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3. Gcwalisa i-Epoxy

Umkhiqizi nomhlinzeki wezinto ezinamathelayo we-epoxy ongcono kakhulu wokugcwalisa underfill

I-Shenzhen DeepMaterial Technologies Co., Ltd iyi-flip chip bga underfill epoxy material kanye nomkhiqizi we-epoxy encapsulant e-china, ikhiqiza ama-underfill encapsulants, i-smt pcb underfill epoxy, ingxenye eyodwa ye-epoxy underfill compounds, flip chip underfill epoxy kanye ne-bga njalo.

I-Underfill yinto ye-epoxy egcwalisa izikhala phakathi kwe-chip nesiphathi sayo noma iphakheji eliqediwe kanye ne-PCB substrate. Ukungagcwalisi kahle kuvikela imikhiqizo ye-elekthronikhi ekushayweni, ekwehleni, nasekudlidlizeni futhi kunciphisa ubunzima ekuxhumekeni kwe-solder okonakala okubangelwa umehluko wokwanda okushisayo phakathi kwe-silicon chip nenkampani yenethiwekhi (izinto ezimbili ezingafani).

Kuzinhlelo zokusebenza ze-capillary underfill, ivolumu enembile yezinto ezingagcwali phansi ikhishwa eceleni kwe-chip noma iphakheji ukuze igeleze ngaphansi ngesenzo se-capillary, igcwalisa izikhala zomoya ezizungeze amabhola okuthengisa axhuma amaphakheji e-chip ku-PCB noma ama-chips astakiwe kumaphakheji ama-chip amaningi. Izinto zokungagcwalisi okungagelezi, ngezinye izikhathi ezisetshenziselwa ukugcwalisa kancane, zifakwa ku-substrate ngaphambi kokuthi i-chip noma iphasela linamathiselwe futhi ligcwaliswe kabusha. Ukungagcwalisi okubunjiwe kungenye indlela ehlanganisa ukusebenzisa i-resin ukugcwalisa izikhala phakathi kwe-chip ne-substrate.

Ngaphandle kokugcwalisa kancane, isikhathi sokuphila somkhiqizo singancipha kakhulu ngenxa yokuqhekeka koxhumano. Ukungagcwalisi kahle kusetshenziswa ezigabeni ezilandelayo zenqubo yokukhiqiza ukuze kuthuthukiswe ukwethembeka.

Umhlahlandlela ophelele we-Underfill Epoxy:

Iyini i-Epoxy Underfill?

I-Underfill uhlobo lwento ye-epoxy esetshenziselwa ukugcwalisa izikhala phakathi kwe-chip ye-semiconductor nesithwali sayo noma phakathi kwephakheji eliqediwe kanye ne-substrate yebhodi lesifunda ephrintiwe (PCB) kumishini kagesi. Ngokuvamile isetshenziswa kubuchwepheshe bokupakisha be-semiconductor obuthuthukisiwe, obufana namaphakheji we-flip-chip kanye ne-chip-scale, ukuthuthukisa ukwethembeka kokusebenza nokushisayo kwamadivayisi.

I-epoxy underfill ngokuvamile yenziwe nge-epoxy resin, i-polymer ebeka ukushisa enezici ezinhle kakhulu zomshini namakhemikhali, okuyenza ilungele ukusetshenziswa ekusetshenzisweni kwe-elekthronikhi okudingayo. I-epoxy resin ivamise ukuhlanganiswa nezinye izithasiselo, njengeziqinile, izigcwalisi, nezilungisi, ukuze kuthuthukiswe ukusebenza kwayo futhi kuhambisane nezakhiwo zayo ukuze ihlangabezane nezidingo ezithile.

I-Epoxy underfill iyisisetshenziswa esiwuketshezi noma esiwuketshezi oluncane esatshalaliswa ku-substrate ngaphambi kokuthi kufa kwe-semiconductor kubekwe phezulu. Khona-ke iyelapha noma iqiniswe, ngokuvamile ngenqubo yokushisa, ukuze yakhe ungqimba oluqinile, oluvikelayo oluhlanganisa ukufa kwe-semiconductor futhi lugcwalise igebe phakathi kokufa ne-substrate.

I-Epoxy underfill yinto enamathelayo ekhethekile esetshenziswa ekwenziweni kukagesi ukuhlanganisa nokuvikela izingxenye ezithambile, njengama-microchips, ngokugcwalisa igebe phakathi kwesici ne-substrate, ngokuvamile ibhodi lesekethe eliphrintiwe (PCB). Ivamise ukusetshenziswa kubuchwepheshe be-flip-chip, lapho i-chip ifakwa ibheke phansi ku-substrate ukuze kuthuthukiswe ukusebenza okushisayo nogesi.

Inhloso eyinhloko yokugcwaliswa ngaphansi kwe-epoxy ukuhlinzeka ngokuqiniswa komshini kuphakheji ye-flip-chip, ukuthuthukisa ukumelana kwayo nezingcindezi zemishini ezifana nokuhamba ngebhayisikili elishisayo, ukushaqeka kwemishini, nokudlidliza. Kuyasiza futhi ukunciphisa ubungozi bokuhluleka kokuhlangana kwe-solder ngenxa yokukhathala nokungezwani kokunwebeka okushisayo, okungenzeka ngesikhathi sokusebenza kwedivayisi ye-elekthronikhi.

Izinto zokugcwaliswa ngaphansi kwe-epoxy zivame ukwakhiwa ngama-epoxy resins, ama-ejenti okwelapha, nezigcwalisi ukuze kuzuzwe izakhiwo ezifiselekayo zemishini, ezishisayo, nezikagesi. Zenzelwe ukuthi zibe nokunamathela okuhle kokufa kwe-semiconductor kanye ne-substrate, i-coefficient ephansi yokwanda kwe-thermal (CTE) ukuze kuncishiswe ukucindezeleka kokushisa, kanye ne-conductivity ephezulu yokushisa ukuze kube lula ukuchithwa kokushisa kusuka kudivayisi.

Isetshenziselwa I-Underfill Epoxy?

I-Underfill epoxy iyingcina ye-epoxy resin esetshenziswa ezinhlelweni ezahlukahlukene ukuhlinzeka ngokuqiniswa kwemishini nokuvikela. Nazi ezinye izinto ezisetshenziswayo ze-underfill epoxy:

Ukupakishwa kweSemiconductor: I-underfill epoxy ivamise ukusetshenziswa ekufakweni kwe-semiconductor ukuze kuhlinzekwe ukwesekwa kwemishini nokuvikela ezingxenyeni ze-elekthronikhi ezintekenteke, njengama-microchips, afakwe kumabhodi esekethe aphrintiwe (ama-PCB). Igcwalisa igebe phakathi kwe-chip ne-PCB, ivimbela ukucindezeleka kanye nokulimala komshini okubangelwa ukwanda nokunciphisa okushisayo ngesikhathi sokusebenza.

I-Flip-Chip Bonding: I-underfill epoxy isetshenziswa ku-flip-chip bonding, exhuma ama-semiconductor chips ngqo ku-PCB ngaphandle kwamabhondi ezintambo. I-epoxy igcwalisa igebe phakathi kwe-chip ne-PCB, ihlinzeka ngokuqiniswa kwemishini kanye nokufakwa kukagesi ngenkathi ithuthukisa ukusebenza okushisayo.

Ukukhiqiza: I-underfill epoxy isetshenziselwa ukwenza izibonisi, ezifana nezibonisi ze-liquid crystal (LCDs) nemibukiso ye-organic light-emitting diode (OLED). Isetshenziselwa ukuhlanganisa kanye nokuqinisa izingxenye ezithambile, ezifana nezishayeli zokubonisa nezinzwa zokuthinta, ukuqinisekisa ukuzinza nokuqina kwemishini.

Amadivayisi we-Optoelectronic: I-underfill epoxy isetshenziswa kumadivayisi we-optoelectronic, njengama-optical transceivers, ama-laser, nama-photodiodes, ukuze kuhlinzekwe ukwesekwa komshini, ukuthuthukisa ukusebenza okushisayo, nokuvikela izingxenye ezizwelayo ezicini zemvelo.

I-Automotive Electronics: I-underfill epoxy isetshenziswa ku-automotive electronics, njengamayunithi okulawula e-elekthronikhi (ECUs) nezinzwa, ukuze kunikeze ukuqiniswa kwemishini nokuvikela ngokumelene nokweqisa kwezinga lokushisa, ukudlidliza, nezimo zemvelo ezinzima.

I-Aerospace kanye nezicelo Zokuvikela: I-underfill epoxy isetshenziswa ku-aerospace nezinhlelo zokuvikela, ezifana ne-avionics, izinhlelo ze-radar, nezinto zikagesi zezempi, ukuze kuhlinzekwe ukuzinza komshini, ukuvikelwa ekuguquguqukeni kwezinga lokushisa, nokumelana nokushaqeka nokudlidliza.

