Izingxenye Zesakhiwo Selensi Ukubopha I-PUR Glue
Amandla Okubambisana Okuphezulu
High Creep Resistance
Izidingo
Ukuhlangana kwezingxenye zesakhiwo selensi kudinga ungqimba oluhle lokunamathela, amandla okubopha okuphezulu, ukuma okusheshayo, nomswakama ophezulu, izinga lokushisa eliphezulu kanye nokucindezela okukhulu kwangaphandle kwezingxenye zokubopha.
Isixazululo
Ingcina ye-DeepMaterial PUR hot-melt ingasetshenziswa ezikhathini lapho kudingeka khona ukuma ngokushesha, futhi izingxenye zokunamathela zidinga ukumelana nomswakama ophezulu, izinga lokushisa eliphezulu kanye nokucindezela okukhulu kwangaphandle.
1. Okuqukethwe okuqinile okungu-100%, okukodwa, okungancibiliki, okunganuki, okunamathelayo okuhambisana nemvelo.
2. Ukunamathela okuphezulu kokuqala, ukumelana nokukhuphuka okuphezulu, amandla okubopha okuphezulu nokuguquguquka okuhle.
3. Umswakama wokushisa wegumbi uphulukisa ngokushesha futhi ayithinti inqubo elandelayo.
4. Ukushisa okuphansi kwe-gluing ngeke kubangele ukulimala ezingxenyeni.
5. Ngemuva kokuphulukisa, inokufakwa uphawu okuhle kokuvala, ukumelana nokushisa okuhle, ukumelana ne-solvent, ukumelana nokushisa okuphezulu nokuphansi, ukumelana kwamanzi okuhle, njll.
I-DeepMaterial PUR ingcina encibilika eshisayo, ngaphezu kokusetshenziswa njenge-adhesive lens, inezinhlobonhlobo zezinhlelo zokusebenza. Izinhlelo zokusebenza ezijwayelekile ziyimingcele emincane yomakhalekhukhwini kanye nemingcele yekhompyutha yethebhulethi.
I-Deepmaterial iphezulu refractive index optical adhesive glue abahlinzeki kanye low refractive index resin polymers epoxy adhesives glue umkhiqizi, ingcina engcono kakhulu yekhamera yokuphepha, uhlinzeka nge-double function optical epoxy adhesive sealant glue for vcm camera module & touch sensor assembly,active alignment camera module assembly kanye nepcb. umhlangano wekhamera kunqubo yokukhiqiza ikhamera
