Sephutheloana sa BGA se Tlatselletsa Epoxy
Fluidity e Phahameng
Ho hloeka ho phahameng
diphepetso tse
Lihlahisoa tsa elektronike tsa sebaka sa sefofane le ho tsamaea, likoloi, likoloi, mabone a LED a ka ntle, matla a letsatsi le likhoebo tsa sesole tse nang le litlhoko tse phahameng tsa botšepehi, lisebelisoa tsa solder ball array (BGA/CSP/WLP/POP) le lisebelisoa tse khethehileng libotong tsa potoloho kaofela li shebane le microelectronics. Mokhoa oa miniaturization, le li-PCB tse tšesaane tse nang le botenya bo ka tlase ho 1.0mm kapa li-substrates tsa kopano tse tenyetsehang tse phahameng, manonyeletso a solder pakeng tsa lisebelisoa le li-substrates a senyeha habonolo tlas'a khatello ea mochine le mocheso.
Solutions
Bakeng sa sephutheloana sa BGA, DeepMaterial e fana ka tharollo ea ts'ebetso ea underfill - phallo ea capillary e ncha. Filler e ajoa ebe e sebelisoa pheletsong ea sesebelisoa se kopaneng, 'me "capillary effect" ea mokelikeli e sebelisoa ho etsa hore sekhomaretsi se kenelle le ho tlatsa bokatlase ba chip, ebe se futhumatsoa ho kopanya setlolo le chip substrate, manonyeletso a solder le substrate ea PCB.
Melemo ea ts'ebetso ea DeepMaterial underfill
1. Mokelikeli o phahameng, bohloeki bo phahameng, karolo e le 'ngoe, ho tlatsa ka potlako le bokhoni ba ho folisa ka potlako ba likarolo tsa molumo o motle haholo;
2. E ka theha seaparo se tlaase sa ho tlatsa seaparo se se nang letho le se se nang letho, se ka felisang khatello ea kelello e bakoang ke lisebelisoa tsa welding, ho ntlafatsa ts'episo le thepa ea mechine ea likaroloana, le ho fana ka tšireletso e ntle bakeng sa lihlahisoa ho tloha ho oela, ho sotha, ho sisinyeha, mongobo. , joalo-joalo.
3. Tsamaiso e ka lokisoa, 'me boto ea potoloho e ka sebelisoa hape, e leng ho bolokang litšenyehelo haholo.
Deepmaterial ke pheko ea mocheso o tlase bga flip chip underfill pcb epoxy process sekhomaretsi sekhomaretsi moetsi le bafani ba thepa e hanyetsanang le mocheso, fana ka karolo e le 'ngoe ea metsoako ea epoxy underfill, epoxy underfill encapsulant, underfill encapsulation lisebelisoa tsa flip chip ka pcpoxy electronic circuit board. e thehiloeng chip underfill le cob encapsulation thepa joalo-joalo.