I-Consumer Electronics: I-underfill epoxy isetshenziswa kuma-electronics ahlukahlukene wabathengi, okuhlanganisa ama-smartphone, amaphilisi, namakhonsoli egeyimu, ukuze kuhlinzekwe ukuqiniswa komshini nokuvikela izingxenye ze-elekthronikhi emonakalweni ngenxa yokuhamba kwamabhayisikili ashisayo, umthelela, nokunye ukucindezeleka.

Amadivayisi Ezokwelapha: I-Underfill epoxy isetshenziswa emishinini yezokwelapha, njengamadivayisi afakelwayo, okokusebenza kokuxilonga, namadivayisi okuqapha, ukuze kuhlinzekwe ukuqinisa kwemishini nokuvikela izingxenye ze-elekthronikhi ezintekenteke ezindaweni ezinonya.

Ukupakishwa kwe-LED: I-underfill epoxy isetshenziswa ekufakweni kwe-light-emitting diode (ama-LED) ukuze kuhlinzekwe usekelo lwemishini, ukuphatha okushisayo, nokuvikela kumswakama nezinye izici zemvelo.

I-General Electronics: I-underfill epoxy isetshenziswa kuhlelo olubanzi lwezinhlelo zokusebenza ze-elekthronikhi ezijwayelekile lapho kudingeka khona ukuqinisa ngomshini nokuvikelwa kwezingxenye ze-elekthronikhi, njengakuma-electronics wamandla, i-industrial automation, kanye nemishini yezokuxhumana.

Iyini I-Underfill Material Ye-Bga?

I-Underfill material ye-BGA (I-Ball Grid Array) i-epoxy noma i-polymer-based material esetshenziselwa ukugcwalisa igebe phakathi kwephakheji ye-BGA ne-PCB (Ibhodi Lesifunda Eliphrintiwe) ngemva kokudayiswa. I-BGA iwuhlobo lwephakheji yokukhweza ngaphezulu esetshenziswa kumishini kagesi ehlinzeka ngokuminyana okuphezulu kokuxhumana phakathi kwesekethe ehlanganisiwe (IC) ne-PCB. Okubalulekile okungagcwalisi kakhulu kuthuthukisa ukuthembeka kwamalunga e-BGA solder namandla okusebenza, kunciphisa ubungozi bokwehluleka ngenxa yengcindezi yemishini, ukuhamba ngebhayisikili okushisayo, nezinye izici zemvelo.

Okubalulekile okungagcwali phansi kuvame ukuwuketshezi futhi kugeleza ngaphansi kwephakheji ye-BGA ngesenzo se-capillary. Ibe seyenza inqubo yokwelapha ukuze kuqiniswe nokudala ukuxhumana okuqinile phakathi kwe-BGA ne-PCB, ngokuvamile ngokushisa noma ukuchayeka kwe-UV. I-underfill material isiza ukusabalalisa izingcindezi zemishini ezingase zenzeke ngesikhathi sokuhamba ngebhayisikili okushisayo, ukunciphisa ubungozi bokuqhekeka kwe-solder kanye nokwenza ngcono ukuthembeka okuphelele kwephakheji ye-BGA.

Okubalulekile okungagcwali phansi kwe-BGA kukhethwa ngokucophelela ngokusekelwe ezintweni ezifana nomklamo othize wephakheji ye-BGA, izinto ezisetshenziswa ku-PCB ne-BGA, indawo yokusebenza, kanye nohlelo oluhlosiwe. Ezinye izinto ezijwayelekile zokungagcwalisi phansi kwe-BGA zifaka i-epoxy-based, no-flow, kanye nokugcwaliswa ngaphansi ngezinto ezihlukene zokugcwalisa njenge-silica, i-alumina, noma izinhlayiya eziqhutshwayo. Ukukhethwa kwezinto ezifanele zokungagcwalisi kahle kubalulekile ukuze kuqinisekiswe ukwethembeka nokusebenza kwesikhathi eside kwamaphakheji e-BGA kumishini kagesi.

Ukwengeza, okokusebenza okungagcwali phansi kwe-BGA kunganikeza isivikelo kumswakama, uthuli, nokunye ukungcola okungase kungene ngaphandle kwegebe eliphakathi kwe-BGA ne-PCB, okungase kubangele ukugqwala noma amasekhethi amafushane. Lokhu kungasiza ukuthuthukisa ukuqina nokuthembeka kwamaphakheji e-BGA ezindaweni ezinokhahlo.

Iyini i-Underfill Epoxy ku-Ic?

I-underfill epoxy ku-IC (I-Integrated Circuit) iyinto enamathelayo evala igebe phakathi kwe-chip ye-semiconductor kanye ne-substrate (njengebhodi lesekethe eliphrintiwe) kumishini kagesi. Ivamise ukusetshenziswa enqubweni yokukhiqiza yama-IC ukuze kuthuthukiswe amandla awo emishini nokuthembeka.

Ama-IC ngokuvamile akhiwa i-chip ye-semiconductor equkethe izingxenye ze-elekthronikhi ezihlukahlukene, njengama-transistors, ama-resistors, nama-capacitor, axhunywe kokuthintana nogesi wangaphandle. Lawa ma-chips abe esefakwa ku-substrate, ehlinzeka ngosekelo kanye nokuxhumana kukagesi kulo lonke uhlelo lwe-elekthronikhi. Kodwa-ke, ngenxa yomehluko kuma-coefficients of thermal expansion (CTEs) phakathi kwe-chip ne-substrate kanye nokucindezeleka nobunzima okuhlangenwe nakho ngesikhathi sokusebenza, ukucindezeleka komshini, nezinkinga zokuthembeka zingavela, njengokuhluleka okubangelwa ukuhamba ngebhayisikili elishisayo noma ukuphahlazeka komshini.

I-underfill epoxy ibhekana nalezi zinkinga ngokuvala igebe phakathi kwe-chip ne-substrate, kudala ibhondi eqinile. Iwuhlobo lwe-epoxy resin eyakhiwe ngezinto ezithile, ezifana ne-viscosity ephansi, amandla aphezulu okunamathela, kanye nezakhiwo ezinhle ezishisayo nezomshini. Ngesikhathi senqubo yokukhiqiza, i-epoxy engagcwalisi isetshenziswa ngendlela ewuketshezi, bese ilashwa ukuze kuqiniswe futhi kwakhiwe isibopho esiqinile phakathi kwe-chip ne-substrate. Ama-IC angamadivayisi e-elekthronikhi azwelayo asengozini yokucindezelwa yimishini, ukuhamba ngebhayisikili kwezinga lokushisa, nezinye izici zemvelo ngesikhathi sokusebenza, ezingabangela ukwehluleka ngenxa yokukhathala okuhlangene kwe-solder noma ukuncipha phakathi kwe-chip ne-substrate.

I-underfill epoxy isiza ukusabalalisa kabusha kanye nokunciphisa ukucindezelwa kwemishini kanye nobunzima ngesikhathi sokusebenza futhi inikeza isivikelo kumswakama, ukungcola, kanye nokushaqeka kwemishini. Kuphinde kusize ukuthuthukisa ukwethembeka kokuhamba ngebhayisikili okushisayo kwe-IC ngokunciphisa ubungozi bokuqhekeka noma ukuhlukaniswa phakathi kwe-chip ne-substrate ngenxa yokushintsha kwezinga lokushisa.

Iyini i-Underfill Epoxy ku-Smt?

I-underfill epoxy ku-Surface Mount Technology (SMT) ibhekisela ohlotsheni lwento enamathelayo esetshenziselwa ukugcwalisa igebe phakathi kwe-semiconductor chip ne-substrate kumishini kagesi efana namabhodi esekethe aphrintiwe (ama-PCB). I-SMT iyindlela edumile yokuhlanganisa izingxenye ze-elekthronikhi kuma-PCB, futhi i-underfill epoxy ivamise ukusetshenziselwa ukuthuthukisa amandla emishini nokuthembeka kwamalunga e-solder phakathi kwe-chip ne-PCB.

Lapho izinto zikagesi zingaphansi kokuhamba ngebhayisikili okushisayo kanye nengcindezi yemishini, njengalapho kusebenza noma kuthuthwa, umehluko ku-coefficient of thermal expansion (CTE) phakathi kwe-chip ne-PCB kungabangela ubunzima emalungeni e-solder, okuholela ekuhlulekeni okungaba khona njengokuqhekeka. noma delamination. I-underfill epoxy isetshenziselwa ukunciphisa lezi zinkinga ngokuvala igebe phakathi kwe-chip ne-substrate, ukuhlinzeka ngosekelo lwemishini, nokuvimbela amalunga e-solder ukuthi ahlangabezane nengcindezi eyeqile.

I-underfill epoxy ngokuvamile iyimpahla ye-thermosetting ekhishwa isesimweni esiwuketshezi ku-PCB, futhi igelezela esikhaleni phakathi kwe-chip ne-substrate ngokusebenzisa isenzo se-capillary. Ibe selashwa ukuze kwakhiwe into eqinile futhi eqinile ebopha i-chip ku-substrate, ithuthukise ubuqotho obuphelele bemishini bamalunga e-solder.

