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5. Ifilimu yoKhuseleko yeSemiconductor

Ifilimu yoKhuseleko yeSemiconductor

Ukwenziwa kwesixhobo seSemiconductor kuqala ngokufakwa kweefilimu ezibhityile kakhulu zemathiriyeli kwii-silicone wafers. Ezi filimu zifakwa umaleko weathom enye ngexesha kusetyenziswa inkqubo ebizwa ngokuba yi-vapor deposition. Imilinganiselo echanekileyo yezi bhanyabhanya zibhityileyo kunye neemeko ezisetyenzisiweyo ukuzidala zisiba baluleke ngakumbi njengoko izixhobo ze-semiconductor ezifana nezo zifumaneka kwiichips zekhompyuter ziyancipha. I-DeepMaterial isebenzisana nababoneleli beekhemikhali, abavelisi bezixhobo zenkqubo yokubeka kunye nabanye kushishino ukuphuhlisa ifilimu ecekethekileyo yokubeka iliso yokubeka iliso kunye nesikimu sokuhlalutya idatha esibonelela ngombono ophuculwe kakhulu weenkqubo kunye neekhemikhali ezenza ezi filimu ziphezulu.

I-DeepMaterial ibonelela eli shishini ngomlinganiselo obalulekileyo kunye nezixhobo zedatha ezinceda ukuchonga iimeko ezifanelekileyo zokuvelisa. Ukukhula komphunga obhityileyo kuxhomekeke kunikezelo olulawulwayo lwezandulela zeekhemikhali kumphezulu we-silicon wafer.

Abavelisi bezixhobo ze-Semiconductor basebenzisa iindlela zokulinganisa i-DeepMaterial kunye nohlalutyo lwedatha ukuphucula iinkqubo zabo zokukhula kwefilimu yokubeka umphunga. Umzekelo, i-DeepMaterial iphuhlise inkqubo yamehlo ebeka iliso ekukhuleni kwefilimu ngexesha lokwenyani, enovakalelo oluphezulu kakhulu xa kuthelekiswa neendlela zemveli. Ngeenkqubo ezingcono zokubeka iliso, abavelisi be-semiconductor banokuphonononga ngokuzithemba ngakumbi ukusetyenziswa kweekhemikhali zangaphambili zemichiza kunye nendlela iileya zeefilimu ezahlukeneyo ezisabelana ngayo. Isiphumo singcono "iindlela zokupheka" zeefilimu ezineempawu ezifanelekileyo.