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3. Ukuzalisa ngaphantsi kwe-Epoxy

Eyona nto igqwesileyo i-epoxy incamathelayo umenzi kunye nomthengisi

I-Shenzhen DeepMaterial Technologies Co., Ltd yi-flip chip bga underfill epoxy material kunye nomvelisi we-epoxy encapsulant e-china, ukuvelisa i-underfill encapsulants, i-smt pcb egcwalisa i-epoxy, inxalenye enye ye-epoxy underfill ikhompawundi, i-flip chip igcwalisa i-epoxy ye-csp kunye ne-bga njalo.

I-Underfill yimathiriyeli ye-epoxy egcwalisa izithuba phakathi kwetshiphu kunye nomphathi wayo okanye iphakheji egqityiweyo kunye ne-PCB substrate. I-Underfill ikhusela iimveliso ze-elektroniki ekothukeni, ekuweni, nasekungcangcazeleni kwaye kunciphisa uxinzelelo kunxibelelwano lwe-solder eethe-ethe olubangelwa ngumahluko wokwandiswa kwe-thermal phakathi kwe-silicon chip kunye ne-carrier (izinto ezimbini ezingafaniyo).

Kwizicelo zokuzaliswa ngaphantsi kwe-capillary underfill, umthamo ochanekileyo wemathiriyeli yokuzaliswa ngaphantsi ukhutshwa ecaleni kwetshiphu okanye ipakethe ukuze iqukuqele ngaphantsi kwesenzo se-capillary, ivala izikhewu zomoya ezijikeleze iibhola ze-solder ezidibanisa iipakethe ze-chip kwi-PCB okanye iitshiphusi ezipakishwe kwiipakethe ezininzi. Izixhobo zokungagcwaliswa ngaphantsi kwamanzi, ngamanye amaxesha zisetyenziselwa ukungagcwali ngaphantsi, zifakwe kwi-substrate ngaphambi kokuba i-chip okanye ipakethe iqhotyoshelwe kwaye iphinde ihanjiswe kwakhona. Ukuzaliswa ngaphantsi okubunjiweyo yenye indlela ebandakanya ukusebenzisa i-resin ukuvala izikhewu phakathi kwe-chip kunye ne-substrate.

Ngaphandle kokuzaliswa ngaphantsi, ubude bobomi bemveliso buya kuncitshiswa kakhulu ngenxa yokuqhekeka koqhagamshelo. Ukungazaliseki kusetyenziswa kwezi zigaba zilandelayo zenkqubo yokuvelisa ukuphucula ukuthembeka.

IsiKhokelo esiGqibeleleyo se-Epoxy yokungagcwalisi:

Yintoni i-Epoxy Underfill?

I-Underfill luhlobo lwezinto ze-epoxy ezisetyenziselwa ukuzalisa izithuba phakathi kwe-chip ye-semiconductor kunye nomphathi wayo okanye phakathi kwephakheji egqityiweyo kunye nebhodi yesekethe eprintiweyo (PCB) substrate kwizixhobo zombane. Iqhele ukusetyenziswa kubuchwepheshe bokupakisha be-semiconductor obuphambili, obunje ngeflip-chip kunye neepakeji zesikali se-chip, ukuqinisa ukuthembeka koomatshini kunye nobushushu bezixhobo.

I-epoxy underfill yenziwa ngokuqhelekileyo nge-epoxy resin, i-polymer ye-thermosetting eneempawu ezigqwesileyo zoomatshini kunye neekhemikhali, iyenza ilungele ukusetyenziswa kwizicelo ezibangwayo ze-elektroniki. I-epoxy resin idla ngokudityaniswa nezinye izongezo, ezifana neziqini, izihluzi, kunye nezilungisi, ukunyusa ukusebenza kwayo kunye nokulungisa iimpawu zayo ukuhlangabezana neemfuno ezithile.

I-epoxy underfill lulwelo okanye i-semi-lequid imathiriyeli egalelwe kwi-substrate phambi kokuba i-semiconductor die ibekwe ngaphezulu. Emva koko iyaphiliswa okanye iqiniswe, ngokuqhelekileyo ngenkqubo ye-thermal, ukwenza i-rigid, layer ekhuselayo efaka i-semiconductor die kwaye igcwalise i-gap phakathi kwe-die kunye ne-substrate.

I-Epoxy underfill sisixhobo sokuncamathelisa esikhethekileyo esisetyenziswa kwimveliso yombane ukugquma nokukhusela izinto ezibuthathaka, ezinje ngemicrochips, ngokuzalisa isithuba phakathi kwento kunye ne-substrate, ngokuqhelekileyo ibhodi yesekethe eprintiweyo (PCB). Ngokuqhelekileyo isetyenziselwa iteknoloji ye-flip-chip, apho i-chip ifakwe ubuso-phantsi kwi-substrate ukuphucula ukusebenza kwe-thermal kunye nombane.

Eyona njongo iphambili ye-epoxy underfills kukubonelela ngokuqiniswa koomatshini kwi-flip-chip package, ukuphucula ukuchasana kwayo noxinzelelo lomatshini olufana nokuhamba ngebhayisikile eshushu, ukothuka koomatshini, kunye nokungcangcazela. Kwakhona kunceda ukunciphisa umngcipheko wokungaphumeleli okuhlangeneyo kwe-solder ngenxa yokukhathala kunye nokungahambi kakuhle kwe-thermal ukwanda, okunokuthi kwenzeke ngexesha lokusebenza kwesixhobo sombane.

Izixhobo zokuzalisa i-epoxy ziqhele ukwenziwa ngeereyini ze-epoxy, ii-ejenti zokunyanga, kunye nezihluzi ukufezekisa eyona nto ifunwayo ngumatshini, i-thermal, kunye neempawu zombane. Zenzelwe ukuba zibe nokubambelela kakuhle kwi-semiconductor die kunye ne-substrate, i-coefficient ephantsi yokwandiswa kwe-thermal (CTE) ukunciphisa uxinzelelo lwe-thermal, kunye ne-conductivity ephezulu ye-thermal ukuququzelela ukutshatyalaliswa kobushushu kwisixhobo.

I-Underfill Epoxy isetyenziselwa ntoni?

I-epoxy ye-Underfill yi-adhesive epoxy resin adhesive esetyenziswa kwizicelo ezahlukeneyo ukubonelela ngokuqiniswa komatshini kunye nokukhusela. Nalu usetyenziso oluqhelekileyo lwe-epoxy engagcwalisiyo:

Ukupakishwa kweSemiconductor: I-epoxy ye-underfill idla ngokusetyenziswa kwi-semiconductor packaging ukubonelela ngenkxaso yomatshini kunye nokukhusela kumacandelo e-elektroniki athambileyo, afana ne-microchips, efakwe kwiibhodi zesekethe eziprintiweyo (PCBs). Izalisa isithuba phakathi kwe-chip kunye ne-PCB, ukukhusela uxinzelelo kunye nomonakalo womatshini obangelwa ukwanda kwe-thermal kunye nokunciphisa ngexesha lokusebenza.

Ukudityaniswa kwe-Flip-Chip: I-epoxy engagcwaliswanga isetyenziswa kwi-flip-chip bonding, edibanisa iitshiphusi ze-semiconductor ngqo kwi-PCB ngaphandle kweebhondi zocingo. I-epoxy igcwalisa i-gap phakathi kwe-chip kunye ne-PCB, ibonelela ngokuqiniswa koomatshini kunye nokufakelwa kombane ngelixa kuphuculwa ukusebenza kwe-thermal.

Uveliso loMboniso: I-epoxy ye-underfill isetyenziselwa ukwenza imiboniso, efana ne-liquid crystal displays (LCDs) kunye ne-organic light-emitting diode (OLED) ibonisa. Isetyenziselwa ukudibanisa kunye nokomeleza amacandelo athambileyo, anje ngokubonisa abaqhubi kunye neenzwa zokuchukumisa, ukuqinisekisa ukuzinza komatshini kunye nokuqina.

Izixhobo ze-Optoelectronic: I-epoxy ye-Underfill isetyenziswe kwizixhobo ze-optoelectronic, ezifana ne-transceivers optical, lasers, kunye ne-photodiodes, ukubonelela ngenkxaso yomatshini, ukuphucula ukusebenza kwe-thermal, kunye nokukhusela amacandelo abuthathaka kwizinto ezisingqongileyo.

Umbane weeMoto: I-epoxy ye-underfill isetyenziswa kwii-automotive electronics, ezifana neeyunithi zokulawula i-electronics (ECUs) kunye ne-sensor, ukubonelela ngokuqiniswa koomatshini kunye nokukhusela ngokugqithisileyo kobushushu, ukungcangcazela, kunye neemeko ezinzima zokusingqongileyo.

IAerospace kunye nezicelo zoKhuselo: I-epoxy ye-underfill isetyenziswe kwi-aerospace kunye nezicelo zokukhusela, ezifana ne-avionics, iinkqubo ze-radar, kunye ne-electronics yezempi, ukubonelela ngokuzinza komatshini, ukukhuselwa ngokuguquguquka kweqondo lokushisa, kunye nokuchasana nokothuka kunye nokungcangcazela.