I-Underfill epoxy isebenzisa imisebenzi embalwa ebalulekile kumihlangano ye-SMT. Kuyasiza ukunciphisa ukwakheka kokuqhekeka okuhlanganyelwe kwe-solder noma ukuphuka ngenxa yebhayisikili eshisayo kanye nokucindezeleka komshini ngesikhathi sokusebenza kwemishini kagesi. Iphinde ithuthukise ukuchithwa okushisayo kusuka ku-IC kuya ku-substrate, okusiza ukuthuthukisa ukuthembeka nokusebenza komhlangano we-elekthronikhi.

Ukugcwalisa i-epoxy emibuthanweni ye-SMT kudinga amasu anembile okukhipha ukuze kuqinisekiswe ukumbozwa okufanele nokusabalalisa okufanayo kwe-epoxy ngaphandle kokudala noma yimuphi umonakalo ku-IC noma i-substrate. Imishini ethuthukisiwe njengamarobhothi okukhipha impahla kanye namahhavini okwelapha ngokuvamile isetshenziswa enqubweni yokungagcwalisi kahle ukuze kuzuzwe imiphumela engaguquki kanye namabhondi ekhwalithi ephezulu.

Yiziphi Izakhiwo Zezinto Ezingagcwalisi Ngaphansi?

Izinto ezingagcwali phansi zivame ukusetshenziswa ezinqubweni zokukhiqiza ugesi, ikakhulukazi, ukupakishwa kwe-semiconductor, ukuthuthukisa ukuthembeka nokuqina kwamadivayisi kagesi njengamasekhethi ahlanganisiwe (ICs), ama-ball grid arrays (BGAs), namaphakheji we-flip-chip. Izakhiwo zezinto ezingagcwalisi kakhulu zingahluka kuye ngohlobo oluthile nokwakheka kodwa ngokuvamile zihlanganisa okulandelayo:

I-Thermal conductivity: Izinto zokungagcwalisi kahle kufanele zibe ne-thermal conductivity enhle yokukhipha ukushisa okukhiqizwa idivayisi ye-elekthronikhi ngesikhathi sokusebenza. Lokhu kusiza ukuvimbela ukushisa ngokweqile, okungaholela ekuhlulekeni kwecebo.

Ukuhambelana kwe-CTE (I-Coefficient of Thermal Expansion): Izinto ezingagcwalisi kahle kufanele zibe ne-CTE ehambisana ne-CTE yesisetshenziswa sikagesi kanye ne-substrate eboshwe kuyo. Lokhu kusiza ukunciphisa ingcindezi yokushisa ngesikhathi sokuhamba ngebhayisikili futhi kuvimbele i-delamination noma ukuqhekeka.

I-viscosity ephansi: Izinto ezingagcwalisi kahle kufanele zibe nokuminyana okuphansi ukuze zikwazi ukugeleza kalula ngesikhathi senqubo yokuhlanganisa futhi zivale izikhala phakathi kwensiza ye-elekthronikhi ne-substrate, kuqinisekiswe ukumbozwa okufanayo kanye nokunciphisa izikhala.

Ukunamathela: Izinto ezingagcwalisi kahle kufanele zibe nokunamathela okuhle kudivayisi ye-elekthronikhi kanye ne-substrate ukuze kunikeze ibhondi eqinile futhi kuvimbele ukuhlukaniswa noma ukuhlukana ngaphansi kwengcindezi eshisayo neyomshini.

Ukufakwa kukagesi: Izinto zokungagcwalisi kahle kufanele zibe nezindawo zokuvikela ugesi eziphakeme ukuvimbela amasekhethi amafushane nokunye ukwehluleka kukagesi ocingweni.

Amandla omshini: Izinto ezisetshenziswayo zokungagcwalisi kahle kufanele zibe namandla anele okusebenza ukuze zimelane nezingcindezi ohlangabezana nazo ngesikhathi sokuhamba ngebhayisikili, ukushaqeka, ukudlidliza, neminye imithwalo yemishini ngaphandle kokuqhekeka noma ukonakala.

Isikhathi sokwelashwa: Izinto ezisetshenziswayo ezingagcwalisi kahle kufanele zibe nesikhathi esifanele sokwelapha ukuze kuqinisekiswe ukuhlangana okufanele nokwelashwa ngaphandle kokubangela ukubambezeleka enqubweni yokukhiqiza.

Ukusabalalisa kanye nokusebenza kabusha: Izinto ezingagcwalisi kahle kufanele zihambisane nezinto ezisetshenziswayo ezisetshenziswa ekukhiqizeni futhi zivumele ukusetshenzwa kabusha noma ukulungiswa uma kudingeka.

Ukumelana nomswakama: Izinto zokungagcwalisi kahle kufanele zibe nokumelana nomswakama okuhle ukuze kuvinjelwe ukungena komswakama, okungabangela ukwehluleka kwedivayisi.

Impilo: Izinto ezingagcwalisi kahle kufanele zibe neshelufu elifanele, elivumela ukugcinwa okufanele nokusebenziseka ngokuhamba kwesikhathi.

Iyini I-Underfill Material Ebunjiwe?

Izinto ezibunjiwe zokungagcwalisi phansi zisetshenziswa ekufakweni kwe-elekthronikhi ukuze kuhlanganiswe futhi kuvikelwe amadivaysi e-semiconductor, njengamasekhethi ahlanganisiwe (ama-IC), ezicini zemvelo zangaphandle kanye nokucindezeleka komshini. Ngokuvamile isetshenziswa njengento ewuketshezi noma yokunamathisela bese yelapheka ukuze iqinise futhi yakhe isendlalelo esivikelayo esizungeze idivayisi ye-semiconductor.

Izinto ezibunjiwe zokungagcwalisi phansi zivame ukusetshenziswa ekufakweni kwe-flip-chip, okuxhumanisa amadivaysi e-semiconductor ebhodini lesekethe eliphrintiwe (PCB) noma i-substrate. Ukupakishwa kwe-Flip-chip kuvumela isikimu soxhumano esinobukhulu obuphezulu, esisebenza kakhulu, lapho idivayisi ye-semiconductor igxunyekwa ibheke phansi ku-substrate noma i-PCB, futhi ukuxhunywa kukagesi kwenziwa kusetshenziswa amabhampa ensimbi noma amabhola e-solder.

Izinto ezibunjiwe zokungagcwalisi ngaphansi ngokuvamile zikhishwa zibe uketshezi noma ifomu lokunamathisela futhi zigeleza ngaphansi kwedivayisi ye-semiconductor ngesenzo se-capillary, sigcwalisa izikhala phakathi kwedivayisi ne-substrate noma i-PCB. Izinto ezisetshenziswayo zibe sezelashwa kusetshenziswa ukushisa noma ezinye izindlela zokwelapha ukuze kuqiniswe futhi kwakhiwe isendlalelo esivikelayo esimboza idivayisi, sinikeze ukusekela komshini, ukufakwa kwe-thermal, nokuvikelwa kumswakama, uthuli, nokunye ukungcola.

Izinto ezibunjiwe zokungagcwalisi phansi zivame ukwakhiwa ukuze zibe nezakhiwo ezifana ne-viscosity ephansi ukuze zikhishwe kalula, ukuzinza okuphezulu kokushisa kokusebenza okuthembekile ezinhlobonhlobo zamazinga okushisa okusebenza, ukunamathela okuhle kuma-substrates ahlukene, i-coefficient ephansi yokwanda okushisayo (CTE) ukunciphisa ingcindezi ngesikhathi sokushisa. ukuhamba ngebhayisikili, kanye nezakhiwo eziphakeme zokuvala ugesi ukuvimbela amasekhethi amafushane.

Impela! Ngaphezu kwezakhiwo ezishiwo ngaphambili, izinto ezibunjiwe zokungagcwalisi kahle zingase zibe nezinye izici eziklanyelwe izinhlelo zokusebenza ezithile noma izidingo. Isibonelo, ezinye izinto ezingagcwalisi ngaphansi ezithuthukisiwe kungenzeka zithuthukise ukuqhutshwa kwe-thermal ukuze kuthuthukiswe ukuchithwa kokushisa kusukela kudivayisi ye-semiconductor, okubalulekile ezinhlelweni zokusebenza zamandla aphezulu lapho ukuphathwa kwe-thermal kubalulekile.

Uyisusa Kanjani I-Underfill Material?

Ukususa izinto ezingagcwaliswanga ngokwanele kungaba inselele, njengoba yakhelwe ukuthi iqine futhi imelane nezimo zemvelo. Kodwa-ke, izindlela ezimbalwa ezijwayelekile zingasetshenziswa ukususa izinto ezingagcwalisi kancane, kuye ngohlobo oluthile lokungagcwalisi kahle kanye nomphumela ofunekayo. Nazi ezinye izinketho:

Izindlela ezishisayo: Izinto ezingagcwali phansi ngokuvamile ziklanyelwe ukuthi zizinze ngokushisa, kodwa ngezinye izikhathi zingathanjiswa noma zincibilike ngokusebenzisa ukushisa. Lokhu kungenziwa kusetshenziswa izinto ezikhethekile ezifana nesiteshi sokuvuselela umoya oshisayo, insimbi yokudambisa enensingo eshisayo, noma isifudumezi se-infrared. I-underfill ethambile noma encibilikisiwe ingase isikwe ngokucophelela noma isuswe kusetshenziswa ithuluzi elifanelekile, njengepulasitiki noma i-scraper yensimbi.

