I-Epoxy Underfill
I-DeepMaterial, njengomvelisi wokuncamathelisa we-epoxy kwimizi-mveliso, siphulukana nophando malunga nokuzaliswa ngaphantsi kwe-epoxy, iglu engaqhubekiyo kwizinto zombane, i-epoxy engaqhubekiyo, izinto zokuncamathelisa kwindibano ye-elektroniki, i-adhesive engagcwalisiyo, i-refractive index epoxy. Ngokusekwe kuloo nto, sinetekhnoloji yamva nje yokuncamathelisa kwi-industrial epoxy.
I-DeepMaterial iphuhlise izinto zokuncamathelisa kwimizi-mveliso yokupakishwa kwetshiphu kunye novavanyo, izinto zokuncamathelisa kwinqanaba lebhodi yesekethe, kunye nokuncamatheliswa kweemveliso zombane. Ngokusekwe kwizinto ezincamathelayo, iye yaphuhlisa iifilimu ezikhuselayo, izihluzi zesemiconductor, kunye nezixhobo zokupakisha zokusetyenzwa kwe-wafer semiconductor kunye nokupakishwa kwechip kunye novavanyo.
Ukubonelela ngezinto zokuncamathelisa zombane kunye nefilimu ecekethekileyo yeemveliso zezixhobo zombane kunye nezisombululo kwiinkampani zonxibelelwano, iinkampani ze-elektroniki zabathengi, iinkampani zokupakisha ze-semiconductor kunye nokuvavanya, kunye nabavelisi bezixhobo zonxibelelwano, ukusombulula aba bathengi bakhankanywe ngasentla ekukhuseleni inkqubo, imveliso echanekileyo ephezulu. , kunye nokusebenza kombane.
I-DeepMaterial ibonelela ngeentlobo ezahlukeneyo zeemveliso malunga nokuncamatheliswa kweshishini lombane, i-UV ephilisa i-UV encamathelayo, uhlobo olusebenzayo lokuncamathelisa okutshisayo okunyibilikayo kunye noxinzelelo olubuthathaka lokuncamathela okunyibilikayo, i-epoxy-based chip underfill kunye ne-COB encapsulation series, ibhodi yokukhusela ibhodi yesekethe kunye ne-conformal coating ancamatheliswayo. series, epoxy based conductive silver adhesive series, structural bonding adhesive series, functional ekhuselayo film series, semiconductor ekhuselayo series film.
I-DeepMaterial yeyona nxalenye ye-epoxy underfill encapsulants encapsulants inkampani e-China, unikezelo ngenxalenye yokuzaliswa kwe-epoxy ye-flip chip izixhobo ibhola igridi yokupakisha isikali sokupakishwa kwe-csp bga wcsp lga, ukunyangwa kobushushu obuphantsi bga flip chip underfill pcb epoxy inkqubo yokuncamathelisa iglu epoxy, intlama encamathelayo sealant glue for underfill pcb electronic components,semiconductor encamathelayo kwindibano electronic. kwaye nangokunjalo