Ii-Electronics zabathengi: I-epoxy ye-Underfill isetyenziswa kwii-elektroniki ezahlukeneyo zabathengi, kubandakanya ii-smartphones, iitafile, kunye nezixhobo zokudlala, ukubonelela ngokuqiniswa koomatshini kunye nokukhusela izinto ze-elektroniki kumonakalo ngenxa yebhayisekile eshushu, impembelelo kunye nolunye uxinzelelo.

Izixhobo zonyango: I-epoxy engagcwaliswanga isetyenziswa kwizixhobo zonyango, ezifana nezixhobo ezifakelwayo, izixhobo zokuxilonga, kunye nezixhobo zokubeka iliso, ukubonelela ngokuqiniswa koomatshini kunye nokukhusela izixhobo ze-elektroniki ezibuthathaka kwiindawo ezibuhlungu zomzimba.

ukuPakisha kwe-LED: I-epoxy ye-underfill isetyenziselwa ukupakisha ii-diode ezikhupha ukukhanya (ii-LED) ukubonelela ngenkxaso yomatshini, ulawulo lwe-thermal, kunye nokukhuselwa kumswakama kunye nezinye izinto zokusingqongileyo.

I-Electronics ngokubanzi: I-epoxy ye-underfill isetyenziswa kuluhlu olubanzi lwezicelo zombane jikelele apho ukuqinisa ngoomatshini kunye nokhuseleko lwamalungu e-elektroniki kufuneka, njengakumbane we-elektroniki, i-industrial automation, kunye nezixhobo zonxibelelwano.

Yintoni i-Underfill Material ye-Bga?

Izinto ezingagcwaliswanga kwi-BGA (i-Ball Grid Array) i-epoxy okanye i-polymer-based material esetyenziselwa ukuvala isithuba phakathi kwephakheji ye-BGA kunye ne-PCB (iBhodi yeSekethe eShicileleyo) emva kokuthengiswa. I-BGA luhlobo lwepakethe yomphezulu wentaba esetyenziswa kwizixhobo zombane ezibonelela ngoxinaniso oluphezulu lonxibelelwano phakathi kwesekethe edibeneyo (IC) kunye nePCB. Imathiriyeli yokungagcwalisi iphucula ukuthembeka kwamalungu e-solder ye-BGA kunye nokomelela koomatshini, kuthomalalisa umngcipheko wokusilela ngenxa yoxinzelelo lomatshini, ukukhwela ibhayisekile ngokushushu, kunye nezinye izinto zokusingqongileyo.

Imathiriyeli yokungazaleli ngokuqhelekileyo ilulwelo kwaye iqukuqela phantsi kwepakethe ye-BGA ngesenzo se-capillary. Ithi ke iqhube inkqubo yokunyanga ukuqinisa kunye nokudala uqhagamshelwano oluqinileyo phakathi kweBGA kunye nePCB, ngesiqhelo ngobushushu okanye ukuvezwa kweUV. Izinto zokungaphumeleli zinceda ukusabalalisa uxinzelelo lomatshini olunokuthi lwenzeke ngexesha lokuhamba ngebhayisikili eshushu, ukunciphisa umngcipheko we-solder joint cracking kunye nokuphucula ukuthembeka okupheleleyo kwephakheji ye-BGA.

Izinto ezingazalisekiyo ze-BGA zikhethwe ngononophelo ngokusekelwe kwizinto ezifana noyilo oluthile lwephakheji ye-BGA, izinto ezisetyenziswa kwi-PCB kunye ne-BGA, indawo yokusebenza, kunye nesicelo esijoliswe kuyo. Ezinye izinto eziqhelekileyo zokuzaliswa ngaphantsi kwe-BGA ziquka i-epoxy-based, akukho-flow, kunye ne-underfill kunye nezixhobo zokuzalisa ezahlukeneyo ezifana ne-silica, i-alumina, okanye i-conductive particles. Ukukhethwa kwezinto ezifanelekileyo zokuzaliswa ngaphantsi kubalulekile ukuqinisekisa ukuthembeka kwexesha elide kunye nokusebenza kweephakheji ze-BGA kwizixhobo zombane.

Ukongeza, izinto zokuzaliswa ngaphantsi kwe-BGA zinokubonelela ngokhuseleko lokufuma, uthuli, kunye nezinye izinto ezingcolisayo ezinokungena ngaphandle komsantsa phakathi kwe-BGA kunye nePCB, ezinokubangela ukubola okanye iisekethe ezimfutshane. Oku kunokunceda ukomeleza ukuqina kweepakethe ze-BGA kunye nokuthembeka kwiindawo ezirhabaxa.

Yintoni i-Underfill Epoxy kwi-Ic?

I-epoxy engagcwaliswanga kwi-IC (i-Integrated Circuit) yinto enamathelayo egcwalisa isithuba phakathi kwe-chip ye-semiconductor kunye ne-substrate (efana nebhodi yesekethe eprintiweyo) kwizixhobo zombane. Iqhele ukusetyenziswa kwinkqubo yokwenziwa kwee-ICs ukukhulisa amandla abo omatshini kunye nokuthembeka.

Ii-ICs ngokwesiqhelo zenziwe nge-semiconductor chip equlethe izinto ezahlukeneyo ze-elektroniki, ezifana neetransistors, resistors, kunye neecapacitors, ezidityaniswe kuqhagamshelwano lwangaphandle lombane. Ezi chips emva koko zixhonywe kwi-substrate, enika inkxaso kunye noqhagamshelwano lombane kuyo yonke inkqubo ye-elektroniki. Nangona kunjalo, ngenxa yokungafani kwe-coefficients yokwandiswa kwe-thermal (CTEs) phakathi kwe-chip kunye ne-substrate kunye noxinzelelo kunye noxinzelelo olufunyenwe ngexesha lokusebenza, ukunyanzeliswa komatshini, kunye nemiba yokuthembeka inokuvela, njengokungaphumeleli okubangelwa ukuhamba ngebhayisikili okanye ukuchithwa komatshini.

I-epoxy engagcwaliswanga ilungisa le miba ngokuzalisa isithuba phakathi kwe-chip kunye ne-substrate, ukudala ibhondi eyomelele ngoomatshini. Luhlobo lwe-epoxy resin eyenziwe ngeempawu ezithile, ezifana ne-viscosity ephantsi, amandla aphezulu okubambelela, kunye neempawu ezilungileyo ze-thermal kunye ne-mechanical. Ngethuba lenkqubo yokuvelisa, i-epoxy engaphantsi isetyenziswe kwifom ye-liquid, kwaye emva koko iphiliswe ukuze iqiniswe kwaye idale ibhondi eqinile phakathi kwe-chip kunye ne-substrate. Ii-ICs zizixhobo zombane ezibuthathaka ezichaphazeleka kuxinzelelo lomatshini, ukukhwela ibhayisekile kobushushu, kunye nezinye izinto zokusingqongileyo ngexesha lokusebenza, ezinokubangela ukusilela ngenxa yokudinwa okudityanisiweyo okanye ukudinwa phakathi kwetshiphu kunye ne-substrate.

I-epoxy engagcwaliswanga inceda ukusabalalisa kwakhona kunye nokunciphisa uxinzelelo lomatshini kunye noxinzelelo ngexesha lokusebenza kwaye ibonelela ngokhuseleko kubumanzi, ungcoliseko, kunye nokothuka koomatshini. Kwakhona kunceda ekuphuculeni ukuthembeka kwebhayisikili ye-thermal ye-IC ngokunciphisa umngcipheko wokuqhekeka okanye i-delamination phakathi kwe-chip kunye ne-substrate ngenxa yokutshintsha kweqondo lokushisa.

Yintoni i-Underfill Epoxy kwi-Smt?

I-epoxy ye-underfill kwi-Surface Mount Technology (SMT) ibhekisela kuhlobo lwezinto ezincamathelayo ezisetyenziselwa ukuzalisa isithuba phakathi kwe-chip ye-semiconductor kunye ne-substrate kwizixhobo zombane ezifana neebhodi zesekethe eziprintiweyo (PCBs). I-SMT yindlela ethandwayo yokudibanisa amacandelo e-elektroniki kwii-PCB, kwaye i-epoxy engagcwaliswanga isetyenziswa ngokuqhelekileyo ukuphucula amandla omatshini kunye nokuthembeka kwamalungu e-solder phakathi kwe-chip kunye ne-PCB.

Xa izixhobo zombane ziphantsi kwebhayisekile eshushu kunye noxinzelelo lomatshini, njengaxa kusetyenzwa okanye kuthutho, umahluko kwi-coefficient yokwandiswa kwe-thermal (CTE) phakathi kwe-chip kunye ne-PCB kunokubangela uxinzelelo kumalungu e-solder, okukhokelela ekungaphumelelini okunokwenzeka njengokuqhekeka. okanye delamination. I-epoxy engaphantsi kwe-underfill isetyenziselwa ukunciphisa le miba ngokuzalisa isithuba phakathi kwe-chip kunye ne-substrate, ukubonelela ngenkxaso yomatshini, kunye nokukhusela ama-solder joints ukuba abe noxinzelelo olugqithisileyo.