Izindlela zamakhemikhali: Izincibilikisi zamakhemikhali zingancibilikisa noma zithambe ezinye izinto ezingagcwali kakhulu. Uhlobo lwe-solvent oludingekayo luncike ohlotsheni oluthile lwezinto ezingagcwalisi kahle. Izinyibilikisi ezijwayelekile zokususwa kokungagcwalisi okuncane zifaka i-isopropyl alcohol (IPA), i-acetone, noma izixazululo ezikhethekile zokususa ukugcwalisa okungagcwaliswanga phansi. I-solvent ngokuvamile isetshenziswa kokungagcwalisi kahle futhi ivunyelwe ukungena futhi ithambise, ngemva kwalokho okubalulekile kungasulwa ngokucophelela noma kusulwe.

Izindlela zikagesi: Impahla engagcwalisi kakhulu ingasuswa ngokuyimishini kusetshenziswa izindlela ezilumayo noma zemishini. Lokhu kungabandakanya amasu anjengokugaya, ukugaya, noma ukugaya, kusetshenziswa amathuluzi akhethekile noma izinto zokusebenza. Izinqubo ezizenzakalelayo ngokuvamile zinolaka futhi zingase zifaneleke ezimweni lapho ezinye izindlela zingasebenzi, kodwa zingase futhi zenze izingozi zokulimaza i-substrate engaphansi noma izingxenye futhi kufanele zisetshenziswe ngokuqapha.

Izindlela zokuhlanganisa: Kwezinye izimo, inhlanganisela yamasu ingase isuse izinto ezingagcwali kakhulu. Isibonelo, izinqubo ezihlukahlukene ezishisayo namakhemikhali zingasetshenziswa, lapho ukushisa kusetshenziswa khona ukuze kuthambise izinto ezingagcwali phansi, izincibilikisi ukuze kuqhutshekwe kuncibilike noma kuthambise impahla, kanye nezindlela zemishini zokususa izinsalela ezisele.

Indlela Yokugcwalisa I-Underfill Epoxy

Nansi inkomba yesinyathelo ngesinyathelo sendlela yokugcwalisa i-epoxy:

Isinyathelo 1: Qoqa Izinto kanye Nezisetshenziswa

Gcwalisa kancane impahla ye-epoxy: Khetha okokusebenza kwe-epoxy kokugcwalisa okungaphansi kwekhwalithi ephezulu okuhambisana nezingxenye ze-elekthronikhi osebenza ngazo. Landela imiyalelo yomkhiqizi yokuxuba nokwelapha izikhathi.

Izisetshenziswa zokusabalalisa: Uzodinga isistimu yokukhipha, njengesirinji noma i-dispenser, ukuze usebenzise i-epoxy ngokunembile nangokufana.

Umthombo wokushisa (uyazikhethela): Ezinye izinto ze-epoxy ezigcwaliswe kancane zidinga ukwelashwa ngokushisa, ngakho-ke ungase udinge umthombo wokushisa, okufana nohhavini noma ipuleti elishisayo.

Izinto zokuhlanza: Yiba ne-isopropyl alcohol noma i-ejenti yokuhlanza efanayo, ama-wipes angenayo i-lint, namagilavu ​​okuhlanza nokuphatha i-epoxy.

Isinyathelo sesi-2: Lungiselela Izingxenye

Hlanza izingxenye: Qinisekisa ukuthi izingxenye ezizogcwaliswa kancane zihlanzekile futhi azinakho ukungcola, njengothuli, amafutha, noma umswakama. Hlanza kahle usebenzisa i-isopropyl alcohol noma i-ejenti yokuhlanza efanayo.

Faka i-adhesive noma i-flux (uma kudingeka): Kuye ngokuthi i-underfill epoxy material kanye nezingxenye ezisetshenziswayo, kungase kudingeke ukuthi usebenzise i-adhesive noma i-flux ezingxenyeni ngaphambi kokufaka i-epoxy. Landela imiyalelo yomkhiqizi wento ethile esetshenziswayo.

Isinyathelo sesi-3: Hlanganisa i-epoxy

Landela imiyalelo yomkhiqizi ukuze uxube kahle okokusebenza kwe-epoxy okungagcwalisi kahle. Lokhu kungase kuhilele ukuhlanganisa izingxenye ezimbili noma ngaphezulu ze-epoxy ngezilinganiso ezithile futhi uzishukumise kahle ukuze kuzuzwe ingxube ye-homogeneous. Sebenzisa isitsha esihlanzekile nesomile ukuxuba.

Isinyathelo sesi-4: Faka i-Epoxy

Layisha i-epoxy ohlelweni lokusabalalisa: Gcwalisa isistimu yokukhipha, njengesirinji noma i-dispenser, ngezinto ezixubile ze-epoxy.

Faka i-epoxy: Hambisa impahla ye-epoxy endaweni edinga ukugcwaliswa kancane. Qinisekisa ukuthi usebenzisa i-epoxy ngendlela efanayo futhi elawulwayo ukuze uqinisekise ukumbozwa okuphelele kwezingxenye.

Gwema amabhamuza omoya: Gwema ukubamba amabhamuza omoya ku-epoxy, njengoba angathinta ukusebenza nokuthembeka kwezingxenye ezingagcwaliswanga kahle. Sebenzisa amasu okukhipha afanele, njengokucindezela okunensayo nokunendayo, futhi ukhiphe ngobumnene noma yimaphi amabhamuza omoya avaleleke ngevacuum noma uthephe ukuhlanganisa.

Isinyathelo sesi-5: Yelapha i-epoxy

Ukwelapha i-epoxy: Landela imiyalelo yomkhiqizi yokwelapha i-epoxy engagcwalisi. Kuye ngezinto ze-epoxy ezisetshenzisiwe, lokhu kungase kuhlanganise ukulungisa ekamelweni lokushisa noma ukusebenzisa umthombo wokushisa.

Vumela isikhathi sokuphumula esifanele: Nikeza i-epoxy isikhathi esanele sokwelapha ngokugcwele ngaphambi kokuphatha noma ukuqhubeka nokucubungula izingxenye. Ngokuya ngempahla ye-epoxy nezimo zokuphulukisa, lokhu kungathatha amahora ambalwa kuya ezinsukwini ezimbalwa.

Isinyathelo sesi-6: Hlanza futhi Uhlole

Hlanza i-epoxy eyengeziwe: Uma i-epoxy iselaphekile, susa noma iyiphi i-epoxy eyeqile usebenzisa izindlela zokuhlanza ezifanele, njengokukhuhla noma ukusika.

Hlola izingxenye ezigcwaliswe kancane: Hlola izingxenye ezingagcwalisiwe kahle ukuze uthole noma ikuphi ukonakala, okufana ne-voids, i-delamination, noma ukumbozwa okungaphelele. Uma kutholakala noma yikuphi ukukhubazeka, thatha izinyathelo ezifanele zokulungisa, njengokugcwalisa kabusha noma ukuphulukisa kabusha, njengoba kudingeka.

Uyigcwalisa nini i-Underfill Epoxy

Isikhathi sokufaka isicelo se-epoxy esingagcwalisiwe sizoncika kunqubo ethile kanye nohlelo lokusebenza. I-underfill epoxy ngokuvamile isetshenziswa ngemuva kokuthi i-microchip igxunyekwe ebhodini lesifunda futhi amajoyinti e-solder enziwe. Ngokusebenzisa i-dispenser noma isirinji, i-epoxy engagcwalisi ibe isikhishwa ngegebe elincane phakathi kwe-microchip nebhodi lesifunda. I-epoxy ibe isiyelapha noma iqiniswe, ngokuvamile iyishisise ezingeni lokushisa elithile.

Isikhathi esiqondile sohlelo lokusebenza lwe-epoxy olungagcwalisiwe lungancika ezintweni ezifana nohlobo lwe-epoxy esetshenzisiwe, usayizi nejiyomethri yegebe okufanele ligcwaliswe, kanye nenqubo ethile yokwelapha. Ukulandela imiyalelo yomkhiqizi kanye nendlela enconyiwe ye-epoxy ethile esetshenziswayo kubalulekile.

Nazi ezinye izimo zansuku zonke lapho i-underfill epoxy ingasetshenziswa:

I-Flip-chip bonding: I-underfill epoxy ivamise ukusetshenziswa ekubopheni i-flip-chip, indlela yokunamathisela i-semiconductor chip ngqo ku-PCB ngaphandle kokubopha intambo. Ngemuva kokuthi i-flip-chip inamathiselwe ku-PCB, i-underfill epoxy ngokuvamile isetshenziswa ukugcwalisa igebe phakathi kwe-chip ne-PCB, inikeze ukuqiniswa komshini nokuvikela i-chip ezintweni zemvelo ezifana nomswakama kanye nokushintsha kwezinga lokushisa.

