Hybrid microelectronic semiconductor e shoa ka likhomaretsi le li-encapsulants ka boqapi
Hybrid microelectronic semiconductor e shoa ka likhomaretsi le li-encapsulants ka boqapi
Likhomaretsi tsa Microelectronics le li-encapsulants li hlokahala nakong ea kopano. DeepMaterial e 'nile ea kenya letsoho ka mafolofolo ho ntshetsa pele mekhoa e metle ka ho fetisisa e ka sebelisoang ho etsa lisebelisoa tse sebetsang hantle, tse bonolo, tse potlakileng, tse bobebe, tse tšesaane le tse nyenyane. Microelectronics e fumane botumo bo boholo indastering. Lisebelisoa li kene ho khotsofatsa tlhoko e ntseng e eketseha ea indasteri le bareki ea lihlahisoa.
Likhomaretsi le boqapi
Tlhahiso e ncha le theknoloji ea morao-rao e bakile bokhoni le ts'epahalo ea litsamaiso tsena. Hona joale li-microelectronics li bapala karolo e kholo litabeng tsa puisano le marang-rang, boenjiniere ba mehloli ea tlhaho, merafo, sebaka le lisebelisoa tsa sesole, tsamaiso ea lipalangoang le ea likoloi, matla le lisebelisoa tsa tlhahlobo ea bongaka.
Lintlafatso libakeng tsena li bile teng ka ho hlahisa tse ntle ka ho fetisisa li-microelectronic adhesives le li-encapsulants. Likhomaretsi li bile thuso e kholo ho nts'etsopele ea elektronike e kang mechine ea khatiso, lisebelisoa tsa lapeng, lisebelisoa tsa molumo, lisebelisoa tsa lipapali, lithelefono tsa cellular, li-laptops, li-sensor, lisebelisoa tse aparoang le lik'hamera tsa digital.
PCBs
Ho na le liphephetso tse ngata tsa taolo ea mocheso tseo hajoale li leng ho li-PCB tse nang le meralo e nyane haholo. Ho bohlokoa ho sebelisa conductive thermally li-microelectronic adhesives le li-encapsulants boemong bona. Liqapi tse joalo li ka sebetsana le ho futhumala ha likarolo tsa bohlokoa ka ho fetisisa ha ka nako e ts'oanang li ntlafatsa lebelo la ts'ebetso ka ho sebelisa li-adhesive tse senyang mocheso. Ka lisebelisoa tse joalo, bophelo bo lebelletsoeng ba lisebelisoa tseo ho buuoang ka tsona le tlholisano ea tsona le tsona li ntlafatsoa ka linyehelo tse fapaneng tsa lihlahisoa.
Lits'ebetsong tsa microelectronic, hoa khoneha ho kopana le bokhoni bo boholo ka ho fetisisa ba ho hlahisa lihlahisoa tse ngata. Ka li-adhesives tse ntle ka ho fetisisa sebakeng sena, ha ho na meeli. Li-adhesive li thusa ho theha:
- Li-antenna tse bohlale
- Likopano tsa 3D
- Elektronike e tala
- Ho khanna ho sa hlokahale
- Pokello ea boitsebiso
- Theknoloji e aparang
- Lisebelisoa tsa elektronike tse tenyetsehang
- leru dikhomphiutha
- Internet ea lintho
Kajeno, li-adhesive li na le mesebetsi e mengata ea ho theha microelectronics, 'me taba ena e ke ke ea hlokomolohuoa. Lisebelisoa tse fapaneng li ka sebelisoa ho hokahanya likarolo le ho nolofalletsa likhokahano. Hape hoa khoneha ho pitsa ho sebelisa metsoako ea lipitsa, li-encapsulants le li-adhesives tsa polymeric. Bakeng sa likarolo tsa likoloi, gel ea silicone e ka sebelisoa ho li sireletsa. Ena ke khetho e theko e tlaase 'me e sireletsa potoloho eohle ho tloha metsing.
Tlhokahalo ea kopo ea sekhomaretsi le encapsulation
Ho li-microelectronics, li-adhesives le li-encapsulants lia hlokahala 'me ke karolo ea katleho ea mekhoa e joalo. Ho na le maemo ao re etsang litsamaiso tse hlokang ho sebelisoa libakeng tse thothomelang haholo le libakeng tse tšosang. Boemong bo joalo, ho hlokahala encapsulation ho finyella ts'ebetso e ka tšeptjoang le e tsitsitseng ka ho fetisisa.
Moralo oa kopano ka 'mele, hammoho le thepa ea encapsulant, e hloka ho ts'oaroa ha ho tla le moralo oa sistimi. Hape, ho hlokahala hore u nahane ka makhetlo le boholo ba mojaro oa inertial.
Matla a ho thothomela le ho thothomela a ntlafala haholo ha boima le boholo ba 'mele oa sistimi eohle li bolokoa li le nyane. Sena se fokotsa matla a inertial mme se eketsa ho satalla. Ka sistimi e ntle ka ho fetisisa, microelectronic ea hau e bolokiloe maemong a matle ka ho fetisisa.
Ho DeepMaterial, re na le mefuta e mengata e fapaneng ea likhomaretsi tsa elektroniki le li-encapsulants tseo u ka li nahanang. Mefuta ea rona ea lihlahisoa e lula e le ea boleng bo phahameng ka ho fetisisa, 'me re lula re le ka pele ho letsa le ho feta mekhoa e mecha ho liindasteri tse fapaneng ka ho fana ka tharollo e tšoarellang.
Bakeng sa ho eketsehileng ka lebasetere microelectronic semiconductor die khomaretse sekgomaretsi le encapsulants ka boqapi, o ka etela DeepMaterial ho https://www.epoxyadhesiveglue.com/thermally-conductive-microelectronics-adhesives-and-encapsulants-bonding-in-microelectronics-and-photonics/ etsoe Info more.
