Chip Ngaphantsi / Ukupakishwa
Inkqubo yokwenziwa kweChip usetyenziso lweeMveliso ezincamathelayo ze-DeepMaterial
Ukupakishwa kweSemiconductor
Itekhnoloji ye-Semiconductor, ngakumbi ukupakishwa kwezixhobo ze-semiconductor, ayizange ichukumise izicelo ezingaphezulu kunanamhlanje. Njengoko yonke inkalo yobomi bemihla ngemihla iba yedijithali-ukusuka kwiimoto ukuya kukhuseleko lwasekhaya ukuya kwii-smartphones kunye nesiseko se-5G-i-semiconductor yokupakisha izinto ezintsha ezisentliziyweni yokuphendula, ethembekileyo, kunye namandla anamandla e-elektroniki.
Iiwafers ezibhityileyo, imilinganiselo emincinci, iipakethi ezicolekileyo, ukuhlanganiswa kwephakheji, uyilo lwe-3D, itekhnoloji yenqanaba le-wafer kunye noqoqosho lwesikali kwimveliso yobuninzi ifuna imathiriyeli enokuxhasa amabhongo okuvelisa izinto ezintsha. Indlela yezisombululo ezipheleleyo zikaHenkel zonyusa izibonelelo ezininzi zehlabathi ukuhambisa itekhnoloji ephezulu yokupakisha i-semiconductor kunye nokusebenza okukhuphisanayo. Ukusuka kwizincamathelisi zokuncamathelisa ukupakishwa kocingo lwemveli ukuya kwii-underfill eziphambili kunye ne-encapsulants kwizicelo zokupakisha ezihambele phambili, iHenkel ibonelela ngetekhnoloji yezixhobo ze-cutting-edge kunye nenkxaso yehlabathi efunwa ziinkampani eziphambili ze-microelectronics.
Flip Chip Ngaphantsi
Ukuzaliswa ngaphantsi kusetyenziselwa uzinzo lomatshini we-flip chip. Oku kubaluleke ngakumbi xa ukuthengiswa kwegridi yebhola (BGA) chips. Ukunciphisa i-coefficient yokwandiswa kwe-thermal (CTE), i-adhesive igcwele i-nanofillers.
I-Adhesives esetyenziswa njenge-chip underfill ineempawu zokuhamba kwe-capillary ukuze zisetyenziswe ngokukhawuleza kwaye kulula. I-adhesive ye-double-adhesive idla ngokusetyenziswa: iindawo ezinqamlekileyo zibanjwe ngokunyangwa kwe-UV ngaphambi kokuba iindawo ezinomthunzi ziphiliswe nge-thermal.
I-Deepmaterial lubushushu obuphantsi bokunyanga i-bga flip chip underfill pcb epoxy process encamathelayo umenzi weglu yezinto eziphathekayo kunye nabanikezeli bezinto zokugquma ubushushu obungangeni, babonelele ngecandelo elinye leepoxy underfill ikhompawundi, i-epoxy underfill encapsulant, underfill encapsulation materials for flip chip in pcpoxy electronic circuit board isiseko se-chip underfill kunye ne-cob encapsulation materials njalo njalo.