Ubuchwepheshe be-Surface Mount (SMT): I-epoxy engagcwalisi kakhulu ingase isetshenziswe ezinqubweni zobuchwepheshe be-surface mount (SMT), lapho izingxenye ze-elekthronikhi ezifana namasekhethi adidiyelwe (ama-ICs) kanye nezinto ezimelana nazo zigxunyekwe ngqo phezu kwe-PCB. I-epoxy engagcwalisi kakhulu ingase isetshenziswe ukuqinisa nokuvikela lezi zingxenye ngemva kokuthengiswa ku-PCB.

Ukuhlanganiswa kwe-Chip-on-board (COB): Emhlanganweni we-chip-on-board (COB), ama-chips angenalutho we-semiconductor anamathiselwe ngqo ku-PCB kusetshenziswa izinto zokunamathisela eziqhutshwayo, futhi i-underfill epoxy ingase isetshenziselwe ukuhlanganisa nokuqinisa ama-chips, ukuthuthukisa ukuzinza nokuthembeka kwawo.

Ukulungiswa kwezinga lengxenye: I-underfill epoxy ingase futhi isetshenziswe ezinqubweni zokulungisa izinga lengxenye, lapho izingxenye ze-elekthronikhi ezilimele noma ezinephutha ku-PCB zithathelwa indawo ezintsha. I-underfill epoxy ingase isetshenziswe engxenyeni yokushintshanisa ukuze kuqinisekiswe ukunamathela okufanele kanye nokuzinza kwemishini.

Ingabe I-Epoxy Filler Ingenamanzi

Yebo, isigcwalisi se-epoxy ngokuvamile asingeni manzi uma sesipholile. Izigcwalisi ze-epoxy zaziwa ngokunamathela kwazo okuhle kakhulu kanye nokumelana namanzi, okuzenza zibe ukukhetha okudumile kwezinhlelo zokusebenza ezahlukahlukene ezidinga ibhondi eqinile nengenamanzi.

Uma isetshenziswa njengokugcwalisa, i-epoxy ingagcwalisa ngempumelelo imifantu nezikhala ezintweni ezahlukahlukene, kufaka phakathi ukhuni, insimbi, nokhonkolo. Uma seselaphekile, idala indawo eqinile, eqinile ukumelana namanzi nomswakama, okuyenza ifaneleke ukusetshenziswa ezindaweni ezichayeke emanzini noma ezinomswakama ophezulu.

Kodwa-ke, kubalulekile ukuqaphela ukuthi akuwona wonke ama-epoxy fillers adalwe alingana, futhi amanye angase abe namazinga ahlukene okumelana namanzi. Kuhlale kuwumqondo omuhle ukuhlola ilebula yomkhiqizo othile noma uthintane nomkhiqizi ukuze uqiniseke ukuthi ifanele iphrojekthi yakho nokusetshenziswa okuhlosiwe.

Ukuqinisekisa imiphumela engcono kakhulu, kubalulekile ukulungisa kahle indawo ngaphambi kokufaka i-epoxy filler. Lokhu ngokuvamile kuhilela ukuhlanza indawo kahle nokususa noma iyiphi into evulekile noma eyonakele. Lapho indawo engaphezulu isilungisiwe kahle, isigcwalisi se-epoxy singaxutshwa futhi sisetshenziswe ngokulandela imiyalelo yomkhiqizi.

Kubalulekile futhi ukuqaphela ukuthi akuwona wonke ama-epoxy fillers adalwe alinganayo. Eminye imikhiqizo ingase ifaneleke kakhulu izinhlelo zokusebenza ezithile noma izindawo kunezinye, ngakho ukukhetha umkhiqizo ofanele umsebenzi kubalulekile. Ukwengeza, ezinye izigcwalisi ze-epoxy zingase zidinge ezinye izigqoko noma ama-sealers ukuze anikeze ukuvikeleka okuhlala isikhathi eside kokuvimbela amanzi.

Ama-epoxy fillers adume ngezakhiwo zawo zokuvikela amanzi kanye nekhono lokudala isibopho esiqinile nesihlala isikhathi eside. Kodwa-ke, ukulandela amasu okusebenza afanele nokukhetha umkhiqizo ofanele kubalulekile ukuze kuqinisekiswe imiphumela engcono kakhulu.

Gcwalisa Ngaphansi Inqubo ye-Epoxy Flip Chip

Nazi izinyathelo zokwenza inqubo ye-underfill epoxy flip chip:

Ukuhlanza: I-substrate ne-flip chip ziyahlanzwa ukuze kukhishwe noma yiluphi uthuli, udoti, noma ukungcola okungase kuphazamise ibhondi ye-epoxy engagcwaliswanga kahle.

Ukusabalalisa: I-epoxy engagcwalisiwe isakazwa ku-substrate ngendlela elawulwayo, kusetshenziswa i-dispenser noma inaliti. Inqubo yokukhipha kufanele iqonde ukugwema noma yikuphi ukuchichima noma i-voids.

Ukulungiswa: I-flip chip ibe isiqondaniswa ne-substrate kusetshenziswa isibonakhulu ukuze kuqinisekiswe ukubekwa okunembile.

Geza kabusha: I-flip chip igeleza kabusha kusetshenziswa isithando somlilo noma ihhavini ukuze kuncibilike amaqhuqhuva e-solder futhi ibophe i-chip ku-substrate.

Ukwelapha: I-epoxy engagcwalisiwe yelapheka ngokuyishisisa kuhhavini ngezinga lokushisa elithile nangesikhathi. Inqubo yokwelapha ivumela i-epoxy ukuthi igeleze futhi igcwalise noma yiziphi izikhala phakathi kwe-flip chip ne-substrate.

Ukuhlanza: Ngemuva kwenqubo yokuphulukisa, noma iyiphi i-epoxy eyeqile iyasuswa emaphethelweni e-chip ne-substrate.

Ukuhlolwa: Isinyathelo sokugcina ukuhlola i-flip chip ngaphansi kwesibonakhulu ukuze uqinisekise ukuthi akukho zikhala noma izikhala ku-epoxy engagcwaliswanga kahle.

Ngemuva kokwelapha: Kwezinye izimo, inqubo yokwelapha ngemva kokwelashwa ingase idingeke ukuze kuthuthukiswe izakhiwo zemishini nezokushisa ze-epoxy engagcwalisiwe. Lokhu kuhilela ukushisisa i-chip futhi ezingeni lokushisa eliphezulu isikhathi eside ukuze kuzuzwe ukuxhumanisa okuphelele kwe-epoxy.

Ukuhlolwa kukagesi: Ngemuva kwenqubo ye-epoxy flip-chip yokugcwalisa okungaphansi, idivayisi iyahlolwa ukuze kuqinisekiswe ukuthi isebenza kahle. Lokhu kungase kuhlanganise ukuhlola izikhindi noma ukuvuleka kusekethe nokuhlola izici zikagesi zedivayisi.

Okufakiwe: Uma idivayisi isihloliwe futhi yaqinisekiswa, ingapakishwa futhi ithunyelwe kukhasimende. Ukupakishwa kungase kuhlanganise ukuvikeleka okwengeziwe, okufana nokuvikela noma i-encapsulation, ukuqinisekisa ukuthi idivayisi ayonakaliswa ngesikhathi sokuthutha noma ukuphathwa.

Indlela ye-Epoxy Underfill Bga

Inqubo ihilela ukugcwalisa isikhala phakathi kwe-chip ye-BGA nebhodi lesifunda nge-epoxy, ehlinzeka ngokusekela okwengeziwe komshini futhi ithuthukise ukusebenza okushisayo kokuxhumeka. Nazi izinyathelo ezihilelekile ku-epoxy underfill indlela ye-BGA:

• Lungiselela iphakheji ye-BGA kanye ne-PCB ngokuyihlanza nge-solvent ukuze ususe ukungcola okungase kuthinte ibhondi.
• Faka inani elincane lokuguquguquka phakathi nendawo yephakheji ye-BGA.
• Beka iphakheji ye-BGA ku-PCB futhi usebenzise i-ovini yokugeleza kabusha ukuze uthengise iphakheji ebhodini.
• Faka inani elincane lokugcwalisa i-epoxy ekhoneni lephakheji ye-BGA. I-underfill kufanele isetshenziswe ekhoneni eliseduze nendawo yephakheji, futhi akufanele ihlanganise noma yimaphi amabhola e-solder.
• Sebenzisa isenzo se-capillary noma i-vacuum ukuze udwebe ukugcwalisa ngaphansi kwephakheji ye-BGA. I-underfill kufanele igeleze eduze kwamabhola e-solder, igcwalise noma yiziphi izikhala futhi idale isibopho esiqinile phakathi kwe-BGA ne-PCB.
• Yelapha ukugcwaliswa ngaphansi ngokwemiyalelo yomkhiqizi. Lokhu ngokuvamile kuhilela ukushisisa umhlangano ezingeni lokushisa elithile ngesikhathi esithile.
• Hlanza umhlangano nge-solvent ukuze ususe noma yikuphi ukugeleza okudlulele noma okungagcwalisi kahle.
• Hlola ukugcwaliswa ngaphansi ukuze uthole ama-voids, amabhamuza, noma okunye ukonakala okungase kuphazamise ukusebenza kwe-chip ye-BGA.
• Hlanza noma iyiphi i-epoxy eyeqile ku-chip ye-BGA nebhodi lesifunda usebenzisa isincibilikisi.
• Hlola i-chip ye-BGA ukuze uqinisekise ukuthi isebenza ngendlela efanele.

