Ityala e-USA: I-American Partner's Chip Underfill Solution
Njengelizwe lobuchwepheshe obuphezulu, kukho iinkampani ezininzi ze-BGA, i-CSP okanye i-Flip Chip e-USA, ngoko ke izinto zokuncamathelisa ezingaphelelanga zifunwa kakhulu.
Omnye wabathengi bethu osuka kwiinkampani zobuchwepheshe obuphezulu e-USA, basebenzisa isisombululo se-DeepMaterial sokuzaliswa ngaphantsi kwe-chip yabo, kwaye iyasebenza ngokugqibeleleyo.
I-DeepMaterial ibonelela ngezixhobo zokusebenza eziphezulu ze-Sintering kunye ne-Die Attach, i-Surface Mount, kunye nezicelo ze-Wave Soldering. Ububanzi beemveliso bubandakanya i-Silver Sinter Technologies, i-Solder Paste, i-Solder Preforms, i-Underfills kunye ne-Edgebond, i-Soldering Alloys, i-Liquid Soldering Flux, i-Cored Wire, i-Surface Mount Adhesives, i-Electronic Cleaners, kunye ne-Stencils.
I-DeepMaterial Chip Underfill Adhesive series yinxalenye enye, izinto ezinyangwa ngubushushu. Iimathiriyeli ziye zaphuculwa ukuze kungenelwe i-capillary underfill kunye nokusebenza kwakhona. Ezi zinto zisekwe epoxy zinokusasazwa kwimida yeBGA, CSP okanye izixhobo zeFlip Chip. Esi sixhobo siya kuthi emva koko sihambe ukuze sigcwalise isithuba esingaphantsi kwala macandelo.
Njengokuba iqulethe i-underfill ye-capillary yecandelo elinye eyenzelwe ukukhuselwa kweepakethi ze-chip ezidibeneyo kwiibhodi zesekethe eziprintiweyo.
Lubushushu obuphezulu beglasi obutshintshayo [Tg] kunye nokwandiswa kwe-thermal coefficient ephantsi [CTE] nganeno. Ezi mpawu zibangela isisombululo esiphezulu sokuthembeka.
Iziphumo zomkhiqizo
· Ibonelela ngecandelo elipheleleyo xa igalelwe kwi-substrate efudunyezwe ngama-70 – 100°C.
· Amaxabiso aphezulu e-Tg kunye ne-CTE ePhantsi aphucula kakhulu ukukwazi ukupasa imeko engqongqo yoVavanyo lokuBhayiseka kwe-Thermal
· Ukusebenza okugqwesileyo kwe-Thermal Cycling Test
· I-Halogen-free kwaye ihambelana ne-RoHS Directive 2015/863/EU
I-Underfill ye-Thermal Fatigue Resistance ekhethekileyo
Yima wedwa i-SAC ye-solder joints kwi-BGA kunye ne-CSP ye-assemblies ithande ukutyhafa kwizicelo zemoto ezishushu. I-Tg ephezulu kunye ne-CTE ephantsi yokungagcwaliswa [UF] sisisombululo sokuqinisa. Njengoko ukuphinda kusetyenzwe kwakhona kungeyomfuneko, oku kuvumela umxholo wokuzalisa ophezulu ekuqulunqeni ukuphuhlisa iimpawu ezinjalo.
I-DeepMaterial Chip Underfill Adhesive series ine-Tg ephezulu ye-165 ° C kunye ne-CTE1 / CTE2 ephantsi ye-31 ppm / 105 ppm, xa idityanisiwe kwaye ivavanywe ukuba iphumelele imijikelo ye-5000 -40 + 125 ° C uvavanyo lokuhamba ngebhayisikili eshushu. Ngomlinganiselo ongcono wokuhamba, tshisa i-substrates ngexesha lokukhupha.
Sikwajonge imveliso ye-DeepMaterial encamathelayo kwishishini lentsebenziswano namahlakani ehlabathi, ukuba ufuna ukuba yiarhente ye-DeepMaterial's:
Umthengisi wokuncamathelisa kwishishini eMelika,
Umthengisi wokuncamathelisa kwishishini eYurophu,
Umthengisi wokuncamathelisa kwishishini e-UK,
Umthengisi wokuncamathelisa kwishishini eIndiya,
Umthengisi wokuncamathelisa kwishishini eOstreliya,
Umthengisi wokuncamathelisa kwishishini eCanada,
Umthengisi wokuncamathelisa kwishishini eMzantsi Afrika,
Umthengisi wokuncamathelisa kwishishini eJapan,
Umthengisi wokuncamathelisa kwishishini eYurophu,
Umthengisi wokuncamathelisa kwishishini eKorea,
Umthengisi wokuncamathelisa kwishishini eMalaysia,
Umthengisi wokuncamathelisa kwishishini kwiiPhilippines,
Umthengisi wokuncamathelisa kwishishini eVietnam,
Umthengisi wokuncamathelisa kwishishini e-Indonesia,
Umthengisi wokuncamathelisa kwishishini eRashiya,
Umthengisi wokuncamathelisa kwishishini eTurkey,
......
Nxibelelana nathi ngoku!
