Melemo le Likopo tsa li-Epoxy Encapsulants tse sa Tlatsehang ho Electronics

Underfill epoxy e fetohile karolo ea bohlokoa ho netefatsa ho ts'epahala le ho tšoarella ha lisebelisoa tsa elektroniki. Lintho tsena tse khomarelang li sebelisetsoa ho tlatsa lekhalo pakeng tsa microchip le substrate ea eona, ho thibela khatello ea kelello le tšenyo ea mochine, le ho sireletsa khahlanong le mongobo le maemo a tikoloho. Melemo ea ho tlatsa epoxy atolosetse taolong e ntlafalitsoeng ea mocheso le ts'ebetso.

 

Tšebeliso ea eona e se e tloaelehile liindastering tse fapaneng, ho tloha ho lisebelisoa tsa elektronike tsa bareki ho isa sebakeng sa lifofane le lisebelisoa tsa elektroniki tsa ts'ireletso. Sengoliloeng sena, re tla hlahloba melemo le ts'ebeliso ea underfill epoxy ho elektroniki, mefuta e fapaneng, le lintlha tse lokelang ho nahanoa ha u khetha e nepahetseng.

Melemo ea Underfill Epoxy

Ho na le mekhoa e fapaneng eo batho le lik'hamphani ba ka ruang molemo ka ho sebelisa underfill epoxy. Tsena li tla totobatsoa ka tlase.

 

Ho tšepahala ho matlafalitsoe le ho tšoarella ha lisebelisoa tsa elektroniki

• Ka ho tlatsa lekhalo lipakeng tsa microchips le substrates, ho tlatsa epoxy e thibela tšenyo e bakoang ke khatello ea mochine, ho eketsa nako e telele ea lisebelisoa tsa elektronike.
• E ntlafatsa matla le ho tiea ha maqhama pakeng tsa microchip le substrate, ho fokotsa kotsi ea tšenyo e tsoang ho atoloso ea mocheso le ho fokotseha.

 

Ho ntlafatsa tsamaiso ea motlakase

• Underfill epoxy e thusa ho tsamaisa mocheso ka ho lekana ho microchip le substrate, ho ntlafatsa taolo ea mocheso.
• E boetse e ntlafatsa ho qhala mocheso, ho fokotsa kotsi ea ho chesa le ho lelefatsa bophelo ba lisebelisoa tsa elektroniki.

 

Thibelo ea khatello ea mochine le tšenyo ea lisebelisoa tsa elektronike

• Underfill epoxy e fokotsa kotsi ea tšenyo e bakiloeng ke khatello ea maikutlo, ho thothomela le ho tsukutleha, ho netefatsa ho tšoarella ha lisebelisoa tsa elektroniki.
• E ka boela ea thusa ho thibela ho phunyeha le delamination, e ka hlahang ka lebaka la ho atolosoa ha mocheso le ho fokotseha.

 

Tšireletso khahlanong le mongobo le lintho tse ling tsa tikoloho

• Underfill epoxy e sebetsa e le tšitiso khahlano le mongobo, lerōle le lintho tse ling tsa tikoloho tse ka senyang lisebelisoa tsa elektroniki.
• E thusa ho sireletsa khahlanong le kutu, ho netefatsa hore lisebelisoa tsa elektroniki li tsoela pele ho sebetsa hantle ha nako e ntse e ea.

 

Its'ebetso e ntlafalitsoeng ea lisebelisoa tsa elektroniki

• Underfill epoxy e ka ntlafatsa ts'ebetso ea lisebelisoa tsa elektroniki ka ho fokotsa kotsi ea tšenyo, mocheso o feteletseng le litaba tse ling tse ka amang ts'ebetso ea tsona.
• E ka boela ea ntlafatsa tsamaiso ea motlakase ea li-microchips le substrates, ho netefatsa hore matšoao a fetisoa ka mokhoa o nepahetseng le ka nepo.

