusebenza ezijwayelekile zifaka imemori khadi, umhlangano weCCD noma we-CMOS. Lo mkhiqizo ulungele ukuphulukiswa kwezinga lokushisa eliphansi futhi ungaba nokunamathela okuhle ezintweni ezihlukahlukene ngesikhathi esifushane. Izinhlelo zokusebenza ezijwayelekile zihlanganisa amamemori khadi, izingxenye ze-CCD/CMOS. Ifaneleka ikakhulukazi izikhathi lapho into ezwela ukushisa idinga ukwelashwa ngezinga lokushisa eliphansi. |
| EA-6109 |
Iyingxenye eyodwa ye-thermal ephulukisa i-epoxy resin. Lo mkhiqizo ufanelekile ukuphulukiswa kwezinga lokushisa eliphansi futhi unokunamathela okuhle ezintweni ezihlukahlukene ngesikhathi esifushane kakhulu. Izinhlelo zokusebenza ezijwayelekile zifaka imemori khadi, ukuhlanganiswa kwe-CCD/CMOS. Ifaneleka ngokukhethekile izinhlelo zokusebenza lapho izinga lokushisa eliphansi lokuphulukisa lidingeka ezingxenyeni ezizwela ukushisa. |
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| EA-6120 |
Okunamathelisa okuphilisa okunokushisa okuphansi kwe-Classic, okusetshenziselwa umhlangano wemojula ye-LCD backlight. |
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| EA-6180 |
Ukwelapha okusheshayo ekushiseni okuphansi, okusetshenziselwa ukuhlanganiswa kwezingxenye zeCCD noma ze-CMOS nama-VCM motors. Lo mkhiqizo uklanyelwe ngokukhethekile izinhlelo zokusebenza ezizwela ukushisa ezidinga ukwelapha izinga lokushisa eliphansi. Ingakwazi ukunikeza amakhasimende ngokushesha izinhlelo zokusebenza ezinomphumela ophezulu, njengokunamathisela amalensi okusakaza ukukhanya kuma-LED, nokuhlanganisa imishini yokuzwa izithombe (okuhlanganisa namamojula ekhamera). Lokhu okubalulekile kumhlophe ukuze kunikeze ukubonakala okukhulu. |
Ukukhethwa Komkhiqizo we-Epoxy Encapsulation
| Umkhiqizo womkhiqizo | Series Series | Igama Product | Colour | I-viscosity evamile (cps) | Isikhathi sokuqala sokulungisa / ukulungiswa okugcwele | Indlela yokwelapha | TG/°C | Ukuqina /D | Isitolo/°C/M |
| I-epoxy esekelwe | I-Ecapsulation Adhesive | EA-6216 | Black | 58000-62000 | 150 ° C 20min | Ukwelapha ukushisa | 126 | 86 | 2-8/6M |
| EA-6261 | Black | 32500-50000 | 140°C 3H | Ukwelapha ukushisa | 125 | * | 2-8/6M | ||
| EA-6258 | Black | 50000 | 120 ° C 12min | Ukwelapha ukushisa | 140 | 90 | -40/6M | ||
| EA-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Ukwelapha ukushisa | 137 | 90 | 2-8/6M |
Gcwalisa Ngaphansi Ukukhethwa Komkhiqizo we-Epoxy
| Series Series | Igama Product | Uhlelo lokusebenza olujwayelekile lomkhiqizo |
| Ukungagcwalisi kahle | EA-6307 | Kuyinto eyodwa-component, thermosetting epoxy resin. Kuyi-CSP (FBGA) esebenziseka kabusha (i-FBGA) noma i-BGA filler esetshenziselwa ukuvikela amalunga e-solder ekucindezelekeni komshini kumishini kagesi ephathwayo. |
| EA-6303 | I-adhesive ye-epoxy resin enengxenye eyodwa iyinhlaka yokugcwalisa engasetshenziswa kabusha ku-CSP (FBGA) noma ku-BGA. Yelapheka ngokushesha lapho ishisa. Iklanyelwe ukunikeza ukuvikeleka okuhle ukuvimbela ukwehluleka ngenxa yokucindezeleka kwemishini. I-viscosity ephansi ivumela ukugcwalisa izikhala ngaphansi kwe-CSP noma i-BGA. | |
| EA-6309 | I-epoxy resin ephulukisayo esheshayo, egeleza ngokushesha eyenzelwe amaphakheji wesayizi we-chip yokugcwalisa ukugeleza kwe-capillary, ukuthuthukisa isivinini senqubo ekukhiqizeni futhi iklame ukwakheka kwayo kwe-rheological, ivumele ukuthi ingene ku-25μm imvume, inciphise ukucindezeleka okubangelwa, ithuthukise ukusebenza kwamabhayisikili okushisa, ukumelana kwamakhemikhali okuhle kakhulu. | |
