I-Glue Yokulungisa Imojuli Yekhamera ne-PCB Board
Ukusebenza Okuqinile
Ukwelapha Ngokushesha
Izidingo
1. Isetshenziswa ekuqiniseni nasekuhlanganiseni imojuli yekhamera yomkhiqizo kanye ne-PCB;
2. Khipha i-glue emagumbini ezinhlangothi ezine ukuze wenze i-weir yokuzivikela;
3. Thuthukisa amandla okuhlanganisa emojula ye-CMOS ne-PCB;
4. Hlakaza futhi unciphise ukushuba kanye nengcindezi yamaqhubu abangelwa ukudlidliza;
5. Gwema ukushisa okuphezulu kokubhaka kweglue yendabuko, ukugwema ukulimala ezingxenyeni noma kuthinte ukusebenza kwazo.
Solutions
I-DeepMaterial incoma ukuthi kusetshenziswe izinga lokushisa eliphansi lokuphulukisa i-epoxy glue, eyaziwa nangokuthi i-glue module yekhamera, ukushisa okuyingxenye eyodwa okuphulukisa i-epoxy glue, i-viscosity ephezulu, ukumelana nesimo sezulu esihle kakhulu, izakhiwo ezinhle zokuvala ugesi, impilo ende, ukumelana nomthelela onamandla.
I-deepMaterial ikhamera ye-module glue, ukuphulukiswa okusheshayo ku-80 ℃ izinga lokushisa eliphansi, lingagwema kahle ukulahlekelwa izingxenye zekhamera eluhlaza okubangelwa ukushisa okuphezulu kokubhaka, futhi isivuno sizothuthukiswa kakhulu.
I-DeepMaterial low-temperature curing vinyl inokusebenza okuqinile, ukwakhiwa okulula, futhi ifaneleka kakhulu ekusebenzeni okuqhubekayo komugqa wokukhiqiza.
