Chip Underfill / Packaging
Tšebeliso ea Ts'ebetso ea Tlhahiso ea Chip ea Lihlahisoa tsa DeepMaterial Adhesive
Semiconductor Packaging
Theknoloji ea semiconductor, haholo-holo ho paka lisebelisoa tsa semiconductor, ha ho mohla e kileng ea ama lisebelisoa tse ngata ho feta kajeno. Ha karolo e 'ngoe le e' ngoe ea bophelo ba letsatsi le letsatsi e ntse e eketseha ka bongata - ho tloha likoloing ho ea ho ts'ireletso ea lapeng ho ea ho li-smartphones le lisebelisoa tsa 5G - mekhoa e mecha ea ho paka ka semiconductor e bohareng ba matla a elektroniki a arabelang, a ka tšeptjoang le a matla.
Li-wafers tse tšesaane, litekanyo tse nyane, li-pitches tse ntle, kopanyo ea liphutheloana, moralo oa 3D, mahlale a boemo ba wafer le moruo oa tlhahiso ea bongata li hloka lisebelisoa tse ka tšehetsang litabatabelo tsa boqapi. Mokhoa o felletseng oa tharollo ea Henkel o sebelisa lisebelisoa tse pharalletseng tsa lefats'e ho fana ka theknoloji e phahameng ea semiconductor packaging le ts'ebetso ea tlholisano. Ho tloha ho li-adhesives bakeng sa liphutheloana tsa terata tsa setso ho ea ho li-underfill tse tsoetseng pele le li-encapsulants bakeng sa lits'ebetso tse tsoetseng pele tsa ho paka, Henkel e fana ka theknoloji ea lisebelisoa tsa morao-rao le tšehetso ea lefats'e e hlokoang ke lik'hamphani tse etellang pele tsa microelectronics.
Flip Chip Underfill
Tlatsetso e ka tlaase e sebelisoa bakeng sa botsitso ba mochini oa flip chip. Sena se bohlokoa haholo ha ho soasoa li-ball grid array (BGA) chips. Ho fokotsa coefficient of thermal expansion (CTE), sekhomaretsi se tletse ka li-nanofillers.
Likhomaretsi tse sebelisoang e le li-underfill tsa chip li na le thepa ea phallo ea capillary bakeng sa ts'ebeliso e potlakileng le e bonolo. Hangata ho sebelisoa sekhomaretsi se nang le mefuta e 'meli: libaka tse ka thōko li ts'oaroa ke phekolo ea UV pele libaka tse nang le moriti li phekoloa ka mocheso.
Deepmaterial ke pheko ea mocheso o tlase bga flip chip underfill pcb epoxy process sekhomaretsi sekhomaretsi moetsi le bafani ba thepa e hanyetsanang le mocheso, fana ka karolo e le 'ngoe ea metsoako ea epoxy underfill, epoxy underfill encapsulant, underfill encapsulation lisebelisoa tsa flip chip ka pcpoxy electronic circuit board. e thehiloeng chip underfill le cob encapsulation thepa joalo-joalo.
