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  5. I-Epoxy-Based Chip Underfill kunye ne-COB Encapsulation Materials

I-Epoxy-Based Chip Underfill kunye ne-COB Encapsulation Materials

I-DeepMaterial inikezela nge-capillary flow underfills entsha kwi-flip chip, i-CSP kunye nezixhobo ze-BGA. I-DeepMaterial entsha ye-capillary flow flow underfill i-fluidity ephezulu, i-high-purity, i-component-component potting materials eyenza i-uniform, i-void-free underfill layers ephucula ukuthembeka kunye neempawu ze-mechanical zamacandelo ngokuphelisa uxinzelelo olubangelwa yi-solder materials. I-DeepMaterial ibonelela ngemixube yokuzaliswa ngokukhawuleza kweendawo ezintle kakhulu, ukukwazi ukunyanga ngokukhawuleza, ukusebenza ixesha elide kunye nobomi, kunye nokusebenza kwakhona. Ukuphinda kusetyenzwe kwakhona konga iindleko ngokuvumela ukususwa kokugcwalisa ukuze kuphinde kusetyenziswe ibhodi.

Indibano ye-Flip chip ifuna ukukhululeka koxinzelelo lwe-welding seam kwakhona ukuguga okwandisiweyo kunye nobomi bomjikelezo. I-CSP okanye indibano ye-BGA ifuna ukusetyenziswa kokungagcwaliswa kakuhle ukuze kuphuculwe ingqibelelo yomatshini wendibano ngexesha le-flex, i-vibration okanye uvavanyo lokulahla.

I-DeepMaterial's flip-chip underfills inomxholo ophezulu wokuzalisa ngelixa igcina ukuhamba okukhawulezayo kwiipatshi ezincinci, kunye nokukwazi ukuba nobushushu obuphezulu beglasi kunye nemodyuli ephezulu. Ukuzaliswa ngaphantsi kwe-CSP yethu kufumaneka kumanqanaba ahlukeneyo okuzalisa, akhethelwe ubushushu beglasi yokutshintsha kunye nemodyuli yesicelo esicetywayo.

I-COB encapsulant ingasetyenziselwa ukudibanisa ucingo ukubonelela ukhuseleko lokusingqongileyo kunye nokwandisa amandla omatshini. Ukutywinwa okukhuselekileyo kwee-chips eziboshwe ngocingo kubandakanya i-encapsulation ephezulu, i-cofferdam, kunye nokuzaliswa kwesithuba. Izincamathelisi ezinomsebenzi wokuqukuqela ocoliweyo ziyafuneka, kuba amandla azo okuhamba kufuneka aqinisekise ukuba iingcingo zifakwe ecapsulat, kwaye i-adhesive ayisayi kuphuma kwi-chip, kwaye iqinisekise ukuba ingasetyenziselwa ukukhokelela kwipitch entle kakhulu.

I-DeepMaterial's COB encapsulating adhesives can be thermally or UV inyangelwe i-DeepMaterial's COB encapsulation adhesive inokunyangwa ubushushu okanye i-UV-inyangelwe ngokuthembeka okuphezulu kunye ne-thermal coefficient yokudumba, kunye nobushushu obuphezulu beglasi kunye nomxholo we-ion ophantsi. I-DeepMaterial's COB encapsulating adhesives ikhusela ii lead kunye neplumbum, i-chrome kunye ne-silicon wafers ukusuka kwindawo yangaphandle, umonakalo womatshini kunye nokubola.

I-DeepMaterial COB encapsulating adhesives yenziwe nge-epoxy yokunyanga ukushisa, i-acrylic yokunyanga i-UV, okanye iikhemistri ze-silicone ukwenzela ukugquma kombane okulungileyo. I-DeepMaterial COB encapsulating adhesives inika uzinzo oluphezulu lobushushu kunye nokumelana nokothuka kwe-thermal, iipropathi zokuthintela umbane kuluhlu olubanzi lobushushu, kunye nokuncipha okuncinci, uxinzelelo oluphantsi, kunye nokuxhathisa imichiza xa uphilisiwe.