I-epoxy engagcwaliswanga ngokuqhelekileyo sisixhobo se-thermosetting esifakwe kwimo engamanzi kwi-PCB, kwaye iqukuqela ingene phakathi kwetshiphu kunye ne-substrate ngokusebenzisa i-capillary action. Emva koko iyaphiliswa ukuze yenze into eqinileyo kunye neyomeleleyo edibanisa i-chip kwi-substrate, iphucula yonke ingqibelelo yomatshini yamalungu e-solder.

I-epoxy engagcwaliswanga inika imisebenzi emininzi ebalulekileyo kwiindibano ze-SMT. Inceda ukunciphisa ukwakheka kweentanda ezidibeneyo ze-solder okanye iifractures ngenxa yebhayisikile eshushu kunye noxinzelelo lomatshini ngexesha lokusebenza kwezixhobo zombane. Kwakhona kwandisa ukuchithwa kwe-thermal ukusuka kwi-IC ukuya kwi-substrate, enceda ukuphucula ukuthembeka kunye nokusebenza kwendibano ye-elektroniki.

Ukuzaliswa kwe-epoxy kwiindibano ze-SMT kufuna iindlela ezichanekileyo zokusabalalisa ukuqinisekisa ukhuseleko olufanelekileyo kunye nokusabalalisa okufanayo kwe-epoxy ngaphandle kokwenza umonakalo kwi-IC okanye kwi-substrate. Izixhobo eziphezulu ezifana nokukhupha iirobhothi kunye nee-ovens zokunyanga zisetyenziswa ngokuqhelekileyo kwinkqubo yokungaphumeleli ukufezekisa iziphumo ezihambelanayo kunye nezibophelelo eziphezulu.

Ziintoni iiPropati zeMathiriyeli eNgagcwaliswanga?

Izinto zokungaphumeleli zisetyenziswa ngokuqhelekileyo kwiinkqubo zokuvelisa i-electronics, ngokukodwa, ukupakishwa kwe-semiconductor, ukunyusa ukuthembeka kunye nokuqina kwezixhobo zombane ezifana neesekethe ezidibeneyo (ICs), ii-ball grid arrays (BGAs), kunye neepakethe ze-flip-chip. Iipropathi zemathiriyeli yokuzaliswa ngaphantsi kunokwahluka ngokuxhomekeke kuhlobo oluthile kunye noqulunqo kodwa ngokubanzi ziquka oku kulandelayo:

I-Thermal conductivity: Izinto zokungaphumeleli kufuneka zibe ne-conductivity efanelekileyo ye-thermal yokuchitha ubushushu obuveliswa sisixhobo sombane ngexesha lokusebenza. Oku kunceda ukuthintela ukushisa, oku kunokukhokelela ekungaphumeleli kwecebo.

I-CTE (i-Coefficient yoKwandiswa kwe-Thermal) ukuhambelana: Izinto ezingaphantsi kokuzaliswa kufuneka zibe ne-CTE ehambelana ne-CTE yesixhobo sombane kunye ne-substrate eboshwe kuyo. Oku kunceda ukunciphisa uxinzelelo lwe-thermal ngexesha lokuhamba ngebhayisikile kwaye kuthintele i-delamination okanye ukuqhekeka.

I-viscosity ephantsi: Izinto zokungaphumeleli kufuneka zibe noxinzelelo oluphantsi ukwenzela ukuba zikwazi ukuhamba ngokulula ngexesha lenkqubo ye-encapsulation kwaye zizalise izikhewu phakathi kwesixhobo sombane kunye ne-substrate, ukuqinisekisa ukugubungela okufanayo kunye nokunciphisa i-voids.

Ukuncamathela: Izinto zokungaphumeleli kufuneka zibe nokubambelela kakuhle kwisixhobo sombane kunye ne-substrate ukubonelela ngebhondi eyomeleleyo kunye nokuthintela i-delamination okanye ukwahlukana phantsi koxinzelelo lwe-thermal kunye noomatshini.

Ukugqunywa kombane: Izinto zokungaphumeleli kufuneka zibe neempawu eziphezulu zokugquma umbane ukukhusela iisekethe ezimfutshane kunye nokunye ukusilela kombane kwisixhobo.

Amandla oomatshini: Izinto zokungaphumeleli kufuneka zibe namandla aneleyo okumelana noxinzelelo olufunyenwe ngexesha lokuhamba ngebhayisikile, ukothuka, ukungcangcazela, kunye neminye imithwalo yomatshini ngaphandle kokuqhekeka okanye ukonakala.

Ixesha lokunyanga: Izinto zokungaphumeleli kufuneka zibe nexesha elifanelekileyo lokunyanga ukuqinisekisa ukudibanisa okufanelekileyo kunye nokunyanga ngaphandle kokubangela ukulibaziseka kwinkqubo yokuvelisa.

Ukuhanjiswa kunye nokusebenza kwakhona: Izixhobo zokungazali kufuneka zihambelane nezixhobo zokukhupha ezisetyenziswa kwimveliso kwaye zivumele ukusetyenzwa kwakhona okanye ukulungiswa xa kukho imfuneko.

Ukuxhathisa ukufuma: Izinto zokungaphumeleli kufuneka zibe nokuxhathisa okulungileyo kokufuma ukukhusela ukungena kokufuma, okunokubangela ukusilela kwesixhobo.

Beka ubomi kwishelufa: Izinto zokungaphumeleli kufuneka zibe neshelufu efanelekileyo, evumela ukugcinwa okufanelekileyo kunye nokusetyenziswa ngexesha.

Yintoni i-Underfill Material ebunjiweyo?

Isixhobo sokuzaliswa esibunjiweyo sisetyenziselwa ukupakishwa kwe-elektroniki ukugubungela kunye nokukhusela izixhobo ze-semiconductor, ezifana neesekethe ezidibeneyo (ICs), ukusuka kwizinto zangaphandle zokusingqongileyo kunye noxinzelelo lomatshini. Ngokuqhelekileyo isetyenziswa njengolwelo okanye into yokuncamathisela emva koko inyangelwe ukuqinisa kunye nokudala umaleko okhuselayo ojikeleze isixhobo se-semiconductor.

Izinto ezibunjiweyo zokuzaliswa ngaphantsi zisetyenziswa ngokuqhelekileyo kwi-flip-chip packaging, edibanisa izixhobo ze-semiconductor kwibhodi yesekethe eprintiweyo (PCB) okanye i-substrate. I-Flip-chip packaging ivumela i-high-density, i-high-performance interconnect scheme, apho idivaysi ye-semiconductor ifakwe ubuso-phantsi kwi-substrate okanye i-PCB, kwaye ukudibanisa kombane kwenziwa ngokusebenzisa i-metal bumps okanye iibhola ze-solder.

Izinto ezibunjiweyo zokuzalisa ngaphantsi zidla ngokukhutshwa kulwelo okanye kwifomu yokuncamathisela kwaye zihamba phantsi kwesixhobo se-semiconductor ngesenzo se-capillary, ukuzalisa izithuba phakathi kwesixhobo kunye ne-substrate okanye i-PCB. Izinto eziphathekayo zinyangwa kusetyenziswa ukushisa okanye ezinye iindlela zokunyanga ukuqinisa kunye nokudala umaleko okhuselayo odibanisa isixhobo, ukubonelela ngenkxaso yomatshini, ukufakwa kwe-thermal, kunye nokukhuselwa kumswakama, uthuli kunye nezinye izinto ezingcolileyo.

Izinto ezibunjiweyo zokuzaliswa ngaphantsi kwe-molded ngokuqhelekileyo ziqulunqwe ukuba zibe neepropati ezifana ne-viscosity ephantsi yokuhambisa lula, ukuzinza okuphezulu kwe-thermal yokusebenza okuthembekileyo kuluhlu olubanzi lwamaqondo okushisa okusebenzayo, ukunamathela kakuhle kwii-substrates ezahlukeneyo, i-coefficient ephantsi yokwandiswa kwe-thermal (CTE) ukunciphisa uxinzelelo ngexesha lobushushu. ukukhwela ibhayisekile, kunye neempawu eziphezulu zokugquma umbane ukuthintela imijikelezo emifutshane.

Ngokuqinisekileyo! Ukongeza kwiipropati ezikhankanywe ngaphambili, izinto ezibunjiweyo zokuzaliswa ngaphantsi zinokuba nezinye iimpawu ezilungiselelwe izicelo ezithile okanye iimfuno. Ngokomzekelo, ezinye izinto eziphuhlisiwe zokuzaliswa ngaphantsi zinokuthi ziphucule ukuqhutyelwa kwe-thermal ukuphucula ukutshatyalaliswa kobushushu kwisixhobo se-semiconductor, eyimfuneko kwizicelo zamandla aphezulu apho ulawulo lwe-thermal lubalulekile.

