DeepMaterial(Shenzhen)Co.,Ltd
DeepMaterial (Shenzhen) Co., Ltd. ke k'hamphani e ncha e sebetsanang le likhomaretsi tsa semiconductor le lisebelisoa tsa elektroniki le lisebelisoa tsa ts'ireletso ea bokaholimo bakeng sa ho paka le ho etsa liteko.
Ho ipapisitsoe le mahlale a mantlha a likhomaretsi, DeepMaterial e hlahisitse likhomaretsi bakeng sa ho paka le ho etsa liteko tsa chip, li-adhesives tsa boemo ba boto ea potoloho, le likhomaretsi bakeng sa lihlahisoa tsa elektroniki. E ipapisitse le likhomaretsi, e thehile lifilimi tse sireletsang, li-filler tsa semiconductor, le lisebelisoa tsa ho paka bakeng sa ts'ebetso ea semiconductor wafer le ho paka le tlhahlobo ea chip.
Ho fana ka likhomaretsi tsa elektroniki le lihlahisoa tsa lisebelisoa tsa elektroniki tse tšesaane le litharollo bakeng sa lik'hamphani tsa terminal tsa puisano, lik'hamphani tsa lisebelisoa tsa elektroniki, lik'hamphani tsa ho paka le ho hlahloba semiconductor, le baetsi ba lisebelisoa tsa puisano, ho rarolla bareki ba boletsoeng ka holimo ts'ireletso ea ts'ebetso, bonding e nepahetseng haholo ea sehlahisoa. , le ts'ebetso ea motlakase. Tlhokahalo ea lehae bakeng sa ts'ireletso, ts'ireletso ea mahlo, joalo-joalo.
Khamphani e ntse e tsoela pele ho fetola ts'ebeliso ea likhomaretsi le lisebelisoa tsa resin, mme leano la leano la k'hamphani le tla shebana le nts'etsopele ea li-adhesives tsa EB le lisebelisoa tse ncha tsa semiconductor. Likhomaretsi le li-resin tsa EB li tla phunyeletsa libotlolo tsa tekheniki tse kang nako ea ho folisa, nako e bulehileng ea ts'ebetso le matla a tlamahano a sekhomaretsi leha e le sefe sa lefats'e, ka hona ha se na nako e bulehileng, ha ho na nako ea ho folisa (super fast nanosecond curing), li-adhesives tse ncha tsa viscosity. ka matla a matla a tlamahano a tla senya ts'ebeliso ea hajoale ea lihlahisoa tsa elektroniki le kopano ea karolo, li-sensor tse nepahetseng, ts'ebetso ea boto ea potoloho ea PCB, PCB oa potoloho ea boto ea etching (ts'ebetso ea etching ka holimo ho 195nm), matla a macha (betri le matla a moea a potting, bonding). Melao ea kopo ea sekhomaretsi ea 'maraka bakeng sa indasteri ea thepa ea mohaho (liphanele tse kopantsoeng); ts'ebeliso ea thekenoloji ea EB ea ho folisa le ea mahlaseli ka tataiso ea lisebelisoa tsa semiconductor e tla phunyeletsa monopoly ea morao-rao ea thekenoloji ea thepa ea tšireletso ea semiconductor ke lik'hamphani tsa Majapane le ho finyella katleho ea tekheniki holim'a mokokotlo.
DeepMaterial ke sekhomaretsi sa epoxy le sekhomaretsi sa li-sealants, se hlahisang sekhomaretsi sa sekhomaretsi se matla ka ho fetesisa se sa keneleng metsi bakeng sa polasetiki ho tšepe le khalase, likhomaretsi tsa semiconductor bakeng sa kopano ea elektroniki, sekhomaretsi sa chip bakeng sa epoxy underfill, sekhomaretsi sa magnet bonding bakeng sa limakete ka linjini tsa motlakase.
