Isicelo seNdibano yeModyuli yeKhamera yeeMveliso ezincamathelayo zemodyuli yeCamera ye-DeepMaterial
Kwinkalo yezobuchwephesha, izinto zokuncamathelisa zisetyenziswa ngokukodwa kwiselfowuni kunye neemodyuli zekhamera ye-smartphone. Oku kuquka ukudityaniswa kwezixhobo zomntu ngamnye-ezifana ne-lens-to-lens mount okanye i-lens mount-to-camera sensor-, ukukhusela i-chips zekhamera kwiibhodi zesekethe (ukufa unamathele), usebenzisa i-adhesive njenge-chip underfill, i-Low pass bond isihluzo kunye neglue. imodyuli yekhamera edityanisiweyo kwizindlu zesixhobo.
Izinto ezincamathelayo ezikhethekileyo zenza udibaniso oluchanekileyo kunye nokudityaniswa okuzinzileyo kweemodyuli ezincinci zekhamera. I-adhesive esetyenzisiweyo ifanelekile kwimveliso yobuninzi beemodyuli zekhamera kwaye iphilisa ngokukhawuleza kumaqondo aphantsi.
IiAdhesives zeNdibano zeModyuli yeKhamera
Iimodyuli zekhamera zisetyenziswa kakhulu kwizixhobo ezisingqongileyo. Ukunyuka kweemfuno zabathengi zokhuseleko kuye kwaqhuba imfuno yokuphuhliswa kweenkqubo zokuncedisa abaqhubi (ADAS) kwizithuthi. Ii-smartphones zifudukela kwiinkqubo ezimbini, ezintathu okanye ezine zekhamera kwisixhobo esinye ukubonelela ngeempawu zomsebenzisi ebezifikeleleka kuphela ngezixhobo zokufota ezikumgangatho ophezulu. Ukwanda kwezixhobo zasekhaya ezihlakaniphile kuye kwazisa iikhamera ezininzi kubomi bethu-iingcango ezikrelekrele, iinkqubo zokhuseleko, ii-hubs zasekhaya kunye nezixhobo zokuphatha inja ngoku zifaka iikhamera zokusasaza bukhoma. Ngenxa yesidingo sokuqhubeka nokwenza izinto ezincinci zekhamera kunye nokuphucula ukuthembeka, abavelisi bemodyuli yekhamera baya ngokuya befuna izixhobo zokuhlanganisa. Ipotfoliyo kaChemence yeUV kunye nezinto ezincamathelayo ezimbini ziyilelwe ukuhlangabezana neemfuno zabavelisi kuninzi lwezicelo, kubandakanywa ukomelezwa kweFPC, ukubotshwa kwesivamvo somfanekiso, i-IR yokucoca isihluzo, ukubonda iilensi kunye nokuxhonywa kwelensi yombhobho, indibano yeVCM kunye nokulungelelaniswa okuSebenzayo.
Ulungelelwaniso olusebenzayo
Isidingo sokubonelela ngezakhono zemifanekiso ekumgangatho ophezulu ifuna ngokuchanekileyo kwaye ithembekile ukubekwa kwemodyuli yekhamera kunye nezisombululo zokulungiswa. Incamathelisa encamathelayo kabini yonyango yolungelelwaniso olusebenzayo. I-UV yethu kunye nezinto ezincamathelayo zokunyanga ubushushu zibonelela ngokusasaza ngokulula, ukusetwa ngokukhawuleza okukhulu kunye nonyango oluthembekileyo lobushushu kwiindawo ezinomthunzi. Imveliso nganye yokulungelelanisa esebenzayo ibonelela ngokugqwesa ngokugqwesileyo kwi-substrates ebalulekileyo kunye neempawu eziphantsi kakhulu zokukhupha kunye ne-shrinkage, ukuqinisekisa ukuthembeka kwecandelo elide.
Ukudibanisa iLens
Ukudityaniswa kweLens kunye ne-lens barrel bonding kufuna izinto zokuncamathelisa ezineempawu ezikhethekileyo zokusebenza. Ama-substrates achanekileyo achaza ukuba ukulungiswa kweqondo lokushisa eliphantsi kubalulekile ukunciphisa ukuphazamiseka kwe-substrate. Ukongezelela, i-index ephezulu ye-thixotropic kunye ne-low outgassing ibaluleke kakhulu ukuqinisekisa ukuba i-adhesive ayifuduki kwiindawo ezingafunekiyo kwaye ingcolise amacandelo. Ukongeza ekuboneleleni ngokuncamathela okugqwesileyo kwii-substrates ezifana ne-LCP kunye ne-PA kunye nokufunxeka okothusayo okwandisiweyo kunye nokumelana nefuthe, i-Deepmaterial lens bonding adhesives nazo ziyahlangabezana nezi mfuno zokusebenza.
FPC Ruggedization
Iimodyuli zekhamera zihlala ziqhagamshelwe kwindibano yazo yokugqibela nge-flexible printed circuit (FPC). Ukongeza kokugqwesa ukuxhathisa i-peel, ukuguquguquka, kunye nokunganyangeki kwamanzi, i-Deepmaterial i-UV-ancamatheliyo enyangekayo ibonelela ngokugqwesileyo kwi-FPC substrates ezifana ne-polyimide kunye ne-polyester.
I-DeepMaterial sisalathiso esiphakamileyo esincamathelayo esincamathelayo esincamathelayo kunye ne-refractive index resin polymers epoxy adhesives glue umenzi, eyona inncamatheliswayo yekhamera yokhuseleko, ibonelela ngezinto ezimbini epoxy adhesive sealant glue kwimodyuli yekhamera ye-vcm kunye nendibano yesivamvo sokuchukumisa, imodyuli yolungelelwaniso olusebenzayo lwemodyuli yekhamera kunye nepcb. indibano yekhamera kwinkqubo yokuvelisa ikhamera