 

 

Lisebelisoa tsa Underfill Epoxy

Underfill epoxy e sebelisoa lits'ebetsong tse fapaneng tsa elektroniki ho liindasteri tse fapaneng, ho kenyelletsa:

 

Mechini ea motlakase ea bareki

• Underfill epoxy e sebelisoa hangata ho li-smartphones, matlapa, lilaptop, le lisebelisoa tse ling tsa elektroniki tsa bareki ho ntlafatsa ts'ebetso ea tsona ea nako e telele le ho ts'epahala.
• E boetse e thusa ho sireletsa khahlanong le tšenyo e bakoang ke ho atolosoa ha mocheso le ho fokotseha, ho netefatsa hore lisebelisoa tsena li tšoarella nako e telele.

 

Lisebelisoa tsa elektroniki

• Underfill epoxy e sebelisoa ho lisebelisoa tsa elektroniki tsa likoloi ho itšireletsa khahlanong le tšenyo e bakiloeng ke ho thothomela le ho makala.
• E boetse e thusa ho ntlafatsa tsamaiso ea mocheso, ho netefatsa hore likarolo tsa elektronike likoloing li sebetsa hantle.

 

Aerospace le lisebelisoa tsa elektroniki tsa ts'ireletso

• Tlatsa epoxy E bohlokoa haholo ho lisebelisoa tsa elektroniki tsa sepakapaka le ts'ireletso ka lebaka la maemo a holimo a ho thothomela, ho ts'oha, le ho feto-fetoha ha thempereichara tseo ba pepesetsoang ho tsona.
• E thusa ho thibela tšenyo e bakoang ke lintlha tsena le ho netefatsa hore lisebelisoa tsa elektronike li tsoela pele ho sebetsa hantle.

 

Lisebelisoa tsa bongaka

• Underfill epoxy e sebelisoa ho elektronike ea bongaka ka lebaka la litlhoko tse thata tsa ho tšepahala le ho tšoarella indastering ena.
• E thusa ho sireletsa khahlanong le tšenyo e bakoang ke mongobo, lerōle le lintho tse ling tsa tikoloho, ho netefatsa hore lisebelisoa tsa bongaka li sebetsa ka mokhoa o sireletsehileng le ka katleho.

 

Lisebelisoa tsa elektronike tsa indasteri

• Underfill epoxy e sebelisoa ho lisebelisoa tsa elektroniki tsa indasteri joalo ka lisensara, li-motor, le litsamaiso tsa taolo ho itšireletsa khahlanong le tšenyo e bakiloeng ke tikoloho e thata le ho fetoha ha mocheso.
• E boetse e thusa ho ntlafatsa bophelo bo bolelele le ho tšepahala ha litsamaiso tsena tsa elektroniki.

 

Mefuta e sa tšoaneng ea Epoxy

Mona ke litlhaloso tsa mofuta o mong le o mong oa underfill epoxy:

 

Phallo ea capillary e tlatsa epoxy

Ena ke mofuta oa underfill epoxy e sebelisoang boemong ba mokelikeli 'me e phalla ka har'a lekhalo pakeng tsa microchip le substrate ka ketso ea capillary. E loketse bakeng sa likopo moo ho nang le lekhalo le lenyenyane pakeng tsa microchip le substrate, kaha e ka phalla habonolo 'me ea tlatsa lekhalo ntle le tlhokahalo ea khatello ea ka ntle. Capillary flow underfill epoxy e sebelisoa hangata ho lisebelisoa tsa elektronike tsa bareki le lits'ebetso tse ling moo ho hlokahalang boemo bo phahameng ba ho tšepahala.

 

No-flow underfill epoxy

No-flow underfill epoxy ke mofuta oa underfill epoxy e sebelisoang boemong bo tiileng 'me ha e phalle. E loketse bakeng sa likopo moo lekhalo pakeng tsa microchip le substrate e kholoanyane 'me e hloka khatello ea ka ntle ho tlatsa. E sebelisoa hangata lits'ebetsong tsa likoloi le tsa sefofane, moo likarolo tsa elektronike li tlas'a maemo a phahameng a ho sisinyeha le ho makala.

