I-potting electronics pcb ene-epoxy potting compound kunye ne-epoxy resin conformal coating Iindibano zombane kufuneka zikhuselwe kuluhlu olubanzi lwezinto, ezifana ne-corrosive agents, ukuchithwa kwe-thermal, ukothuka, kunye nokungcangcazela. Ukhuseleko lufumaneka xa sisenza imbiza. Le nkqubo ibandakanya ukuzalisa iindibano zombane ngeekhompawundi...
ISilicone Potting Compound VS Epoxy Potting Compound-Yeyiphi Engcono? Ukubumba kukugcwalisa okanye ukubethelela iindibano ze-elektroniki okanye izinto ezinentlaka kwindawo ebiyelweyo ukuzigcina zikhuselekile kwiingozi. Ukuzinzisa kungenziwa ngokuyinxenye okanye ngokupheleleyo, ngokuxhomekeke kumanqanaba okhuseleko afunekayo kwi...
Ngaba ukubumba i-epoxy resin kwi-electronics lukhetho olulungileyo ukusuka kubenzi bee-epoxy? Ukubumba kubhekisa kwinkqubo yokuzalisa indibano yombane usebenzisa ikhompawundi ukunceda ukuxhathisa ukungcangcazela kunye nokothuka. Ikwayenzelwe ukukhuphela ngaphandle umhlwa kunye nokufuma. Xa isicelo siyilwa, kwaye kukho...
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