Epoxy Underfill
DeepMaterial, joalo ka moetsi oa sekhomaretsi sa epoxy indastering, re lahlehetsoe ke lipatlisiso mabapi le underfill epoxy, non conductive glues for electronics, non conductive epoxy, adhesives for electronic assembly, underfill adhesive, high refractive index epoxy. Motheong oa seo, re na le theknoloji ea morao-rao ea sekhomaretsi sa epoxy ea indasteri.
DeepMaterial e hlahisitse likhomaretsi tsa indasteri bakeng sa ho paka le ho etsa liteko tsa chip, li-adhesive tsa boemo ba boto ea potoloho, le likhomaretsi bakeng sa lihlahisoa tsa elektroniki. E ipapisitse le likhomaretsi, e thehile lifilimi tse sireletsang, li-filler tsa semiconductor, le lisebelisoa tsa ho paka bakeng sa ts'ebetso ea semiconductor wafer le ho paka le tlhahlobo ea chip.
Ho fana ka likhomaretsi tsa elektroniki le lihlahisoa tsa lisebelisoa tsa elektroniki tse tšesaane le litharollo bakeng sa lik'hamphani tsa terminal tsa puisano, lik'hamphani tsa lisebelisoa tsa elektroniki, lik'hamphani tsa ho paka le ho hlahloba semiconductor, le baetsi ba lisebelisoa tsa puisano, ho rarolla bareki ba boletsoeng ka holimo ts'ireletso ea ts'ebetso, bonding e nepahetseng haholo ea sehlahisoa. , le ts'ebetso ea motlakase.
DeepMaterial e fana ka mefuta e fapaneng ea lihlahisoa tse mabapi le sekhomaretsi sa indasteri bakeng sa motlakase, letoto la sekhomaretsi sa UV le sekhomaretsi sa UV, mofuta o sebetsang oa sekhomaretsi se chesang se qhibilihisang le sekhomaretsi se nang le khatello e matla ea ho qhibiliha ha mocheso, li-epoxy-based chip underfill le letoto la lisebelisoa tsa COB encapsulation, pitsa ea tšireletso ea boto ea potoloho le sekhomaretsi sa conformal. letoto la li-epoxy based conductive silver adhesive series, letoto la sekhomaretsi sa bonding, letoto la lifilimi tse sireletsang tse sebetsang, letoto la lifilimi tse sirelletsang tsa semiconductor.
DeepMaterial e molemo ka ho fetisisa e le karolo e 'ngoe ea epoxy underfill encapsulants suppliers company in china, supply on part underfill epoxy for flip chip devices ball grid arrays chip scale packaging csp bga wcsp lga,pheko e tlase ea mocheso bga flip chip underfill pcb epoxy process adhesive gluenon conduction epoxy material, sekhomaretsi sealant sekhomaretsi bakeng sa underfill pcb likarolo tsa elektronike, semiconductor sekgomaretsi bakeng sa kopano ea elektronike. joalo joalo