I-Epoxy underfill ihlinzeka ngenani lezinzuzo zamaphakheji e-BGA, okuhlanganisa amandla athuthukisiwe emishini, ukunciphisa ingcindezi kumajoyinti e-solder, nokwanda kokumelana nokuhamba ngebhayisikili okushisayo. Nokho, ukulandela imiyalelo yomkhiqizi ngokucophelela kuqinisekisa isibopho esiqinile nesithembekile phakathi kwephakheji ye-BGA ne-PCB.

Indlela Yokwenza I-Underfill Epoxy Resin

I-Underfill epoxy resin iwuhlobo lokunamathelayo olusetshenziselwa ukugcwalisa izikhala nokuqinisa izingxenye ze-elekthronikhi. Nazi izinyathelo ezijwayelekile zokwenza i-epoxy resin engagcwalisiwe:

• Izithako:
• I-epoxy resin
• I-Hardener
• Izinto zokugcwalisa (njenge-silica noma ubuhlalu bengilazi)
• Izincibilikisi (njenge-acetone noma i-isopropyl alcohol)
• Ama-Catalysts (uyazikhethela)

izinyathelo:

Khetha i-epoxy resin efanelekile: Khetha i-epoxy resin elungele uhlelo lwakho lokusebenza. Ama-epoxy resins eza ngezinhlobo ezahlukahlukene ezinezakhiwo ezahlukahlukene. Ngezinhlelo zokusebenza ezingagcwalisi kahle, khetha inhlaka enamandla amakhulu, ukushwabana okuphansi, nokunamathela okuhle.

Hlanganisa i-epoxy resin ne-hardener: Ama-resin epoxy amaningi angagcwalisi afika ekhithi enezingxenye ezimbili, ne-resin ne-hardener zipakishwe ngokwehlukana. Hlanganisa izingxenye ezimbili ndawonye ngokwemiyalelo yomkhiqizi.

Engeza izinto zokugcwalisa: Engeza izinto zokugcwalisa kungxube ye-epoxy resin ukuze ukhulise i-viscosity yayo futhi unikeze ukwesekwa okwengeziwe kwesakhiwo. I-silica noma ubuhlalu bengilazi buvame ukusetshenziswa njengama-fillers. Engeza ama-fillers kancane kancane futhi uhlanganise kahle kuze kube yilapho kutholakala ukuvumelana okufunayo.

Engeza ama-solvents: Izincibilikisi zingangezwa kungxube ye-epoxy resin ukuze kuthuthukiswe ukugeleza kwayo kanye nezakhiwo zokumanzisa. I-acetone noma i-isopropyl alcohol yizincibilikisi ezivame ukusetshenziswa. Engeza ama-solvents kancane kancane bese uxuba kahle kuze kube yilapho kutholakala ukuvumelana okufunayo.

Akuphoqelekile: Engeza ama-catalysts: Ama-Catalysts angangezwa kungxube ye-epoxy resin ukusheshisa inqubo yokwelapha. Kodwa-ke, izibangeli zinganciphisa impilo yebhodwe lengxube, ngakho-ke zisebenzise kancane. Landela imiyalelo yomkhiqizi ngenani elifanele le-catalyst ozolingeza.

Faka i-underfill epoxy resin ukuze ugcwalise ingxube ye-epoxy resin esikhaleni noma ehlangene. Sebenzisa isirinji noma isiphakeli ukuze usebenzise ingxube kahle futhi ugweme amabhamuza omoya. Qinisekisa ukuthi ingxube isatshalaliswa ngokulinganayo futhi ihlanganisa zonke izindawo.

Ukwelapha i-epoxy resin: I-epoxy resin ingakwazi ukwelapha ngokulandela imiyalelo yomkhiqizi. Ama-epoxy resins amaningi angagcwalisi kakhulu aphulukisa ekamelweni lokushisa, kodwa amanye angase adinge amazinga okushisa aphakeme ukuze alapheke ngokushesha.

 Ingabe Kukhona Imikhawulo Noma Izinselelo Ezihlotshaniswa Ne-Epoxy Underfill?

Yebo, kunemikhawulo nezinselelo ezihambisana nokungagcwaliswa kwe-epoxy. Eminye yemikhawulo evamile nezinselele yilezi:

Ukungafani kokwanda kwezinga lokushisa: I-Epoxy underfill ine-coefficient of thermal expansion (CTE) ehlukile ku-CTE yezingxenye ezisetshenziselwa ukugcwalisa. Lokhu kungabangela ukucindezeleka kokushisa futhi kungaholela ekuhlulekeni kwengxenye, ikakhulukazi ezindaweni ezinezinga lokushisa eliphezulu.

Ukucubungula izinselele: I-Epoxy igcwalisa kancane imishini yokucubungula namasu akhethekile, okuhlanganisa nokukhipha kanye nemishini yokwelapha. Uma kungenziwanga kahle, ukugcwalisa okuncane kungase kungagcwalisi kahle izikhala phakathi kwezingxenye noma kungase kubangele ukulimala ezingxenyeni.

Ukuzwela komswakama: I-epoxy underfill izwela umswakama futhi ingamunca umswakama endaweni. Lokhu kungabangela izinkinga ngokunamathela futhi kungaholela ekuhlulekeni kwengxenye.

Ukuhambisana kwamakhemikhali: I-Epoxy underfill ingasabela ngezinto ezithile ezisetshenziswa ezingxenyeni ze-elekthronikhi, njengamamaski e-solder, izinto zokunamathisela, nama-fluxes. Lokhu kungabangela izinkinga ngokunamathela futhi kungaholela ekuhlulekeni kwengxenye.

Izindleko: Ukugcwaliswa kwe-epoxy kungabiza kakhulu kunezinye izinto ezingagcwalisi, njengokugcwaliswa kwe-capillary. Lokhu kungenza zingabukeki kangako ukuze zisetshenziswe ezindaweni zokukhiqiza ezinevolumu ephezulu.

Okukhathazeka ngemvelo: I-Epoxy underfill ingaqukatha amakhemikhali ayingozi nezinto zokwakha, njenge-bisphenol A (BPA) nama-phthalates, okungabeka engcupheni impilo yomuntu kanye nemvelo. Abakhiqizi kumele bathathe izinyathelo ezifanele zokuqinisekisa ukuthi lezi zinto zokusetshenziswa ziphathwa ngokuphephile futhi zilahlwa.

 Isikhathi sokwelashwa: Ukungagcwalisi kahle kwe-epoxy kudinga isikhathi esithile ukuze kwelashwe ngaphambi kokuthi kusetshenziswe kuhlelo lokusebenza. Isikhathi sokwelapha singahluka kuye ngokwakhiwa okuthile kokugcwaliswa okuncane, kodwa ngokuvamile sisukela emaminithini ambalwa ukuya emahoreni ambalwa. Lokhu kunganciphisa inqubo yokukhiqiza futhi kwandise isikhathi sokukhiqiza sonke.

Nakuba i-epoxy underfill ihlinzeka ngezinzuzo eziningi, okuhlanganisa ukwethembeka okuthuthukisiwe nokuqina kwezingxenye ze-elekthronikhi, iphinde yethule izinselelo ezithile kanye nemikhawulo okufanele icatshangelwe ngokucophelela ngaphambi kokusetshenziswa.

Yiziphi Izinzuzo Zokusebenzisa I-Epoxy Underfill?

Nazi ezinye zezinzuzo zokusebenzisa i-epoxy underfill:

Isinyathelo 1: Ukwethenjelwa okwengeziwe

Enye yezinzuzo ezibaluleke kakhulu zokusebenzisa i-epoxy underfill ukwanda kokuthembeka. Izingxenye ze-elekthronikhi zisengozini yokulimala ngenxa yengcindezi eshisayo neyomshini, njengokuhamba ngebhayisikili okushisayo, ukudlidliza, nokushaqeka. I-Epoxy underfill isiza ukuvikela amalunga e-solder ezingxenyeni ze-elekthronikhi emonakalweni ngenxa yalezi zingcindezi, ezingakhuphula ukuthembeka nempilo yedivayisi ye-elekthronikhi.

