I-Potting Material ye-Electronics kunye nendlela yokukhetha eyona Potting ingcono inokuchazwa njengenkqubo yokuzalisa indibano ye-electronics kunye nesiqina sokuphucula amanqanaba ayo okumelana. Ikwaziwa njengokuzinzisa kwaye yenza amacandelo kunye neendibano zixhathise ukungcangcazela, ukothuka, izinto ezitshabalalisayo, iikhemikhali, amanzi, kunye...
Izinto ekufuneka ziqwalaselwe xa kugaywa i-Electronics nge-epoxy kunye nezinye izixhobo zokubumba Ukubunjwa kubandakanya ukuntywila iindibano ze-elektroniki kwizinto ezihlanganisiweyo, zonke zizisebenzisa kwiindawo ezikhethiweyo. Ukubunjwa kwembiza kunika ukhuseleko ngokuchasene nokungcangcazela, ukothuka, ukufuma, kunye neearhente ezitshabalalisayo, phakathi kwezinye iingozi. I-Epoxy yenye yezinto eziphambili ezisetyenziswa kule ndlela, ...
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