Uzisusa Njani Izinto Ezingazalisekiyo?

Ukususa izinto ezingagcwaliswanga ngokwaneleyo kunokuba ngumngeni, njengoko yenzelwe ukuba yomelele kwaye imelane nezinto ezingqongileyo. Nangona kunjalo, iindlela ezininzi ezisemgangathweni zingasetyenziselwa ukususa imathiriyeli yokuzaliswa ngaphantsi, kuxhomekeke kuhlobo oluthile lokungagcwaliswa kunye nesiphumo esifunwayo. Nazi ezinye iindlela onokukhetha kuzo:

Iindlela zokufudumeza: Izinto ezingagcwaliswanga phantsi ngokwesiqhelo ziyilelwe ukuba zizinze ngokushushu, kodwa ngamanye amaxesha zinokuthanjiswa okanye zinyibilike ngokufaka ubushushu. Oku kunokwenziwa kusetyenziswa izixhobo ezikhethekileyo ezifana nesikhululo sokusebenza ngokutsha somoya oshushu, intsimbi yokuthambisa enencakuba eshushu, okanye isifudumezi se-infrared. I-underfill ethambileyo okanye enyibilikisiweyo inokukhuthulwa ngononophelo okanye iphakanyiswe kusetyenziswa isixhobo esifanelekileyo, esinje ngeplastiki okanye isikrala sesinyithi.

Iindlela zemichiza: Izinyibilikisi zemichiza zinokunyibilikisa okanye zithambise ezinye izinto ezingazaliswanga ngokwaneleyo. Uhlobo lwe-solvent efunekayo luxhomekeke kuhlobo oluthile lwezinto ezingaphantsi. Izinyibilikisi eziqhelekileyo zokususwa kwe-underfill zibandakanya i-isopropyl alcohol (IPA), i-acetone, okanye izisombululo ezikhethekileyo zokususa i-underfill. I-solvent isetyenziswa ngokuqhelekileyo kwizinto ezingaphantsi kwaye zivunyelwe ukuba zingene kwaye zithambise, emva koko izinto ezinokuthi zihlanjululwe ngokucophelela okanye zicinywe.

Iindlela zoomatshini: Izinto ezingagcwaliswanga zingasuswa ngoomatshini kusetyenziswa iindlela ezirhabaxa okanye zoomatshini. Oku kunokuquka ubuchule obunjengokusila, ukugalela, okanye ukungqusha, ukusebenzisa izixhobo ezikhethekileyo okanye izixhobo. Iinkqubo ezizenzekelayo zidla ngokuba ndlongondlongo kwaye zinokufaneleka kwiimeko apho ezinye iindlela zingasebenziyo, kodwa zinokubeka umngcipheko wokonakalisa i-substrate engaphantsi okanye amacandelo kwaye kufuneka isetyenziswe ngononophelo.

Iindlela ezidityanisiweyo: Kwezinye iimeko, indibaniselwano yobuchule inokususa imathiriyeli engagcwaliswanga ngokwaneleyo. Ngokomzekelo, iinkqubo ezahlukeneyo ze-thermal kunye neekhemikhali zingasetyenziselwa, apho ubushushu busetyenziselwa ukuthambisa izinto ezingaphantsi, i-solvents ukuqhubela phambili ukunyibilika okanye ukuthambisa izinto, kunye neendlela zomatshini zokususa intsalela eseleyo.

Ungazalisa njani i-Epoxy

Nantsi inyathelo ngenyathelo isikhokelo sendlela yokuzalisa ngaphantsi kwe-epoxy:

Inyathelo 1: Qokelela izixhobo kunye nezixhobo

Ukuzalisa ngaphantsi kwemathiriyeli ye-epoxy: Khetha umgangatho ophezulu wokuzalisa imathiriyeli ye-epoxy ehambelana nezixhobo ze-elektroniki osebenza nazo. Landela imiyalelo yomenzi yokuxuba kunye nokunyanga amaxesha.

Izixhobo zokukhupha: Uya kudinga inkqubo yokukhupha, njengesirinji okanye i-dispenser, ukusebenzisa i-epoxy ngokuchanekileyo nangokulinganayo.

Umthombo wobushushu (ukhetho): Ezinye izixhobo ze-epoxy ezingagcwaliswanga ngokwaneleyo zifuna ukunyangwa ngobushushu, ngoko unokufuna umthombo wobushushu, onjenge-oveni okanye ipleyiti eshushu.

Izinto zokucoca: Yiba ne-isopropyl alcohol okanye i-ejenti yokucoca efanayo, i-lint-free wipes, kunye neeglavu zokucoca kunye nokuphatha i-epoxy.

Inyathelo lesi-2: Lungiselela Amacandelo

Coca amacandelo: Qinisekisa ukuba izinto eziza kuzaliswa ngaphantsi zicocekile kwaye azinanto engcolisayo, enjengothuli, igrisi, okanye ukufuma. Zicoce ngokucokisekileyo usebenzisa i-isopropyl alcohol okanye i-arhente yokucoca efanayo.

Faka i-adhesive okanye i-flux (ukuba kuyimfuneko): Ngokuxhomekeke kwi-underfill epoxy material kunye namacandelo asetyenziswayo, unokufuna ukusebenzisa i-adhesive okanye i-flux kumacandelo ngaphambi kokufaka i-epoxy. Landela imiyalelo yomenzi wesixhobo esithile esisetyenziswayo.

Inyathelo 3: Xuba i-epoxy

Landela imiyalelo yomenzi ukuxuba imathiriyeli ye-epoxy engaphantsi ngokufanelekileyo. Oku kunokubandakanya ukudibanisa izinto ezimbini okanye ngaphezulu ze-epoxy kwireyishini ezithile kwaye uzivuselele ngokucokisekileyo ukuphumeza umxube olinganayo. Sebenzisa isitya esicocekileyo nesomileyo xa uxuba.

Inyathelo 4: Faka i-Epoxy

Layisha i-epoxy kwinkqubo yokuhambisa: Gcwalisa inkqubo yokukhupha, njengesirinji okanye i-dispenser, kunye ne-epoxy material edibeneyo.

Faka i-epoxy: Ukusasaza imathiriyeli ye-epoxy kwindawo ekufuneka ingagcwaliswanga ngokwaneleyo. Qinisekisa ukuba usebenzisa i-epoxy ngendlela efanayo kwaye elawulwayo ukuqinisekisa ukugubungela ngokupheleleyo amacandelo.

Waphephe amaqamza omoya: Gwema ukubambisa ama-bubbles emoyeni kwi-epoxy, njengoko inokuchaphazela ukusebenza kunye nokuthembeka kwamacandelo angaphantsi. Sebenzisa iindlela ezifanelekileyo zokukhupha, ezinje ngoxinzelelo olucothayo noluzinzileyo, kwaye ngocoselelo ushenxise nawaphina amaqamza omoya avaleleke ngesitshixo okanye ucofe indibano.

Inyathelo 5: Nyanga i-epoxy

Ukunyanga i-epoxy: Landela imiyalelo yomenzi yokunyanga i-epoxy engagcwaliswanga. Ngokuxhomekeke kwizinto ezisetyenzisiweyo ze-epoxy, oku kunokubandakanya ukulungiswa kweqondo lokushisa okanye ukusebenzisa umthombo wokushisa.

Vumela ixesha elifanelekileyo lokunyanga: Nika i-epoxy ixesha elaneleyo lokunyanga ngokupheleleyo phambi kokuphatha okanye ukuqhubela phambili amacandelo. Ngokuxhomekeke kwimpahla ye-epoxy kunye neemeko zokunyanga, oku kungathatha iiyure eziliqela ukuya kwiintsuku ezimbalwa.

Inyathelo lesi-6: Coca kwaye uhlole

Coca i-epoxy engaphezulu: Emva kokuba i-epoxy iphilisiwe, susa nayiphi na i-epoxy engaphezulu usebenzisa iindlela ezifanelekileyo zokucoca, ezifana nokukhuhla okanye ukusika.

Jonga izinto ezingazaliswanga ngokwaneleyo: Jonga izinto ezingazaliswanga nganeno kuzo naziphi na iziphene, ezifana ne-voids, i-delamination, okanye i-inshorensi engaphelelanga. Ukuba kukho naziphi na iziphene ezifunyenweyo, thatha amanyathelo afanelekileyo okulungisa, njengokuzalisa kwakhona okanye ukunyanga kwakhona, njengoko kuyimfuneko.

Uzalisa nini ngaphantsi kwe-Epoxy

Ixesha lokuzaliswa ngaphantsi kwesicelo se-epoxy liya kuxhomekeka kwinkqubo ethile kunye nesicelo. I-epoxy engagcwaliswanga ngokuqhelekileyo isetyenziswa emva kokuba i-microchip ifakwe kwibhodi yesekethe kwaye iijoyinti ze-solder zenziwe. Ukusebenzisa i-dispenser okanye i-syringe, i-epoxy ye-underfill ikhutshwe kwisithuba esincinci phakathi kwe-microchip kunye nebhodi yesiphaluka. I-epoxy iye iphiliswe okanye iqiniswe, ngokuqhelekileyo iyifudumeza kwiqondo elithile lobushushu.