 

Epoxy e entsoeng ka underfill

Epoxy ena ea underfill e sebelisoa e le sengoathoana se entsoeng esale pele se behiloeng holim'a microchip le substrate. E ntan'o futhumatsoa ebe e qhibiliha ho phalla ka har'a lekhalo pakeng tsa microchip le substrate. Molded underfill epoxy e loketse lits'ebetso moo lekhalo lipakeng tsa microchip le substrate le sa tloaelehang kapa moo khatello ea kantle e ke keng ea sebelisoa habonolo. E sebelisoa hangata lits'ebetsong tsa elektroniki tsa indasteri le lits'ebetsong tsa elektronike tsa bongaka.

 

Lintlha Tseo U Lokelang ho li Nahana ha U Khetha Underfill Epoxy

Ha u khetha underfill epoxy bakeng sa lits'ebetso tsa elektroniki, lintlha tse 'maloa li lokela ho nahanoa, ho kenyelletsa:

 

Ho lumellana le lisebelisoa tse ling tse sebelisoang ho elektronike

Underfill epoxy e lokela ho lumellana le lisebelisoa tse ling tse sebelisoang likarolong tsa elektroniki ho netefatsa tlamo e matla le e tšoarellang. Ke habohlokoa ho etsa bonnete ba hore epoxy ea underfill ha e sebetsane le lisebelisoa tse sebelisoang likarolong tsa elektronike, tse ka bakang tšenyo le ho fokotsa nako ea bophelo ea sesebelisoa.

 

Thermal le thepa thepa

E lokela ho ba le thepa e loketseng ea mocheso le ea mechine ho mamella maemo a tikoloho ao lisebelisoa tsa elektronike li sebetsang ho tsona. The underfill epoxy e lokela ho khona ho sebetsana le ho atolosoa ha mocheso le ho fokotseha le khatello ea mechine, e ka bakang tšenyo ea likarolo tsa elektronike.

 

Mokhoa oa kopo le litlhoko

Ts'ebetso ea kopo le litlhoko tsa epoxy ea underfill e ka fapana ho latela mofuta oa karolo ea elektroniki le indasteri eo e sebelisoang ho eona. Lintlha tse joalo ka nako ea pheko, viscosity le mokhoa oa ho fana li lokela ho nahanoa ha u khetha epoxy e sa tlalang. Ts'ebetso ea kopo e lokela ho ba e sebetsang hantle le e theko e boima, ha e ntse e netefatsa hore epoxy e sa tlalang e sebelisoa ka nepo le ka mokhoa o ts'oanang.

 

Ho boloka litšenyehelo

Litsenyehelo tsa underfill epoxy li ka fapana ho latela mofuta le molumo o hlokahalang. Ha u khetha, ke habohlokoa ho nahana ka katleho ea thepa. Sena ha se akarelletse feela litšenyehelo tsa underfill epoxy ka boeona empa hape le litšenyehelo tsa ts'ebetso ea kopo le lisebelisoa life kapa life tse ling tse hlokahalang. Tšebeliso e ntle ea litšenyehelo tsa underfill epoxy e ka hlahlojoa ka ho nahana ka kakaretso ea ts'ebetso le ho tšoarella ha sesebelisoa sa elektroniki, hammoho le litšenyehelo tsohle tsa beng ka nako ea bophelo ba sona.

Summary

Qetellong, underfill epoxy ke sesebelisoa sa bohlokoa bakeng sa ho ntlafatsa ts'epo, ho tšoarella le ts'ebetso ea likarolo tsa elektroniki. Ka ho utloisisa melemo le mefuta e fapaneng e fumanehang, hammoho le lintlha tse lokelang ho nahanoa ha u e khetha, bahlahisi ba ka khetha epoxy e nepahetseng ea underfill bakeng sa lits'ebetso tsa bona tse ikhethileng.

Bakeng sa ho eketsehileng ka melemo le likopo tsa ho tlatsa li-encapsulants tsa epoxy ka lisebelisoa tsa elektroniki, o ka etela DeepMaterial ho https://www.epoxyadhesiveglue.com/epoxy-based-chip-underfill-and-cob-encapsulation-materials/ etsoe Info more.