Isinyathelo sesi-2: Ukusebenza okuthuthukisiwe

Ngokunciphisa ubungozi bokulimala ezingxenyeni ze-elekthronikhi, i-epoxy underfill ingasiza ukuthuthukisa ukusebenza kwedivayisi kukonke. Izingxenye ze-elekthronikhi ezingaqinisiwe kahle zingahlupheka ngenxa yokusebenza okuncishisiwe noma ukwehluleka ngokuphelele, futhi ukugcwaliswa kancane kwe-epoxy kungasiza ukuvimbela lezi zinkinga, okuholela kudivayisi ethembeke kakhudlwana futhi esebenza kahle kakhulu.

Isinyathelo sesi-3: Ukuphathwa okungcono kwe-thermal

I-Epoxy underfill ine-conductivity enhle kakhulu yokushisa, esiza ukukhipha ukushisa okuvela ezingxenyeni ze-elekthronikhi. Lokhu kungathuthukisa ukuphathwa kokushisa kwedivayisi futhi kuvimbele ukushisa ngokweqile. Ukushisa ngokweqile kungabangela ukulimala ezingxenyeni ze-elekthronikhi futhi kuholele ezinkingeni zokusebenza noma ngisho nokwehluleka okuphelele. Ngokuhlinzeka ngokuphatha okushisayo okusebenzayo, ukugcwaliswa ngaphansi kwe-epoxy kungavimbela lezi zinkinga futhi kuthuthukise ukusebenza okuphelele nempilo yedivayisi.

Isinyathelo sesi-4: Amandla emishini athuthukisiwe

I-Epoxy underfill inikeza ukwesekwa okwengeziwe kwemishini ezingxenyeni ze-elekthronikhi, ezingasiza ukuvimbela umonakalo ngenxa yokudlidliza noma ukushaqeka. Izingxenye ze-elekthronikhi ezingaqinisiwe ngokwanele zingabhekana nokucindezeleka kwemishini, okuholela ekulimaleni noma ekuhlulekeni okuphelele. I-Epoxy ingasiza ekuvimbeleni lezi zinkinga ngokunikeza amandla engeziwe emishini, okuholela kudivayisi ethembekile futhi ehlala isikhathi eside.

Isinyathelo sesi-5: Kwehlisiwe i-warpage

I-Epoxy underfill ingasiza ekunciphiseni i-warpage ye-PCB phakathi nenqubo yokudayiswa, okungaholela ekuthembekeni okuthuthukisiwe kanye nekhwalithi engcono yokuhlanganisa i-solder. I-warpage ye-PCB ingabangela izinkinga ngokuqondanisa kwezingxenye ze-elekthronikhi, okuholela ekukhubazekeni okuvamile kwe-solder okungabangela izinkinga zokuthembeka noma ukwehluleka okuphelele. I-Epoxy underfill ingasiza ekuvimbeleni lezi zinkinga ngokunciphisa i-warpage ngesikhathi sokukhiqiza.

Isetshenziswa Kanjani I-Epoxy Underfill Ekwenziweni Kwezogesi?

Nazi izinyathelo ezibandakanyekayo ekusebenziseni i-epoxy underfill ekukhiqizeni izinto zikagesi:

Ukulungiselela izingxenye: Izingxenye ze-elekthronikhi kufanele zakhelwe ngaphambi kokufaka i-epoxy underfill. Izingxenye ziyahlanzwa ukuze kukhishwe noma yikuphi ukungcola, uthuli, noma imfucumfucu engaphazamisa ukunamathela kwe-epoxy. Izingxenye zibe sezibekwa ku-PCB futhi zibanjwe kusetshenziswa ingcina yesikhashana.

Ukukhipha i-epoxy: I-epoxy underfill isakazwa ku-PCB kusetshenziswa umshini okhiphayo. Umshini wokukhipha ulinganisiwe ukuze ukhiphe i-epoxy ngenani eliqondile nendawo. I-epoxy isakazwa ngokuqhubekayo emaphethelweni engxenye. Ukusakaza kwe-epoxy kufanele kube yinde ngokwanele ukumboza lonke igebe phakathi kwe-elementi ne-PCB.

Ukusabalalisa i-epoxy: Ngemva kokuyikhipha, kufanele isakazwe ukuze kuvalwe igebe phakathi kwengxenye ne-PCB. Lokhu kungenziwa ngesandla usebenzisa ibhulashi elincane noma umshini wokusabalalisa ozenzakalelayo. I-epoxy idinga ukusatshalaliswa ngokulinganayo ngaphandle kokushiya noma iyiphi i-voids noma amabhamuza omoya.

Ukwelashwa kwe-epoxy: I-epoxy underfill bese ilungiswa ukuze iqine futhi yakhe isibopho esiqinile phakathi kwengxenye ne-PCB. Inqubo yokwelapha ingenziwa ngezindlela ezimbili: ezishisayo noma ze-UV. Ekwelapheni okushisayo, i-PCB ifakwa kuhhavini futhi ishiselwe ezingeni lokushisa elithile isikhathi esithile. Ekwelapheni kwe-UV, i-epoxy ivezwa ekukhanyeni kwe-ultraviolet ukuqalisa inqubo yokwelapha.

Ukuhlanza: Ngemuva kokuthi i-epoxy underfills iphulukisiwe, i-epoxy eyengeziwe ingasuswa kusetshenziswa i-scraper noma i-solvent. Kubalulekile ukususa noma iyiphi i-epoxy eyeqile ukuyivimbela ukuthi ingaphazamisi ukusebenza kwengxenye ye-elekthronikhi.

Yiziphi Ezinye Izicelo Ezijwayelekile Ze-Epoxy Underfill?

Nazi ezinye izinhlelo zokusebenza ezijwayelekile ze-epoxy underfill:

Ukupakishwa kweSemiconductor: I-Epoxy underfill isetshenziswa kakhulu ekupakishweni kwamadivayisi we-semiconductor, njengama-microprocessors, amasekethe ahlanganisiwe (ama-IC), namaphakheji we-flip-chip. Kulolu hlelo lokusebenza, i-epoxy underfill igcwalisa igebe phakathi kwe-chip ye-semiconductor ne-substrate, ihlinzeka ngokuqiniswa komshini kanye nokuthuthukisa ukuqhutshwa kwe-thermal ukuze kukhishwe ukushisa okukhiqizwa ngesikhathi sokusebenza.

Umhlangano webhodi lesifunda eliphrintiwe (PCB): Ukugcwaliswa ngaphansi kwe-epoxy kusetshenziswa emzimbeni wama-PCB ukuthuthukisa ukuthembeka kwamalunga e-solder. Isetshenziswa ngaphansi kwezingxenye ezifana ne-ball grid array (BGA) namadivayisi wephakheji lesikali se-chip (CSP) ngaphambi kokuphinda kufakwe i-solder. I-epoxy underfills igeleza ezikhaleni phakathi kwengxenye ne-PCB, yenza isibopho esiqinile esiza ukuvimbela ukwehluleka kwamalungu e-solder ngenxa yokucindezeleka kwemishini, njengokuhamba ngebhayisikili okushisayo kanye nokushaqeka/ukudlidliza.

I-Optoelectronics: I-Epoxy underfill iphinde isetshenziswe ekufakweni kwemishini ye-optoelectronic, njenge-light-emitting diode (ama-LED) nama-laser diode. Lawa madivayisi akhiqiza ukushisa ngesikhathi sokusebenza, futhi i-epoxy underfill isiza ukuqeda lokhu kushisa futhi ithuthukise ukusebenza okushisayo okuphelele kwedivayisi. Ukwengeza, i-epoxy underfill ihlinzeka ngokuqiniswa kwemishini ukuvikela izingxenye ze-optoelectronic ezintekenteke ekucindezelekeni kwemishini nasezicini zemvelo.

I-Automotive electronics: I-Epoxy underfill isetshenziswa ku-automotive electronics izinhlelo zokusebenza ezihlukahlukene, njengamayunithi okulawula injini (ECUs), amayunithi okulawula ukudlulisa (TCUs), nezinzwa. Lezi zingxenye ze-elekthronikhi zingaphansi kwezimo zemvelo ezinzima, okuhlanganisa amazinga okushisa aphezulu, umswakama, nokudlidliza. I-Epoxy underfill ivikela ngokumelene nalezi zimo, iqinisekisa ukusebenza okuthembekile nokuqina kwesikhathi eside.

I-Consumer electronics: I-Epoxy underfill isetshenziswa kumadivayisi ahlukahlukene kagesi abathengi, okuhlanganisa ama-smartphones, amaphilisi, amakhonsoli amageyimu, namadivayisi agqokekayo. Kuyasiza ukuthuthukisa ubuqotho bomshini nokusebenza okushisayo kwalawa madivayisi, iqinisekisa ukusebenza okuthembekile ngaphansi kwezimo ezihlukahlukene zokusetshenziswa.

I-Aerospace nokuzivikela: I-Epoxy underfill isetshenziswa kwi-aerospace nezinhlelo zokuvikela, lapho izingxenye ze-elekthronikhi kufanele zimelane nezimo ezibucayi, ezifana nezinga lokushisa eliphezulu, ukuphakama okuphezulu, nokudlidliza okukhulu. I-Epoxy underfill ihlinzeka ngokuzinza kwemishini kanye nokuphathwa okushisayo, okuyenza ifanelekele izindawo ezimazombezombe nezifunayo.