Ixesha elichanekileyo lokusetyenziswa kwe-epoxy engaphantsi kokusetyenziswa kunokuxhomekeka kwizinto ezifana nohlobo lwe-epoxy esetyenzisiweyo, ubungakanani kunye nejometri yesikhewu ekufuneka sizaliswe, kunye nenkqubo ethile yokunyanga. Ukulandela imiyalelo yomenzi kunye nendlela ecetyiswayo ye-epoxy ethile esetyenziswayo kubalulekile.

Nazi ezinye iimeko zemihla ngemihla xa i-epoxy engagcwaliswanga ingasetyenziswa:

Ukudityaniswa kwe-Flip-chip: I-epoxy engagcwaliswanga idla ngokusetyenziswa kwi-flip-chip bonding, indlela yokuqhoboshela i-semiconductor chip ngokuthe ngqo kwi-PCB ngaphandle kocingo oludibanisayo. Emva kokuba i-flip-chip incanyathiselwe kwi-PCB, i-epoxy engagcwaliswanga ngokuqhelekileyo isetyenziselwa ukuvala isithuba phakathi kwe-chip kunye ne-PCB, ukubonelela ngokuqiniswa koomatshini kunye nokukhusela i-chip kwizinto zokusingqongileyo ezifana nokufuma kunye nokutshintsha kweqondo lokushisa.

Itekhnoloji ye-Surface Mount (SMT): I-epoxy yokugcwalisa i-underfill ingasetyenziswa kwiinkqubo ze-surface Mount technology (SMT), apho iikhomponenti ze-elektroniki ezifana neesekethe ezidibeneyo (ICs) kunye nezixhasi zixhonywa ngqo kumphezulu we-PCB. I-epoxy yokuzalisa ngaphantsi ingasetyenziswa ukuqinisa nokukhusela la malungu emva kokuthengiswa kwi-PCB.

Indibano ye-Chip-on-board (COB): Kwindibano ye-chip-on-board (COB), ii-chips ze-semiconductor ezingenanto zifakwe ngokuthe ngqo kwi-PCB usebenzisa i-conductive adhesives, kwaye i-epoxy engagcwaliswanga ingasetyenziselwa ukugubungela kunye nokuqinisa ii-chips, ukuphucula ukuzinza kwabo komatshini kunye nokuthembeka.

Ukulungiswa kwinqanaba lecandelo: I-epoxy engazaliswanga kakuhle isenokusetyenziswa kwiinkqubo zokulungiswa kwecandelo, apho izinto zombane ezonakeleyo okanye ezingalunganga kwi-PCB zitshintshwa zifakwe ezintsha. I-epoxy engagcwaliswanga ingasetyenziswa kwindawo yokutshintshwa ukuze kuqinisekiswe ukubambelela ngokufanelekileyo kunye nokuzinza komatshini.

Ngaba i-Epoxy Filler ayinamanzi

Ewe, isigcwali se-epoxy sihlala singenamanzi xa sele sipholile. Izihluzi ze-Epoxy ziyaziwa ngokunamathela kwazo okugqwesileyo kunye nokumelana namanzi, nto leyo ezenza zibe lukhetho oludumileyo kwiinkqubo ezahlukeneyo ezifuna ibhondi eyomeleleyo nengenamanzi.

Xa isetyenziswa njengesizalisi, i-epoxy inokugcwalisa ngokufanelekileyo iintanda kunye nezikhala kwizinto ezahlukeneyo, kubandakanya umthi, isinyithi kunye nekhonkrithi. Yakuba iphilisiwe, yenza indawo eqinileyo, eyomeleleyo ukumelana namanzi kunye nokufuma, iyenza ilungele ukusetyenziswa kwiindawo ezivezwe ngamanzi okanye ukufuma okuphezulu.

Nangona kunjalo, kubalulekile ukuqaphela ukuba ayizizo zonke iifayili ze-epoxy ezenziwe ngokulinganayo, kwaye ezinye zinokuba namanqanaba ahlukeneyo okumelana namanzi. Kuhlala kululuvo olulungileyo ukujonga ileyibhile yemveliso ethile okanye udibane nomvelisi ukuze uqinisekise ukuba iyilungele iprojekthi yakho kunye nokusetyenziswa okucetywayo.

Ukuqinisekisa iziphumo ezilungileyo, kubalulekile ukulungisa ngokufanelekileyo umphezulu ngaphambi kokufaka i-epoxy filler. Oku kubandakanya ukucoca indawo ngokucokisekileyo kunye nokususa nayiphi na into ekhululekile okanye eyonakeleyo. Emva kokuba umgangatho ulungiswe ngokuchanekileyo, i-epoxy filler ingaxutywa kwaye isetyenziswe ngokwemiyalelo yomenzi.

Kwakhona kubalulekile ukuqaphela ukuba ayizizo zonke iifayili ze-epoxy ezenziwe ngokulinganayo. Ezinye iimveliso zinokulungela usetyenziso oluthile okanye umphezulu kunezinye, ngoko ke ukukhetha imveliso efanelekileyo yomsebenzi kubalulekile. Ukongezelela, ezinye iifayili ze-epoxy zinokufuna iingubo ezongezelelweyo okanye izitywini ukunika ukhuseleko lokungangeni kwamanzi ixesha elide.

Iifayili ze-Epoxy zidume ngeempawu zazo zokuthintela amanzi kunye nokukwazi ukwenza ibhondi eyomeleleyo kwaye ehlala ixesha elide. Nangona kunjalo, ukulandela iindlela ezifanelekileyo zokusetyenziswa kunye nokukhetha imveliso efanelekileyo kubalulekile ukuqinisekisa iziphumo ezilungileyo.

Ukuzalisa inkqubo ye-Epoxy Flip Chip

Nanga amanyathelo okwenza inkqubo ye-epoxy flip chip engagcwaliswanga:

Ukucoca: I-substrate kunye ne-flip chip ziyacocwa ukuze kususwe naluphi na uthuli, i-debris, okanye i-contaminants enokuphazamisana ne-epoxy bond engagcwaliswanga.

Ukuhambisa: I-epoxy engagcwaliswanga ichithwa kwi-substrate ngendlela elawulwayo, isebenzisa i-dispenser okanye inaliti. Inkqubo yokukhutshwa kufuneka ichaneke ukuthintela nakuphi na ukuphuphuma okanye ukuvaleka.

Ulungelelwaniso: I-chip chip ke ihambelana ne-substrate usebenzisa i-microscope ukuqinisekisa ukubekwa ngokuchanekileyo.

Hlaziya kwakhona: I-flip chip iphinda iqhutywe ngokusebenzisa i-oven okanye i-oven ukunyibilikisa amaqhuma e-solder kwaye ibophe i-chip kwi-substrate.

Ukunyanga: I-epoxy engagcwaliswanga iphiliswa ngokuyifudumeza kwi-oven kwiqondo lokushisa elithile kunye nexesha. Inkqubo yokunyanga ivumela i-epoxy ukuba ihambe kwaye igcwalise naziphi na izikhewu phakathi kwe-flip chip kunye ne-substrate.

Ukucoca: Emva kwenkqubo yokunyanga, nayiphi na i-epoxy engaphezulu isuswe kwimida ye-chip kunye ne-substrate.

ukuhlolwa: Isinyathelo sokugqibela kukuhlola i-flip chip phantsi kwe-microscope ukuqinisekisa ukuba akukho zithuba okanye izithuba kwi-epoxy engagcwaliswanga.

Emva kokunyanga: Kwezinye iimeko, inkqubo yokunyanga emva kokunyanga ingaba yimfuneko ekuphuculeni i-mechanical and thermal properties of the epoxy underfilled underfilled. Oku kubandakanya ukufudumeza itshiphu kwakhona kubushushu obuphezulu kangangexesha elongeziweyo ukuze kuphunyezwe uqhagamshelo olupheleleyo lwe-epoxy.

Uvavanyo lombane: Emva kokuzaliswa kwe-epoxy flip-chip inkqubo, isixhobo siyavavanywa ukuqinisekisa ukuba sisebenza kakuhle. Oku kunokubandakanya ukujonga iibhulukhwe ezimfutshane okanye ukuvula kwisekethe kunye nokuvavanya iimpawu zombane zesixhobo.

Ukupakisha: Emva kokuba isixhobo sivavanyiwe kwaye siqinisekisiwe, sinokupakishwa kwaye sithunyelwe kumthengi. Ukupakishwa kunokubandakanya ukukhuselwa okongeziweyo, okufana nokukhusela okukhuselekileyo okanye i-encapsulation, ukuqinisekisa ukuba isixhobo asonakaliswa ngexesha lokuthutha okanye ukuphatha.

