I-Adhesive yesakhiwo

I-DeepMaterial, njengomvelisi wokuncamathelisa we-epoxy kwimizi-mveliso, siphulukana nophando malunga nokuzaliswa ngaphantsi kwe-epoxy, iglu engaqhubekiyo kwizinto zombane, i-epoxy engaqhubekiyo, izinto zokuncamathelisa kwindibano ye-elektroniki, i-adhesive engagcwalisiyo, i-refractive index epoxy. Ngokusekwe kuloo nto, sinetekhnoloji yamva nje yokuncamathelisa kwi-industrial epoxy.

I-DeepMaterial iphuhlise izinto zokuncamathelisa kwimizi-mveliso yokupakishwa kwetshiphu kunye novavanyo, izinto zokuncamathelisa kwinqanaba lebhodi yesekethe, kunye nokuncamatheliswa kweemveliso zombane. Ngokusekwe kwizinto ezincamathelayo, iye yaphuhlisa iifilimu ezikhuselayo, izihluzi zesemiconductor, kunye nezixhobo zokupakisha zokusetyenzwa kwe-wafer semiconductor kunye nokupakishwa kwechip kunye novavanyo.

Ukubonelela ngezinto zokuncamathelisa zombane kunye nefilimu ecekethekileyo yeemveliso zezixhobo zombane kunye nezisombululo kwiinkampani zonxibelelwano, iinkampani ze-elektroniki zabathengi, iinkampani zokupakisha ze-semiconductor kunye nokuvavanya, kunye nabavelisi bezixhobo zonxibelelwano, ukusombulula aba bathengi bakhankanywe ngasentla ekukhuseleni inkqubo, imveliso echanekileyo ephezulu. , kunye nokusebenza kombane.

I-DeepMaterial ibonelela ngeentlobo ezahlukeneyo zeemveliso malunga nokuncamatheliswa kweshishini lombane, i-UV ephilisa i-UV encamathelayo, uhlobo olusebenzayo lokuncamathelisa okutshisayo okunyibilikayo kunye noxinzelelo olubuthathaka lokuncamathela okunyibilikayo, i-epoxy-based chip underfill kunye ne-COB encapsulation series, ibhodi yokukhusela ibhodi yesekethe kunye ne-conformal coating ancamatheliswayo. series, epoxy based conductive silver adhesive series, structural bonding adhesive series, functional ekhuselayo film series, semiconductor ekhuselayo series film.