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Abathengi banamuhla bafuna amadivaysi amancane, ukusebenza okwengeziwe, ukwethembeka okuvelele futhi, yiqiniso, izindleko eziphansi. Njengoba izimfuno zemakethe ye-semiconductor zikhula unyaka nonyaka, i-DeepMaterial inephothifoliyo ephelele ye-die attach, i-underfill, i-encapsulant, ne-adhesives ekhethekile nemikhiqizo yokuhlanganisa cishe yanoma iyiphi iphakheji ethuthukisiwe nanoma yiluphi uhlelo lokusebenza oluhlanganisa i-Flip Chip, i-Wafer Level Packaging kanye ne-Memory 3D TSV. Ukupakisha.

Ngekhompyutha yeselula neyefu, inkumbulo kanye nezinhlelo zokusiza abashayeli ezithuthukisiwe ezisekela isidingo sokuncishiswa kwesici sefomu, ukuhlanganiswa kwezinga lesistimu, ukusebenza kwezinga lebhodi, ukwethembeka okukhuphukile kanye nezixazululo zezindleko eziphansi, i-miniaturization isiphenduke umnyombo wemakethe ye-electronics. Ngokuphendula ukuminyana okuphezulu ezingeni lebhodi i-DeepMaterial ingumholi wezinto ezinamathelayo ezivumela imiklamo yephakheji emisha, ubuchwepheshe obusha obuxhumene nokuphathwa kwedatha okwengeziwe. Uma kukhulunywa ngezinto ezintsha ezihamba phambili emakethe exhumene ethuthukile, i-DeepMaterial iyisinqumo esihamba phambili.

I-DeepMaterial iyi-polyurethane esebenzayo ye-PUR eshisayo encibilika encibilika umakhi kanye nomphakeli, ikhiqiza ingxenye eyodwa yokunamathela e-epoxy underfill, ingcina yeglue encibilikayo eshisayo, ingcina ye-uv yokwelapha, inkomba ephezulu ye-refractive optical adhesive, ingcina kazibuthe enamathelayo, ingcina yensimbi engcono kakhulu engangeni manzi epulasitiki kanye nengilazi, ingcina ye-elekthronikhi yemoto kagesi kanye nama-micro motors entweni yasekhaya