Indlela ye-Epoxy yokuzalisa i-Bga

Inkqubo ibandakanya ukuzaliswa kwesithuba phakathi kwe-chip ye-BGA kunye nebhodi yesiphaluka nge-epoxy, enika inkxaso eyongezelelweyo yomatshini kunye nokuphucula ukusebenza kwe-thermal yokudibanisa. Nanga amanyathelo abandakanyekayo kwi-epoxy underfill BGA indlela:

• Lungisa iphakheji ye-BGA kunye ne-PCB ngokuyicoca nge-solvent ukususa ukungcola okunokuthi kuchaphazele ibhondi.
• Faka isixa esincinci sokuguquguquka kumbindi wephakheji ye-BGA.
• Beka ipakethe ye-BGA kwi-PCB kwaye usebenzise i-oven yokubuyisela ukuthengisa iphakheji ebhodini.
• Faka isicelo esincinci se-epoxy underfill kwikona yephakheji ye-BGA. I-underfill kufuneka isetyenziswe kwikona esondeleyo kumbindi wepakethe, kwaye akufanele ifake nayiphi na iibhola ze-solder.
• Sebenzisa isenzo se-capillary okanye i-vacuum ukuzoba i-underfill phantsi kwephakheji ye-BGA. I-underfill kufuneka ijikeleze iibhola ze-solder, igcwalise nayiphi na i-voids kwaye idale ibhondi eqinile phakathi kwe-BGA kunye ne-PCB.
• Nyanga ukugcwalisa ngaphantsi ngokwemiyalelo yomenzi. Oku ngokuqhelekileyo kubandakanya ukufudumeza indibano kwiqondo lobushushu elithile ixesha elithile.
• Coca indibano nge-solvent ukususa nayiphi na i-flux engaphezulu okanye i-underfill.
• Jonga i-underfill ye-voids, amaqamza, okanye ezinye iziphene ezinokubeka esichengeni ukusebenza kwetshiphu ye-BGA.
• Coca nayiphi na i-epoxy engaphezulu kwi-chip ye-BGA kunye nebhodi yesekethe usebenzisa i-solvent.
• Vavanya itshiphu ye-BGA ukuqinisekisa ukuba isebenza ngokufanelekileyo.

I-Epoxy underfill ibonelela ngenani leenzuzo kwiipakethi ze-BGA, kubandakanywa amandla aphuculweyo omatshini, ukunciphisa uxinzelelo kumalungu e-solder, kunye nokwanda kokuchasana nokuhamba ngebhayisikile eshushu. Noko ke, ukulandela imiyalelo umenzi ngononophelo iqinisekisa bond robust kwaye ethembekileyo phakathi BGA package kunye PCB.

Uyenza njani i-Underfill Epoxy Resin

Ukugcwalisa i-epoxy resin luhlobo lokuncamathelisa olusetyenziselwa ukuzalisa izithuba kunye nokomeleza amacandelo e-elektroniki. Nanga amanyathelo abanzi okwenza i-epoxy resin engagcwaliswanga:

• izithako:
• Intlaka epoxy
• Ukuqinisa
• Izixhobo zokugcwalisa (ezifana ne-silica okanye amaso eglasi)
• Izinyibilikisi (ezifana ne-acetone okanye isopropyl alcohol)
• IiCatalysts (uyazikhethela)

amanyathelo:

Khetha i-epoxy resin efanelekileyo: Khetha i-epoxy resin efanele isicelo sakho. I-epoxy resins iza kwiindidi ezahlukeneyo ezineempawu ezahlukeneyo. Kwizicelo zokuzaliswa ngaphantsi, khetha i-resin enamandla amakhulu, ukushwabana okuphantsi, kunye nokubambelela kakuhle.

Hlanganisa i-epoxy resin kunye ne-hardener: Uninzi lweeresin ze-epoxy ezingaphantsi zingena kwikhithi enamacandelo amabini, kunye ne-resin kunye ne-hardener epakishwe ngokwahlukeneyo. Xuba iinxalenye ezimbini kunye ngokwemiyalelo yomenzi.

Yongeza imathiriyeli yesihluzi: Yongeza izinto zokuzalisa kumxube we-epoxy resin ukwandisa i-viscosity yayo kunye nokubonelela ngenkxaso eyongezelelweyo yesakhiwo. I-silica okanye amaso eglasi asetyenziswa ngokuqhelekileyo njengezizalisi. Yongeza ii-fillers kancinci kwaye udibanise ngokucokisekileyo de kube ukuhambelana okufunwayo kufezekiswe.

Yongeza izinyibilikisi: Izinyibilikisi zingongezwa kumxube we-epoxy resin ukuphucula ukuhamba kwawo kunye neempawu zokumanzisa. I-acetone okanye i-isopropyl alcohol zisetyenziswa ngokuqhelekileyo izinyibilikisi. Yongeza i-solvents kancinane kwaye udibanise ngokucokisekileyo de kube ukuhambelana okufunwayo kufezekiswe.

Ukhetho: Yongeza i-catalysts: Ii-Catalysts zinokongezwa kumxube we-epoxy resin ukukhawulezisa inkqubo yokunyanga. Nangona kunjalo, izinto ezibangelayo zinokunciphisa ubomi bembiza yomxube, ngoko ke zisebenzise ngononophelo. Landela imiyalelo yomenzi malunga nesixa esifanelekileyo se-catalyst ukuba udibanise.

Faka i-epoxy resin engaphantsi kokugcwalisa umxube we-epoxy resin kwi-gap okanye kwi-joint. Sebenzisa isirinji okanye i-dispenser ukusebenzisa umxube ngokuchanekileyo kwaye uphephe amaqamza omoya. Qinisekisa ukuba umxube usasazwe ngokulinganayo kwaye ugqume yonke imiphezulu.

Ukunyanga i-epoxy resin: I-epoxy resin inokunyanga ngokwemiyalelo yomenzi. Uninzi lwee-epoxy resins ezingaphantsi konyango kwiqondo lobushushu begumbi, kodwa ezinye zinokufuna amaqondo obushushu aphakamileyo ukunyangwa ngokukhawuleza.

 Ngaba kukho nayiphi na imida okanye imiceli mngeni eyayanyaniswa ne-Epoxy Underfill?

Ewe, kukho imida kunye nemingeni ehambelana ne-epoxy underfill. Eminye imida eqhelekileyo kunye nemingeni yile:

Ukungahambelani kokwandiswa kobushushu: I-epoxy underfills ine-coefficient yokwandiswa kwe-thermal (CTE) eyahlukileyo kwi-CTE yamacandelo asetyenziselwa ukuzalisa. Oku kunokubangela uxinzelelo lwe-thermal kwaye kunokukhokelela ekungaphumelelini kwecandelo, ngakumbi kwiindawo ezinobushushu obuphezulu.

Ukusetyenzwa kwemingeni: I-Epoxy igcwalisa izixhobo ezikhethekileyo zokucwangcisa kunye nobuchule, kubandakanya ukukhupha kunye nezixhobo zokunyanga. Ukuba akwenziwanga ngokuchanekileyo, i-underfill ayinakuzalisa ngokufanelekileyo izithuba phakathi kwamacandelo okanye inokubangela umonakalo kumacandelo.

Ubuzaza bokufuma: I-epoxy underfills ivakalelwa kukufuma kwaye inokufunxa ukufuma kokusingqongileyo. Oku kunokubangela imiba ngokubambelela kwaye kunokukhokelela ekungaphumelelini kwecandelo.

Ukuhambelana kwemichiza: I-epoxy underfill inokusabela ngezinto ezithile ezisetyenziswa kwizinto ze-elektroniki, ezinje ngeemaski ze-solder, izinto zokuncamathelisa, kunye ne-fluxes. Oku kunokubangela imiba ngokubambelela kwaye kunokukhokelela ekungaphumelelini kwecandelo.

Iindleko: I-epoxy underfills inokubiza kakhulu kunezinye izinto ezingaphantsi, ezifana ne-capillary underfills. Oku kunokwenza ukuba zingabi nomtsalane kangako ukuba zisetyenziswe kwiindawo zokuvelisa umthamo ophezulu.

Iinkxalabo zokusingqongileyo: I-Epoxy underfill ingaba neekhemikhali ezinobungozi kunye nezixhobo, ezifana ne-bisphenol A (BPA) kunye ne-phthalates, enokuthi ibeke umngcipheko kwimpilo yabantu kunye nokusingqongileyo. Abavelisi kufuneka bathathe amanyathelo okhuseleko afanelekileyo ukuqinisekisa ukuphatha nokulahlwa okukhuselekileyo kwezi zixhobo.

 Ixesha lokuphumla: I-epoxy underfill ifuna ixesha elithile lokunyanga ngaphambi kokuba isetyenziswe kwisicelo. Ixesha lokunyanga linokwahluka ngokuxhomekeke kuqulunqo oluthile lwe-underfill, kodwa ngokuqhelekileyo lusuka kwimizuzu emininzi ukuya kwiiyure ezininzi. Oku kunokunciphisa inkqubo yokuvelisa kunye nokwandisa ixesha lokuvelisa lonke.