| DM-6308 | Ukungagcwalisi kahle kwakudala, i-viscosity ephansi kakhulu ifanele izinhlelo zokusebenza eziningi ezingagcwalisi kakhulu. | |
| EA-6310 | I-epoxy primer esetshenziswa kabusha yakhelwe izinhlelo zokusebenza ze-CSP ne-BGA. Ingelapheka ngokushesha emazingeni okushisa aphakathi ukuze kuncishiswe ukucindezela kwezinye izingxenye. Ngemuva kokuphulukisa, izinto ezisetshenziswayo zinezakhiwo ezinhle kakhulu zemishini futhi zingavikela amalunga e-solder ngesikhathi sokuhamba ngebhayisikili ezishisayo. | |
| EA-6320 | Ukugcwaliswa phansi okusebenzisekayo kabusha kuklanyelwe ngokukhethekile izinhlelo zokusebenza ze-CSP, i-WLCSP ne-BGA. Indlela yayo yokwelapha ngokushesha emazingeni okushisa aphakathi nendawo ukuze kuncishiswe ingcindezi kwezinye izingxenye. Izinto ezisetshenziswayo zinezinga lokushisa eliphezulu lokushintsha kwengilazi kanye nokuqina kokuphuka okuphezulu, futhi kunganikeza ukuvikeleka okuhle kwamajoyinti e-solder ngesikhathi sokuhamba ngebhayisikili okushisayo. |
I-DeepMaterial Epoxy Based Chip Underfill kanye ne-COB Packaging Material Data Sheet
Izinga Lokushisa Eliphansi Lokwelapha I-Epoxy Adhesive Product Data Sheet
| Umkhiqizo womkhiqizo | Series Series | Igama Product | Colour | I-viscosity evamile (cps) | Isikhathi sokuqala sokulungisa / ukulungiswa okugcwele | Indlela yokwelapha | TG/°C | Ukuqina /D | Isitolo/°C/M |
| I-epoxy esekelwe | Izinga lokushisa eliphansi lokuphulukisa i-encapsulant | EA-6108 | Black | 7000-27000 | 80°C 20min 60°C 60min | Ukwelapha ukushisa | 45 | 88 | -20/6M |
| EA-6109 | Black | 12000-46000 | 80°C 5-10min | Ukwelapha ukushisa | 35 | 88A | -20/6M | ||
| EA-6120 | Black | 2500 | 80°C 5-10min | Ukwelapha ukushisa | 26 | 79 | -20/6M | ||
| EA-6180 | White | 8700 | 80 ° C 2min | Ukwelapha ukushisa | 54 | 80 | -40/6M |
Ishidi Ledatha Yomkhiqizo Onamathelayo we-Epoxy Ehlanganisiwe
| Umkhiqizo womkhiqizo | Series Series | Igama Product | Colour | I-viscosity evamile (cps) | Isikhathi sokuqala sokulungisa / ukulungiswa okugcwele | Indlela yokwelapha | TG/°C | Ukuqina /D | Isitolo/°C/M |
| I-epoxy esekelwe | I-Ecapsulation Adhesive | EA-6216 | Black | 58000-62000 | 150 ° C 20min | Ukwelapha ukushisa | 126 | 86 | 2-8/6M |
| EA-6261 | Black | 32500-50000 | 140°C 3H | Ukwelapha ukushisa | 125 | * | 2-8/6M | ||
| EA-6258 | Black | 50000 | 120 ° C 12min | Ukwelapha ukushisa | 140 | 90 | -40/6M | ||
| EA-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Ukwelapha ukushisa | 137 | 90 | 2-8/6M |
Gcwalisa Ngaphansi Ishidi Ledatha Yomkhiqizo We-Epoxy Adhesive
| Umkhiqizo womkhiqizo | Series Series | Igama Product | Colour | I-viscosity evamile (cps) | Isikhathi sokuqala sokulungisa / ukulungiswa okugcwele | Indlela yokwelapha | TG/°C | Ukuqina /D | Isitolo/°C/M |
| I-epoxy esekelwe | Ukungagcwalisi kahle | EA-6307 | Black | 2000-4500 | 120°C 5min 100°C 10min | Ukwelapha ukushisa | 85 | 88 | 2-8/6M |
| EA-6303 | I-Opaque creamy yellow liquid | 3000-6000 | 100°C 30min 120°C 15min 150°C 10min | Ukwelapha ukushisa | 69 | 86 | 2-8/6M | ||
| EA-6309 | Uketshezi olumnyama | 3500-7000 | 165°C 3min 150°C 5min | Ukwelapha ukushisa | 110 | 88 | 2-8/6M | ||
| EA-6308 | Uketshezi olumnyama | 360 | 130°C 8min 150°C 5min | Ukwelapha ukushisa | 113 | * | -20/6M | ||
| EA-6310 | Uketshezi olumnyama | 394 | 130 ° C 8min | Ukwelapha ukushisa | 102 | * | -20/6M | ||
| EA-6320 | Uketshezi olumnyama | 340 | 130°C 10min 150°C 5min 160°C 3min | Ukwelapha ukushisa | 134 | * | -20/6M |