Yiziphi Izinqubo Zokwelapha Ze-Epoxy Underfill?

Inqubo yokwelapha ye-epoxy underfill ihlanganisa lezi zinyathelo ezilandelayo:

Ukusabalalisa: I-epoxy underfill ivamise kuhanjiswa njengento ewuketshezi ku-substrate noma ku-chip kusetshenziswa isikhipha impahla noma isistimu ye-jetting. I-epoxy isetshenziswa ngendlela eqondile ukumboza yonke indawo edinga ukugcwaliswa kancane.

I-Ecapsulation: Uma i-epoxy isikhishiwe, i-chip ivamise ukubekwa phezu kwe-substrate, futhi i-epoxy underfill igeleza izungeze nangaphansi kwe-chip, iyihlanganise. Impahla ye-epoxy iklanyelwe ukugeleza kalula futhi igcwalise izikhala phakathi kwe-chip ne-substrate ukuze kwakhiwe ungqimba olufanayo.

Ukwelashwa kwangaphambili: I-epoxy underfill ivamise ukuphulukiswa kusengaphambili noma yelashwe kancane ukuze ifane nejeli ngemva kokufakwa kwe-encapsulation. Lokhu kwenziwa ngokubeka umhlangano enqubweni yokwelapha esezingeni eliphansi lokushisa, njengokubhaka kuhhavini noma i-infrared (IR). Isinyathelo sokuphulukisa ngaphambili sisiza ukwehlisa i-epoxy's viscosity futhi siyivimbele ukuthi ingagelezi iphuma endaweni engagcwaliswa kahle ngesikhathi sezinyathelo zokuphulukisa ezilandelayo.

Ngemuva kokwelashwa: Uma ukugcwaliswa ngaphansi kwe-epoxy seselapheki kusengaphambili, umhlangano ungaphansi kwenqubo yokwelapha enezinga lokushisa eliphezulu, ngokuvamile kuhhavini we-convection noma ekamelweni lokuphulukisa. Lesi sinyathelo saziwa ngokuthi ukuphulukiswa kwangemuva noma ukuphulukiswa kokugcina, futhi senziwa ukuze kwelaphe ngokugcwele impahla ye-epoxy futhi kuzuzwe izici zayo eziphezulu zemishini nezokushisa. Isikhathi kanye nezinga lokushisa kwenqubo yangemva kokuphulukiswa kulawulwa ngokucophelela ukuze kuqinisekiswe ukuphulukiswa okuphelele kokugcwaliswa kwe-epoxy.

Ukupholisa: Ngemuva kwenqubo yokuphulukisa, umhlangano uvame ukuvunyelwa ukupholisa ekamelweni lokushisa kancane kancane. Ukupholisa okusheshayo kungabangela ukucindezeleka okushisayo futhi kuthinte ubuqotho bokungagcwali phansi kwe-epoxy, ngakho ukupholisa okulawulwayo kubalulekile ukuze kugwenywe noma yiziphi izinkinga ezingaba khona.

Ukuhlolwa: Uma ukugcwaliswa ngaphansi kwe-epoxy sekulapheke ngokugcwele, futhi ukuhlangana sekupholile, kuvame ukuhlolelwa noma yimaphi amaphutha noma i-voids kokokusebenza okungagcwalisi kancane. I-X-ray noma ezinye izindlela zokuhlola ezingabhubhisi zingase zisetshenziselwe ukuhlola ikhwalithi yokungagcwali phansi kwe-epoxy futhi kuqinisekiswe ukuthi ibophe i-chip ne-substrate ngokwanele.

Yiziphi Izinhlobo Ezihlukene Zezinto Zokugcwaliswa Ngaphansi Kwe-Epoxy Ezitholakalayo?

Izinhlobo eziningana zezinto zokugcwalisa i-epoxy underfill ziyatholakala, ngayinye inezici zayo nezici zayo. Ezinye zezinhlobo ezijwayelekile ze-epoxy underfill materials yilezi:

I-Capillary Underfill: Izinto ze-capillary underfill ziyizinhlayiya ze-epoxy ezine-viscosity ephansi ezigeleza ezikhaleni ezincane phakathi kwe-chip ye-semiconductor kanye ne-substrate yayo phakathi nenqubo yokungagcwalisi. Zenzelwe ukuthi zibe ne-viscosity ephansi, ezivumela ukuthi zigeleze kalula ezikhaleni ezincane ngokusebenzisa isenzo se-capillary, bese zelapha ukuze zenze into eqinile, ye-thermosetting ehlinzeka ngokuqiniswa komshini ekuhlanganiseni kwe-chip-substrate.

Ukungagcwalisi Okungagelezi Kwamanzi: Njengoba igama liphakamisa, izinto ezingagcwaliswanga ngaphansi kokugeleza azigelezi phakathi nenqubo yokugcwalisa kancane. Ngokuvamile akhiwa ngama-epoxy resins ane-viscosity ephezulu futhi asetshenziswa njenge-epoxy paste esakazwe ngaphambili noma ifilimu ku-substrate. Phakathi nenqubo yokuhlanganisa, i-chip ibekwe phezu kwe-no-flow underfill, futhi umhlangano ungaphansi kokushisa nokucindezela, okwenza i-epoxy iphulukise futhi yakhe into eqinile egcwalisa izikhala phakathi kwe-chip ne-substrate.

Ukugcwaliswa Ngaphansi Okubunjiwe: Izinto zokungagcwalisi ngaphansi ezibunjiwe zingama-epoxy resins abunjwe ngaphambili abekwe ku-substrate bese eshiselwa ukuze ageleze futhi amboze i-chip phakathi nenqubo yokungagcwalisi kahle. Ngokuvamile zisetshenziswa ezinhlelweni lapho ukukhiqizwa kwevolumu ephezulu kanye nokulawulwa okunembile kokubekwa kwezinto ezingagcwalisi kakhulu kuyadingeka.

I-Wafer-Level Underfill: Izinto zokugcwalisa okungaphansi kwezinga le-wafer ziyizinhlayiya ze-epoxy ezisetshenziswa kuyo yonke indawo eyisicwecwana ngaphambi kokuba ama-chips ngamanye ahlukaniswe. I-epoxy ibe isiyelapheka, yenze into eqinile enikeza ukuvikeleka kokungagcwali phansi kuwo wonke ama-chips ku-wafer. I-wafer-level underfill ngokuvamile isetshenziswa ezinqubweni zokupakisha zeleveli ye-wafer-level (WLP), lapho ama-chips amaningi ahlanganiswa ndawonye ku-wafer eyodwa ngaphambi kokuba ahlukaniswe abe amaphakheji ngamanye.

Ukugcwalisa Ngaphansi Kwe-Encapslant: Izinto zokugcwalisa okungaphansi kwe-encapsulant ziyizinhlayiya ze-epoxy ezisetshenziselwa ukuhlanganisa yonke i-chip ne-substrate, okwenza umgoqo wokuvikela ezungeze izingxenye. Ngokuvamile zisetshenziswa ezinhlelweni ezidinga amandla aphezulu okusebenza, ukuvikelwa kwemvelo, nokuthembeka okuthuthukisiwe.

Imithombo Ehlobene Mayelana Ne-Epoxy Adhesive Glue:

I-Epoxy Encapsulant

Izinamathiselo zeleveli ye-chip epoxy zigcwalisa ngaphansi

I-Epoxy Adhesive enezingxenye ezimbili

Ingxenye eyodwa ye-Epoxy Underfill Encapsulant

Izinga Lokushisa Eliphansi Ukwelapha I-BGA Flip Chip Ngaphansi Kokugcwalisa I-PCB Epoxy

I-Epoxy-Based Chip Underfill kanye nezinto ze-COB Encapsulation

I-Flip-Chip Futhi I-BGA Igcwalisa Inqubo Yeglue Enamathelayo Ye-Epoxy

Izinzuzo kanye Nezicelo Ze-Underfill Epoxy Encapsulants Ku-Electronics

Ungayisebenzisa kanjani i-smt underfill epoxy adhesive ezinhlelweni ezahlukahlukene

Izixazululo ezihamba phambili ze-bga ezigcwele i-epoxy adhesive glue yokusebenza okuhle kakhulu kwengxenye ye-SMT

ISIQINISEKISO ESIPHEZULU
I-Deepmaterial izimisele ngokuba umholi embonini ye-electronic underfill epoxy, ikhwalithi isiko lethu!

INTENGO YOMTHETHO WONKE
Sithembisa ukuvumela amakhasimende ukuthi athole imikhiqizo yokunamathisela epoxy engabizi kakhulu

ABAKHIQIZI ABANGCWEPHESHE
Nge-electronic underfill epoxy adhesive as the core, ehlanganisa iziteshi nobuchwepheshe

ISIQINISEKISO ESINOKUTHEMBEKA NGENKONZO
Nikeza ngezinamathiselo ze-epoxy i-OEM, i-ODM, i-MOQ engu-1. Isethi Egcwele Yesitifiketi