I-Epoxy Encapsulant

Imveliso inokumelana nemozulu ebalaseleyo kwaye ikwazi ukuziqhelanisa nendalo. Ukusebenza okugqwesileyo kokufakelwa kombane, kunokuphepha ukusabela phakathi kwamacandelo kunye nemigca, i-repellent ekhethekileyo yamanzi, inokuthintela amacandelo ukuba achaphazeleke ngumswakama kunye nomswakama, ubuchule obuhle bokutshatyalaliswa kobushushu, kunokunciphisa ubushushu bezinto zombane ezisebenzayo, kunye nokwandisa ubomi benkonzo.

inkcazelo

Imigaqo yokucaciswa kweMveliso

imveliso

imodeli

imveliso

igama

umbala UMbane oQhelekileyo

Viscosity (cps)

Ukuphilisa ixesha ukusebenzisa Umahluko
I-DM-6016E I-epoxy potting adhesive Mnyama 58000 ~ 62000 @ 150℃ 20min PCB ibhodi ufaka ezibuthathaka, transistors, smart card IC

ukupakishwa kwekhadi

Ngezicelo apho iimpawu zokuphatha ezibalaseleyo zifuneka. Izinto ezinyangwayo zikhona ngenxa yokothuka kakhulu kwe-thermal kwaye zibonelela ngokuxhathisa ubushushu obuqhubekayo ukuya kuma-177°C. Ngokukodwa ilungele ukupakishwa kwe-transistors kunye ne-semiconductors efanayo, ingasetyenziselwa ukupakishwa kweesekethe ezidibeneyo zewotshi, i-adhesive encapsulation adhesive, kwibhodi ye-PCB efakelweyo, i-transistors, i-smart card ye-IC yokupakisha ikhadi.
I-DM-6058E I-epoxy potting adhesive Mnyama 50,000 @ 120℃ 12min Ukupakishwa kwe

sensors kunye

ngokuchanekileyo

amacandelo

Le mveliso ibonelela ngokugqwesileyo kokusingqongileyo kunye nokukhuselwa kwe-thermal kumacandelo okupakisha, kwaye ifaneleke ngokukodwa ukukhuselwa kweenzwa kunye namacandelo achanekileyo asetyenziswa kwiindawo ezinzima ezifana neemoto.
I-DM-6061E I-epoxy potting adhesive Mnyama 32500 ~ 50000 @ 140°C 3H PCB ibhodi ufaka ezibuthathaka, transistors, smart card IC

ukupakishwa kwekhadi

Component encapsulation glue, esetyenziselwa ukupakishwa ebuthathaka iiplagi PCB iibhodi, viscosity ebalaseleyo uzinzo, lula ukulawula ubukhulu iglu. Emva kokudlula i-1000H yokuvavanya ubushushu / ukufuma / ukutenxa kunye nomjikelo we-thermal ukuya kwi-125 ℃. I-viscosity ekhethekileyo ezinzile kwi-25 ° C inika ubungakanani obulawulwa ngokulula usebenzisa izixhobo eziqhelekileyo zexesha / uxinzelelo.
I-DM-6086E I-epoxy potting adhesive Mnyama 62500 @ 120℃ 30min 150℃ 15min I-IC kunye ne-Semiconductor Packaging Isetyenziswa kwizicelo ezifuna iimpawu zokuphatha ezigqwesileyo. Kwipakethe ye-IC kunye ne-semiconductor enesakhono esilungileyo somjikelo wobushushu, imathiriyeli inokumelana nokothuka kwe-thermal ngokuqhubekayo ukuya kuthi ga kwi-177 ° C.

Iziphumo zomkhiqizo
· Ibonelela ngokhuseleko oluphezulu lokusingqongileyo kunye nobushushu
· Uzinzo olugqwesileyo lwe-viscosity, kulula ukulawula ubungakanani bokuhambisa
· Ukukwazi ukukhwela ibhayisekile eshushu, imathiriyeli inokumelana nokothuka kwe-thermal ukuya kuthi ga kwi-177°C ngokuqhubekayo
· Ngezicelo ezifuna ukusebenza okuphezulu

Mveliso Inzuzo
Imveliso yi-epoxy resin encapsulant, efanelekileyo kwizicelo ezifuna iimpawu zokuphatha kakuhle. Component encapsulation glue, esetyenziselwa PCB board ebuthathaka ukupakishwa iplagi-in, ebalaseleyo uzinzo viscosity, lula ukulawula ubukhulu iglu. I-epoxy resin encapsulants yenzelwe izicelo ezifuna iimpawu zokuphatha ezigqwesileyo. Isetyenziselwa ukupakishwa kwe-IC kunye ne-semiconductor, inamandla omjikelezo wokushisa, kwaye izinto eziphathekayo ziyakwazi ukumelana nokutshatyalaliswa kwe-thermal ngokuqhubekayo ukuya kwi-177 ° C.