Ngelixa i-epoxy underfills ibonelela ngeenzuzo ezininzi, kubandakanya ukuthembeka okuphuculweyo kunye nokuqina kwezixhobo ze-elektroniki, zikwabonisa imingeni kunye nemida ekufuneka iqwalaselwe ngononophelo phambi kokusetyenziswa.

Ziziphi izinto eziluncedo zokusebenzisa i-Epoxy Underfill?

Nazi ezinye zezibonelelo zokusebenzisa i-epoxy underfill:

Inyathelo 1: Ukwenyuka kokuthembeka

Enye yezona zinto zibalulekileyo zokusebenzisa i-epoxy underfill kukwenyuka kokuthembeka. Amacandelo e-elektroniki asemngciphekweni wokonakala ngenxa yoxinzelelo lwe-thermal kunye noomatshini, njengokuhamba ngebhayisikile eshushu, ukungcangcazela, kunye nokothuka. I-epoxy underfill inceda ukukhusela i-solder joints kumacandelo e-elektroniki kumonakalo ngenxa yolu xinzelelo, olunokunyusa ukuthembeka kunye nobomi besixhobo sombane.

Inyathelo 2: Ukusebenza okuphuculweyo

Ngokunciphisa umngcipheko womonakalo kwizinto ze-elektroniki, i-epoxy underfill inokunceda ukuphucula ukusebenza kwesixhobo ngokubanzi. Amacandelo e-elektroniki angaqiniswanga ngokuchanekileyo anokubandezeleka ngenxa yokuncipha kokusebenza okanye ukungaphumeleli ngokupheleleyo, kwaye i-epoxy underfill inokunceda ukuthintela le miba, ekhokelela kwisixhobo esithembeke ngakumbi nesisebenza kakhulu.

Inyathelo lesi-3: Ulawulo olungcono lwe-thermal

I-epoxy underfill ine-conductivity egqwesileyo ye-thermal, enceda ukukhupha ubushushu kumacandelo e-elektroniki. Oku kunokuphucula ulawulo lwe-thermal yesixhobo kunye nokukhusela ukushisa. Ukushisa ngokugqithiseleyo kunokubangela umonakalo kwizinto ze-elektroniki kwaye kukhokelela kwimicimbi yokusebenza okanye ukusilela ngokupheleleyo. Ngokubonelela ngolawulo olusebenzayo lwe-thermal, i-epoxy underfill inokuthintela ezi ngxaki kwaye iphucule ukusebenza ngokubanzi kunye nobomi besixhobo.

Inyathelo lesi-4: Ukomelezwa kwamandla oomatshini

I-Epoxy underfill inikezela ngenkxaso eyongezelelweyo yomatshini kumacandelo e-elektroniki, anokunceda ukukhusela umonakalo ngenxa yokungcangcazela okanye ukothuka. Amalungu e-elektroniki angaqiniswanga ngokwaneleyo anokubandezeleka ngenxa yoxinzelelo lomatshini, olukhokelela ekwenzakala okanye ukusilela ngokupheleleyo. I-Epoxy inokunceda ukukhusela le miba ngokubonelela ngamandla ongezelelweyo omatshini, okukhokelela kwisixhobo esithembekileyo kunye nesigxina.

Inyathelo lesi-5: Ukunciphisa i-warpage

I-Epoxy underfill inokunceda ukunciphisa i-warpage ye-PCB ngexesha lenkqubo yokuthengisela, nto leyo inokukhokelela ekuphuculeni ukuthembeka kunye nomgangatho ongcono we-solder joint. I-PCB warpage inokubangela imiba ngolungelelwaniso lwamacandelo e-elektroniki, ekhokelela kwiziphene eziqhelekileyo ze-solder ezinokubangela imiba yokuthembeka okanye ukusilela ngokupheleleyo. I-epoxy underfill inokunceda ukukhusela le miba ngokunciphisa i-warpage ngexesha lokuvelisa.

Isetyenziswa njani i-Epoxy Underfill kwi-Electronics Manufacturing?

Nanga amanyathelo abandakanyekayo ekusebenziseni i-epoxy underfill kwimveliso yombane:

Ukulungiselela amacandelo: Amalungu e-elektroniki kufuneka ayilwe phambi kokufaka i-epoxy underfill. Amacandelo ahlanjululwa ukuze asuse naluphi na ukungcola, uthuli, okanye i-debris enokuphazamisa ukunamathela kwe-epoxy. Amacandelo abekwe kwi-PCB kwaye abanjwe ngokusebenzisa i-adhesive yethutyana.

Ukuhambisa i-epoxy: I-epoxy underfill isasazwa kwi-PCB kusetyenziswa umatshini wokukhupha. Umatshini wokukhupha ulinganiswe ukuba ukhuphe i-epoxy kwisixa esichanekileyo kunye nendawo. I-epoxy ichithwa kumlambo oqhubekayo ecaleni komda wecandelo. Umjelo we-epoxy kufuneka ube mde ngokwaneleyo ukugubungela wonke umsantsa phakathi kwento kunye nePCB.

Ukusasaza i-epoxy: Emva kokuyikhupha, kufuneka isasazwe ukuvala umsantsa phakathi kwecandelo kunye nePCB. Oku kunokwenziwa ngesandla usebenzisa ibrashi encinci okanye umatshini wokusasaza ozenzekelayo. I-epoxy kufuneka isasazwe ngokulinganayo ngaphandle kokushiya nayiphi na i-voids okanye amaqamza omoya.

Ukunciphisa i-epoxy: Ukuzaliswa ngaphantsi kwe-epoxy emva koko kulungiswe ukwenza lukhuni kunye nokwenza ibhondi eqinileyo phakathi kwecandelo kunye ne-PCB. Inkqubo yokunyanga ingenziwa ngeendlela ezimbini: i-thermal okanye i-UV. Ekunyangelweni kwe-thermal, i-PCB ifakwe kwi-oven kwaye ifudunyezwe kwiqondo lokushisa elithile ngexesha elithile. Ekunyangelweni kwe-UV, i-epoxy ibonakaliswe kukukhanya kwe-ultraviolet ukuqalisa inkqubo yokunyanga.

Ukucoca: Emva kokuba i-epoxy underfills iphiliswe, i-epoxy engaphezulu inokususwa ngokusebenzisa i-scraper okanye i-solvent. Kubalulekile ukususa nayiphi na i-epoxy engaphezulu ukuyikhusela ekuphazamiseni ukusebenza kwecandelo le-elektroniki.

Zeziphi ezinye zezicelo eziqhelekileyo ze-Epoxy Underfill?

Nazi ezinye iinkqubo eziqhelekileyo zokuzaliswa ngaphantsi kwe-epoxy:

Ukupakishwa kweSemiconductor: I-Epoxy underfill isetyenziswa ngokubanzi kwipakethe yezixhobo ze-semiconductor, njenge-microprocessors, iisekethe ezidibeneyo (ICs), kunye neepakethe ze-flip-chip. Kule sicelo, i-epoxy underfill igcwalisa i-gap phakathi kwe-chip ye-semiconductor kunye ne-substrate, ukubonelela ngokuqiniswa komatshini kunye nokuphucula i-thermal conductivity ukukhupha ukushisa okwenziwa ngexesha lokusebenza.

Ibhodi yesekethe eprintiweyo (PCB) indibano: I-epoxy underfill isetyenziswa kumzimba weePCBs ukukhulisa ukuthembeka kwamalungu e-solder. Isetyenziswa kwicala elingaphantsi lamacandelo afana noluhlu lwegridi yebhola (i-BGA) kunye nezixhobo zephakheji yesikali se-chip (CSP) ngaphambi kokuphinda kufakwe i-soldering. I-epoxy underfills ingena kwizikhewu phakathi kwecandelo kunye ne-PCB, yenza ibhondi eyomeleleyo enceda ukuthintela ukusilela kwamalungu e-solder ngenxa yoxinzelelo lomatshini, njengokuhamba ngebhayisikile eshushu kunye nomothuko / ukungcangcazela.

I-Optoelectronics: I-epoxy underfill ikwasetyenziselwa ukupakisha izixhobo ze-optoelectronic, ezifana ne-light-emitting diodes (LEDs) kunye ne-laser diode. Ezi zixhobo zivelisa ubushushu ngexesha lokusebenza, kwaye i-epoxy underfills inceda ukutshabalalisa obu bushushu kunye nokuphucula ukusebenza kwe-thermal yesixhobo. Ukongeza, i-epoxy underfill ibonelela ngokuqiniswa koomatshini ukukhusela izinto ezibuthathaka ze-optoelectronic kuxinzelelo lomatshini kunye nezinto zokusingqongileyo.

Iimoto zombane: I-epoxy underfill isetyenziswa kwi-automotive electronics kwizicelo ezahlukeneyo, ezifana neeyunithi zokulawula injini (ECUs), iiyunithi zolawulo losasazo (TCUs), kunye nezinzwa. Ezi zixhobo ze-elektroniki ziphantsi kweemeko ezinzima zokusingqongileyo, kuquka amaqondo obushushu aphezulu, ukufuma kunye nokungcangcazela. I-epoxy underfill ikhusela kule meko, iqinisekisa ukusebenza okuthembekileyo kunye nokuqina kwexesha elide.