Moetsi oa Sekhomaretsi oa China oa Sekhomaretsi
Eba moetapele oa lehae ka maqhama le tšireletso ea thepa ea boleng bo holimo bakeng sa li-semiconductors le lihlahisoa tsa elektroniki China. Khamphani ke projeke ea bohlokoa ea kenyelletso Toropong ea Guixi, Profinseng ea Jiangxi, 'me e tsetelitsoe ke Khomishene ea Tsamaiso le Tsamaiso ea Thepa ea Naha.
Sekhomaretsi sa Sekhomaretsi Re Fana ka sona
Tsepamisa maikutlo ho faneng ka lihlahisoa le litharollo tsa lisebelisoa tsa sekhomaretsi le litharollo bakeng sa lik'hamphani tsa terminal tsa puisano le lik'hamphani tsa lisebelisoa tsa elektroniki tsa bareki, lik'hamphani tsa ho paka le ho etsa liteko tsa semiconductor, le baetsi ba lisebelisoa tsa puisano.
Lihlahisoa tsa boleng bo phahameng
Sehlahisoa se thehiloe pele holim'a botsitso le boqapi, 'me tšebeletso e thehiloe pele holim'a botšepehi. E etelletsoeng pele ke 'maraka, tlhahiso ea theknoloji. Capital tlhohonolofatso ho ikamahanya le mokhoa oa localization ea thepa e ncha. Ts'ebetso ea branded, e tsitlellang ho etelletsa boleng le boleng pele
Lifeme tse tharo
· Khamphani ke projeke ea bohlokoa ea kenyelletso Toropong ea Guixi, Profinseng ea Jiangxi, 'me e tsetelitsoe ke Komisi ea Naha ea Tlhokomelo le Tsamaiso ea Thepa.
· Sebaka sa polokelo ea liindasteri sa k'hamphani se Guixi se nka sebaka sa lihekthere tse 110, se nang le sebaka sa kaho sa lisekoere-mithara tse 30,000 karolong ea pele. Ho na le setsi sa sekhomaretsi sa A1 le setsi sa ho etsa lifilimi sa T1.
· Khamphani e na le lisekoere-mithara tse 1,000 tsa R&D le setsi sa thekiso le lisekoere-mithara tse 1,500 tsa setsi sa tlhahiso ea likhomaretsi se Shenzhen.
· Khamphani e na le litsi tsa lits'ebeletso tsa khoebo le bafani ba lits'ebeletso tsa likanale Suzhou, Xiamen, Chengbu, Beijing le Taiwan.
Guixi Manufacturing Base Phase I
Shenzhen R&D Center/Shenzhen Manufacturing Base
Standardization Laborator
· Shenzhen Protective Film R&D Laboratory / Guixi Production Base Analysis & Inspection Laboratory
· Shenzhen Protective Film Comprehensive R&D Laboratory 300 Square Meters
· Guixi Production Base Analysis And Inspection Laboratory 400 Square Meters
Shenzhen Protective Film R&D Laboratory
Shenzhen R&D Center/Shenzhen Manufacturing Base
HLOMPHO HLOMPHO
Thepa ea Bohlale le Taolo ea Tumellano
Khampani e fetisitse setifikeiti sa tsamaiso ea boleng ba ISO9001 le netefatso ea tsamaiso ea tikoloho ea ISO14001, mme e fetisitse netefatso ea tsamaiso ea thepa ea mahlale ea GB/T 29290, 'me e mothating oa ho fana ka setifikeiti sa tsamaiso ea TS16949.
Nakong e tlang, k'hamphani e tla tsoelapele ho fihlela tumellano le maemo a tsamaiso ea tsamaiso.
Khampani e etsa kopo ea litokelo tsa litokelo tsa boqapi tse fetang 50 le lipatente tsa mohlala oa utility selemo se seng le se seng, ho boloka boetapele ba 'maraka ba k'hamphani le boqapi ba theknoloji ka boiqapelo bo tsoelang pele ba theknoloji.
Tsamaiso ea tsamaiso ea boleng
Sisteme ea Tsamaiso ea Tikoloho
Tsamaiso ea tsamaiso ea boleng
Sistimi ea Patent
DeepMaterial semiconductor adhesives technology, litokelo tsa molao le litokelo.