I-deepmaterial yeyona igqwesileyo yeglu encamathelayo engangenwa manzi yeplastiki ukuya kwintsimbi kunye nomenzi weglasi, ubonelele ngeglu encamathelayo epoxy encamathelayo encamathelayo yokuncamathelisa izinto zombane zepcb, izinto zokuncamathelisa zesemiconductor zokudityaniswa kwe-elektroniki, ubushushu obuphantsi bonyango lwe-bga flip chip underfill pcb epoxy process glue material and so. kwi

I-DeepMaterial ye-Epoxy Resin Isiseko seChip eZantsi zokuzalisa kunye neTheyibhile yoKhetho lweMathiriyeli yokuPakisha
Ubushushu obuphantsi Ukunyanga i-Epoxy Adhesive Product Selection

Series Series Igama lemveliso Isicelo esiqhelekileyo semveliso
I-adhesive yokushisa ephantsi yonyango I-DM-6108

I-adhesive yokushisa ephantsi yokushisa, izicelo eziqhelekileyo ziquka imemori khadi, i-CCD okanye i-CMOS. Le mveliso ifanelekile ukunyanga ubushushu obuphantsi kwaye inokubambelela kakuhle kwizinto ezahlukeneyo ngexesha elifutshane. Usetyenziso oluqhelekileyo lubandakanya iimemori khadi, iikhomponenti zeCCD/CMOS. Eyona nto ifanelekileyo kwizihlandlo apho i-heat-sensitive element ifuna ukuphiliswa kwiqondo lokushisa eliphantsi.
I-DM-6109

Yinto enye-inxalenye thermal ephilisa epoxy resin. Le mveliso ifanelekile ukunyanga ubushushu obuphantsi kwaye inokubambelela kakuhle kwizinto ezahlukeneyo ngexesha elifutshane kakhulu. Usetyenziso oluqhelekileyo lubandakanya ikhadi lememori, i-CCD/CMOS indibano. Ifaneleka ngokukodwa kwizicelo apho ubushushu obuphantsi bokunyanga bufuneka kumacandelo anokuthanani nobushushu.
I-DM-6120

I-adhesive yokunyanga yobushushu obuphantsi, esetyenziselwa imodyuli ye-LCD backlight assembly.
I-DM-6180

Ukunyanga ngokukhawuleza kwiqondo lokushisa eliphantsi, elisetyenziselwa ukuhlanganiswa kweCCD okanye iCMOS kunye neemoto zeVCM. Le mveliso yenzelwe ngokukodwa ubushushu obunobushushu obufuna ukunyangwa kobushushu obuphantsi. Inokubonelela ngokukhawuleza abathengi ngezicelo eziphezulu, ezifana nokufaka iilensi zokukhanya ukukhanya kwii-LEDs, kunye nokudibanisa izixhobo zokubona umfanekiso (kubandakanywa neemodyuli zekhamera). Esi sixhobo simhlophe ukunika ukubonakalisa okukhulu.

Ukukhethwa kweMveliso ye-Epoxy Encapsulation

Umgca womkhiqizo Series Series Igama lemveliso Umbala I-viscosity eqhelekileyo (cps) Ixesha lokuqala lokulungiswa / ukulungiswa okupheleleyo Indlela yokuphilisa TG/°C Ukuqina /D Gcina/°C/M
Epoxy esekwe Encapsulation Adhesive I-DM-6216 Mnyama 58000-62000 150 ° C 20min Ukunyanga ubushushu 126 86 2-8/6M
I-DM-6261 Mnyama 32500-50000 140°C 3H Ukunyanga ubushushu 125 * 2-8/6M
I-DM-6258 Mnyama 50000 120 ° C 12min Ukunyanga ubushushu 140 90 -40/6M
I-DM-6286 Mnyama 62500 120 ° C 30min1 150 ° C 15min Ukunyanga ubushushu 137 90 2-8/6M

Ukuzaliswa ngaphantsi koKhetho lweMveliso ye-Epoxy

Series Series Igama lemveliso Isicelo esiqhelekileyo semveliso
Ukugcwalisa ngaphantsi I-DM-6307 Yinto enye, i-thermosetting epoxy resin. Yi-CSP ephinda isetyenziswe (FBGA) okanye i-BGA filler esetyenziselwa ukukhusela amalungu e-solder kuxinzelelo lomatshini kwizixhobo zombane eziphathwayo.
I-DM-6303 I-adhesive ye-epoxy resin yecandelo elinye yi-resin yokuzalisa enokuthi isetyenziswe kwakhona kwi-CSP (FBGA) okanye i-BGA. Iphilisa ngokukhawuleza yakuba ishushu. Yenzelwe ukubonelela ngokukhuselekileyo ukukhusela ukusilela ngenxa yoxinzelelo lomatshini. I-viscosity ephantsi ivumela izithuba zokuzalisa phantsi kwe-CSP okanye i-BGA.
I-DM-6309 Lulwelo oluphilisayo olukhawulezayo, oluqukuqelayo olukhawulezayo lwe-epoxy resin eyenzelwe ukugeleza kwe-capillary yokuzalisa iipakethi zesayizi ye-chip, kukuphucula isantya senkqubo kwimveliso kunye nokuyila uyilo lwayo lwerheological, mayingene kwi-25μm yokukhutshwa, ukunciphisa uxinzelelo olubangelwayo, ukuphucula ukusebenza kwebhayisikile yobushushu, kunye ukumelana nemichiza ebalaseleyo.
DM-6308 I-Classic underfill, i-ultra-low viscosity ilungele uninzi lwezicelo zokungagcwaliswa.
I-DM-6310 I-epoxy primer enokusetyenziswa kwakhona yenzelwe i-CSP kunye nezicelo ze-BGA. Inokunyangwa ngokukhawuleza kumaqondo obushushu aphakathi ukunciphisa uxinzelelo kwamanye amalungu. Emva kokunyanga, izinto eziphathekayo zineempawu ezibalaseleyo zoomatshini kwaye zinokukhusela amalungu e-solder ngexesha lokuhamba ngebhayisikile eshushu.
I-DM-6320 Ukuzaliswa okungaphantsi okunokuphinda kusetyenziswe kuyilelwe ngokukodwa usetyenziso lwe-CSP, i-WLCSP kunye ne-BGA. Ifomula yayo kukunyanga ngokukhawuleza kumaqondo obushushu aphakathi ukunciphisa uxinzelelo kwezinye iindawo. Izinto eziphathekayo zinobushushu obuphezulu beglasi yokutshintsha kunye nokuqina okuphezulu kwe-fracture, kwaye inokubonelela ngokhuseleko olufanelekileyo kumalungu e-solder ngexesha lokuhamba ngebhayisikili eshushu.