Consumer electronics: I-Epoxy underfill isetyenziswa kwizixhobo ezahlukeneyo zombane zabathengi, kubandakanya ii-smartphones, iitafile, iikhonsoli zokudlala, kunye nezixhobo ezinokunxitywa. Inceda ukuphucula ezi zixhobo 'ingqibelelo yomatshini kunye nokusebenza kwe-thermal, ukuqinisekisa ukusebenza okuthembekileyo phantsi kweemeko ezahlukeneyo zokusetyenziswa.

I-Aerospace kunye nokhuselo: I-epoxy underfill isetyenziswa kwi-aerospace kunye nezicelo zokukhusela, apho izixhobo ze-elektroniki kufuneka zimelane neendawo ezingqongileyo ezigqithisileyo, ezifana nokushisa okuphezulu, ukuphakama okuphezulu, kunye nokungcangcazela okukhulu. I-Epoxy underfill ibonelela uzinzo lomatshini kunye nolawulo lobushushu, iyenze ilungele indawo enqabileyo kunye nebanga.

Zeziphi Iinkqubo zokuNyanga zokungagcwaliswa kwe-epoxy?

Inkqubo yokunyanga i-epoxy underfill ibandakanya la manyathelo alandelayo:

Ukuhambisa: I-epoxy underfill idla ngokukhutshwa njengemathiriyeli engamanzi kwi-substrate okanye itshiphu kusetyenziswa isixhobo sokukhupha okanye ijetting system. I-epoxy isetyenziswe ngendlela echanekileyo ukugubungela yonke indawo efunekayo ukuba ingagcwaliswa.

Ufakelo: Emva kokuba i-epoxy ikhutshwe, i-chip idla ngokubekwa phezu kwe-substrate, kwaye i-epoxy underfill ijikeleza kwaye ingaphantsi kwe-chip, iyifake. Izinto ze-epoxy zenzelwe ukuhamba ngokulula kwaye zizalise izikhewu phakathi kwe-chip kunye ne-substrate ukwenza umaleko ofanayo.

Ukunyanga kwangaphambili: I-epoxy underfill idla ngokunyangwa kwangaphambili okanye ngokuyinxenye iphiliswe kwijeli-efana nokungaguquguquki emva kokufakwa kwe-encapsulation. Oku kwenziwa ngokubeka indibano kwinkqubo yokunyanga yobushushu obuphantsi, njengokubhaka kwe-oven okanye i-infrared (IR). Inyathelo lokunyanga kwangaphambili linceda ukunciphisa i-epoxy's viscosity kwaye ithintele ukuba ingaphumi kwindawo engaphantsi komhlaba ngexesha lokunyanga okulandelayo.

Emva kokunyanga: Emva kokuba i-epoxy underfills ihlanjululwe kwangaphambili, indibano iphantsi kwenkqubo yokunyanga yobushushu obuphezulu, ngokuqhelekileyo kwi-oven convection okanye kwigumbi lokunyanga. Eli nyathelo libizwa ngokuba yi-post-curing okanye ukunyanga kokugqibela, kwaye lenziwa ukunyanga ngokupheleleyo izinto ze-epoxy kunye nokufezekisa iimpawu zayo eziphezulu zoomatshini kunye ne-thermal. Ixesha kunye nobushushu benkqubo yokunyanga emva kokunyanga zilawulwa ngokucophelela ukuze kuqinisekiswe ukunyangwa okupheleleyo kwe-epoxy underfill.

Ukupholisa: Emva kwenkqubo yokunyanga, indibano idla ngokuvunyelwa ukuba iphole phantsi kwiqondo lobushushu begumbi kancinci. Ukupholisa ngokukhawuleza kunokubangela uxinzelelo lwe-thermal kwaye kuchaphazele ingqibelelo ye-epoxy underfill, ngoko ke ukupholisa okulawulwayo kubalulekile ukuphepha nayiphi na imiba enokubakho.

ukuhlolwa: Nje ukuba i-epoxy underfill iphiliswe ngokupheleleyo, kwaye indibano sele ipholile, iyahlolwa ngokuqhelekileyo naziphi na iziphene okanye i-voids kwizinto ezingazaliyo. I-X-reyi okanye ezinye iindlela zokuvavanya ezingonakalisi zingasetyenziselwa ukujonga umgangatho we-epoxy underfill kunye nokuqinisekisa ukuba ibophe ngokufanelekileyo i-chip kunye ne-substrate.

Zeziphi Iindidi ezohlukeneyo zeMathiriyeli yokuNgaphantsi kwe-Epoxy ekhoyo?

Iindidi ezininzi ze-epoxy underfill materials ziyafumaneka, nganye ineempawu zayo kunye neempawu zayo. Ezinye zeentlobo eziqhelekileyo ze-epoxy underfill materials zezi:

I-Capillary Underfill: Izixhobo ze-Capillary underfill ziyi-low-viscosity epoxy resins ezihamba kwizithuba ezimxinwa phakathi kwe-chip semiconductor kunye ne-substrate yayo ngexesha lenkqubo yokungafihli. Ziyilelwe ukuba zibe ne-viscosity ephantsi, ezivumela ukuba zihambe ngokulula kwizithuba ezincinci ngesenzo se-capillary, kwaye emva koko ukunyanga ukwenza i-rigid, i-thermosetting material ebonelela ngokuqiniswa komatshini kwindibano ye-chip-substrate.

Akukho-Mphumo ngaphantsi kokuZaliswayo: Njengoko igama libonisa, izixhobo zokungazaliswanga ngaphantsi kwamanzi azihambi ngexesha lenkqubo yokuzaliswa ngaphantsi. Ngokuqhelekileyo zenziwe nge-high-viscosity epoxy resins kwaye zisetyenziswe njenge-epoxy paste ekhutshwe ngaphambili okanye ifilimu kwi-substrate. Ngethuba lenkqubo yendibano, i-chip ibekwe phezu kwe-no-flow underfill, kwaye indibano iphantsi kobushushu kunye noxinzelelo, ibangela ukuba i-epoxy iphilise kwaye yenze into eqinile egcwalisa izikhewu phakathi kwe-chip kunye ne-substrate.

Ukungagcwalisi okubunjiweyo: Izinto ezibunjiweyo zokuzaliswa ngaphantsi zi-resins ze-epoxy ezibunjwe ngaphambili ezibekwe kwi-substrate kwaye zifudunyezwe ukuba zihambe kwaye zifake i-chip ngexesha lenkqubo yokungagcwaliswa. Ngokuqhelekileyo zisetyenziswa kwizicelo apho ukwenziwa kwevolyum ephezulu kunye nolawulo oluchanekileyo lokubekwa kwemathiriyeli engagcwaliswanga kufuneka.

IWafer-Level yokungagcwaliswa: Izixhobo zokuzaliswa ngaphantsi kwenqanaba le-wafer ziiresin ze-epoxy ezisetyenziswa kuwo wonke umphezulu we-wafer ngaphambi kokuba iitshiphusi zomntu ngamnye zibekwe ecaleni. I-epoxy iye yaphiliswa, yenze into eyomeleleyo enika ukhuseleko olungagcwaliswanga kuzo zonke iitshiphusi ezikwiwafa. I-Wafer-level underfill idla ngokusetyenziswa kwiinkqubo zokupakishwa kwe-wafer-level (WLP), apho iitshiphusi ezininzi zipakishwa kunye kwiwafer enye ngaphambi kokuba zohlulwe kwiipakethe ezizimeleyo.

Encapsulant Underfill: Izinto ezingaphantsi kwe-encapsulant ziyi-resins epoxy ezisetyenziselwa ukugubungela yonke i-chip kunye ne-substrate assembly, eyenza umqobo okhuselayo ojikeleze amacandelo. Ngokuqhelekileyo zisetyenziswa kwizicelo ezifuna amandla omatshini aphezulu, ukhuseleko lokusingqongileyo, kunye nokuthembeka okuphuculweyo.

Imithombo eNxulumeneyo malunga neGlue encamathelayo ye-Epoxy:

I-Epoxy Encapsulant

Izincamathelisi zenqanaba letshiphu epoxy zizalise ngaphantsi

Amacandelo amabini e-Epoxy Adhesive

Enye i-Epoxy Underfill Encapsulant enye

Ubushushu obuphantsi Unyango lwe-BGA Flip Chip Ngaphantsi kwe-PCB Epoxy

I-Epoxy-Based Chip Underfill kunye ne-COB Encapsulation Materials

I-Flip-Chip kunye ne-BGA i-Underfills Process Epoxy Adhesive Glue

Izibonelelo kunye nezicelo ze-Epoxy Encapsulants ezingagcwalisiyo kwi-Electronics

Indlela yokusebenzisa i-smt underfill epoxy adhesive kwizicelo ezahlukeneyo

I-bga egqwesileyo i-epoxy i-adhesive glue izisombululo zomgangatho ogqwesileyo wokusetyenzwa kwecandelo le-SMT

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