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I-Industrial Adhesive Glue yamatyala eGlobal

I-DeepMaterial iya kudala ikamva eliqaqambileyo ngekhemistri kunye namaqabane ehlabathi

Ukusebenzisa amandla ekhemistri kunye netekhnoloji, ngasemva ukwenza into entsha. Sisebenzisa itekhnoloji yethu eqokelelweyo ye-synthesis ukuphuhlisa iimveliso ezikhethekileyo kwihlabathi jikelele ezifana ne-backbone ekhethekileyo ye-epoxy resins kunye neepolima ze-acrylic ezisebenzayo.

Sinikezela ngoluhlu olubanzi lweemveliso ezixhasa ukutsha kusetyenziswa itekhnoloji yokuqulunqa ephucukileyo efumana uninzi lwezixhobo. Sibonelela abathengi bethu ngezisombululo ngokukhawuleza nangokwemfuno ngokusebenzisa amava ngokuvubela esiwaphuhlise kwiminyaka emininzi kunye nethala leencwadi lethu elikhulu leeenzymes ezisekwe kwi-actinomycete.

I-DeepMaterial yi-polyurethane esebenzayo i-PUR eshushu inyibilika uxinzelelo kumenzi wokuncamathelisa kunye nomthengisi, ukwenza inxalenye enye yezinto ezincamathelayo ze-epoxy ezincamathelayo, iglu encamathelayo enyibilikayo enyibilikayo, izinto ezincamathelayo zokunyanga i-uv, i-refractive index encamathelayo ebonakalayo, iglu encamathelayo umazibuthe, eyona nto incamathelayo kwiplasitiki encamathelayo encamatheleyo. kunye neglasi, iglu encamathelayo yombane yeemoto zombane kunye neenjini ezincinci kwisixhobo sasekhaya

I-DeepMaterial yeyona glu igqwesileyo encamathelayo engangenwa manzi yeplastiki ukuya kwintsimbi kunye nomenzi weglasi, ubonelele ngeglu encamathelayo epoxy encamathelayo encamathelayo yokuncamathelisa izinto ze-elektroniki ze-pcb, izinto zokuncamathelisa zesemiconductor zokudityaniswa kwe-elektroniki, ubushushu obuphantsi bonyango lwe-bga flip chip underfill pcb epoxy process glue material and so. kwi