Miconductor-Packaging-&-Testing-UV-Viscosity-Reduction-Special-Film

Semiconductor Packaging & Testing UV Phokotso ea Viscosity Filimi e Khethehileng

Sehlahisoa se sebelisa PO e le thepa ea tšireletso ea holim'a metsi, e sebelisoang haholo bakeng sa ho itšeha QFN, SMD microphone substrate cutting, FR4 substrate cutting (LED).

Category:

Tlhaloso

Product ga tlhaloso di-parameter

Model Model Mofuta sehlahisoa botenya Matla a Peel Pele ho UV Matla a Peel Ka mor'a UV
DM-208A Phokotso ea PO+UV tack 170 μm 800gf/25mm 15gf/25mm
DM-208B Phokotso ea PO+UV tack 170 μm 1200gf/25mm 20gf/25mm
DM-208C Phokotso ea PO+UV tack 170 μm 1500gf/25mm 30gf/25mm