I-DeepMaterial Epoxy Based Based Chip Underfill kunye neCOB Packaging Material Data Sheet
Ubushushu obuphantsi bokunyanga i-Epoxy Adhesive Product Data Sheet

Umgca womkhiqizo Series Series Igama lemveliso Umbala I-viscosity eqhelekileyo (cps) Ixesha lokuqala lokulungiswa / ukulungiswa okupheleleyo Indlela yokuphilisa TG/°C Ukuqina /D Gcina/°C/M
Epoxy esekwe Ubushushu obuphantsi bokunyanga i-encapsulant I-DM-6108 Mnyama 7000-27000 80°C 20min 60°C 60min Ukunyanga ubushushu 45 88 -20/6M
I-DM-6109 Mnyama 12000-46000 80 °C 5-10min Ukunyanga ubushushu 35 88A -20/6M
I-DM-6120 Mnyama 2500 80 °C 5-10min Ukunyanga ubushushu 26 79 -20/6M
I-DM-6180 Mhlophe 8700 80 ° C 2min Ukunyanga ubushushu 54 80 -40/6M

Iphepha leDatha leMveliso ye-Epoxy Adhesive Encapsulated

Umgca womkhiqizo Series Series Igama lemveliso Umbala I-viscosity eqhelekileyo (cps) Ixesha lokuqala lokulungiswa / ukulungiswa okupheleleyo Indlela yokuphilisa TG/°C Ukuqina /D Gcina/°C/M
Epoxy esekwe Encapsulation Adhesive I-DM-6216 Mnyama 58000-62000 150 ° C 20min Ukunyanga ubushushu 126 86 2-8/6M
I-DM-6261 Mnyama 32500-50000 140°C 3H Ukunyanga ubushushu 125 * 2-8/6M
I-DM-6258 Mnyama 50000 120 ° C 12min Ukunyanga ubushushu 140 90 -40/6M
I-DM-6286 Mnyama 62500 120 ° C 30min1 150 ° C 15min Ukunyanga ubushushu 137 90 2-8/6M

Ukugcwalisa i-Epoxy Adhesive Product Data Sheet

Umgca womkhiqizo Series Series Igama lemveliso Umbala I-viscosity eqhelekileyo (cps) Ixesha lokuqala lokulungiswa / ukulungiswa okupheleleyo Indlela yokuphilisa TG/°C Ukuqina /D Gcina/°C/M
Epoxy esekwe Ukugcwalisa ngaphantsi I-DM-6307 Mnyama 2000-4500 120°C 5min 100°C 10min Ukunyanga ubushushu 85 88 2-8/6M
I-DM-6303 Ulwelo opaque creamy yellow 3000-6000 100°C 30min 120°C 15min 150°C 10min Ukunyanga ubushushu 69 86 2-8/6M
I-DM-6309 Ulwelo olumnyama 3500-7000 165°C 3min 150°C 5min Ukunyanga ubushushu 110 88 2-8/6M
I-DM-6308 Ulwelo olumnyama 360 130°C 8min 150°C 5min Ukunyanga ubushushu 113 * -20/6M
I-DM-6310 Ulwelo olumnyama 394 130 ° C 8min Ukunyanga ubushushu 102 * -20/6M
I-DM-6320 Ulwelo olumnyama 340 130°C 10min 150°C 5min 160°C 3min Ukunyanga ubushushu 134 * -20/6M