Ipakeji ye-BGA yokuzaliswa ngaphantsi kwe-Epoxy
Ulwelo oluPhezulu
Ukucoceka okuphezulu
mngeni
Iimveliso ze-elektroniki ze-aerospace kunye nokuhamba, iimoto, iimoto, ukukhanya kwe-LED yangaphandle, amandla elanga kunye namashishini omkhosi aneemfuno eziphezulu zokuthembeka, izixhobo ze-solder zebhola (i-BGA / CSP / WLP / POP) kunye nezixhobo ezikhethekileyo kwiibhodi zeesekethe zonke zijongene ne-microelectronics. Umkhwa we-miniaturization, kunye ne-PCB ezibhityileyo ezinobunzima obungaphantsi kwe-1.0mm okanye i-flexible high-density assembly substrates, i-solder joints phakathi kwezixhobo kunye ne-substrates ziba buthathaka phantsi koxinzelelo lomatshini kunye nobushushu.
izisombululo
Ukupakishwa kwe-BGA, i-DeepMaterial ibonelela ngesisombululo senkqubo yokungagcwaliswa - innovative capillary flow underfill. I-filler isasazwa kwaye isetyenziswe kumda wesixhobo esidibeneyo, kwaye "i-capillary effect" ye-liquid isetyenziselwa ukwenza i-glue ingene kwaye igcwalise i-bottom ye-chip, kwaye emva koko ishushu ukuze idibanise i-filler kunye ne-chip substrate; amalungu e-solder kunye ne-PCB substrate.
DeepMaterial underfill inkqubo inzuzo
1. Ukunyibilika okuphezulu, ukucoceka okuphezulu, icandelo elinye, ukuzaliswa ngokukhawuleza kunye nokukwazi ukunyanga okukhawulezileyo kwamacandelo abukhali kakhulu;
2. Iyakwazi ukwenza i-uniform kunye ne-void-free-free-filling layer, enokuphelisa uxinzelelo olubangelwa yi-welding material, ukuphucula ukuthembeka kunye neempawu zomatshini zamacandelo, kunye nokubonelela ngokukhuselekileyo kweemveliso ekuweni, ukujija, ukungcangcazela, ukufuma. , njl.
3. Inkqubo inokulungiswa, kwaye ibhodi yesekethe ingaphinda isetyenziswe, egcina kakhulu iindleko.
I-Deepmaterial lubushushu obuphantsi bokunyanga i-bga flip chip underfill pcb epoxy process encamathelayo umenzi weglu yezinto eziphathekayo kunye nabanikezeli bezinto zokugquma ubushushu obungangeni, babonelele ngecandelo elinye leepoxy underfill ikhompawundi, i-epoxy underfill encapsulant, underfill encapsulation materials for flip chip in pcpoxy electronic circuit board isiseko se-chip underfill kunye ne-cob encapsulation materials njalo njalo.
