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Moetsi le morekisi oa sekhomaretsi sa underfill underfill epoxy

Shenzhen DeepMaterial Technologies Co., Ltd ke moetsi oa flip chip bga underfill epoxy material and epoxy encapsulant encapsulant in china, o etsa underfill encapsulants,smt pcb underfill epoxy, karolo e le 'ngoe ea epoxy underfill metsoako,flip chip underfill epoxy bakeng sa csp le joalo-joalo.

Underfill ke thepa ea epoxy e tlatsang likheo lipakeng tsa chip le mojari oa eona kapa sephutheloana se felileng le substrate ea PCB. Underfill e sireletsa lihlahisoa tsa elektroniki ho tsoa ho ts'oenyeho, ho theoha le ho sisinyeha mme e fokotsa khatello ea likhokahano tse senyehang tsa solder tse bakoang ke phapang ea katoloso ea mocheso lipakeng tsa silicon chip le carrier (lisebelisoa tse peli tse fapaneng).

Lits'ebetsong tsa capillary underfill, palo e nepahetseng ea thepa e sa tlaleng e fanoa ka lehlakoreng la chip kapa sephutheloana ho phalla ka tlase ka ketso ea capillary, ho tlatsa likheo tsa moea ho potoloha libolo tsa solder tse hokahanyang liphutheloana tsa chip ho PCB kapa li-chips tse pakiloeng ka har'a liphutheloana tse ngata. Lisebelisuoa tse se nang phallo, tseo ka linako tse ling li sebelisetsoang ho tlatsa ka tlaase, li behoa holim'a substrate pele chip kapa sephutheloana se hokelloa ebe se tšeloa hape. Molded underfill ke mokhoa o mong o kenyelletsang ho sebelisa resin ho tlatsa likheo lipakeng tsa chip le substrate.

Ntle le ho tlatsa, nako ea bophelo ea sehlahisoa e ne e tla fokotseha haholo ka lebaka la ho phatloha ha likhokahano. Underfill e sebelisoa methating e latelang ea ts'ebetso ea tlhahiso ho ntlafatsa ts'epo.

Tataiso e Felletseng ea Underfill Epoxy :

Epoxy Underfill ke Eng?

Underfill ke mofuta oa thepa ea epoxy e sebelisetsoang ho tlatsa likheo pakeng tsa semiconductor chip le mojari oa eona kapa pakeng tsa sephutheloana se phethiloeng le substrate ea potoloho e hatisitsoeng (PCB) lisebelisoa tsa elektroniki. E sebelisoa hangata ho mahlale a tsoetseng pele a ho paka a semiconductor, joalo ka lipakete tsa flip-chip le chip-scale, ho matlafatsa ts'epahalo ea mochini le mocheso oa lisebelisoa.

Epoxy underfill hangata e entsoe ka epoxy resin, polymer ea thermosetting e nang le thepa e ntle ea mochini le lik'hemik'hale, e etsa hore e be e loketseng ho sebelisoa lits'ebetsong tse batloang tsa elektroniki. Epoxy resin hangata e kopantsoe le li-additives tse ling, joalo ka li-hardener, li-filler, le li-modifiers, ho ntlafatsa ts'ebetso ea eona le ho hlophisa thepa ea eona ho fihlela litlhoko tse ikhethileng.

Epoxy underfill ke ntho ea metsi kapa ea halofo ea metsi e tšeloang holim'a substrate pele lefu la semiconductor le behoa ka holimo. Joale e phekoloa kapa e tiisitsoe, hangata ka mokhoa oa mocheso, ho theha lesela le thata, le sireletsang le koahelang semiconductor die le ho tlatsa lekhalo pakeng tsa lefu le substrate.

Epoxy underfill ke sekhomaretsi se ikhethileng se sebelisoang tlhahisong ea lisebelisoa tsa elektroniki ho koahela le ho sireletsa likaroloana tse bonojoana, joalo ka li-microchips, ka ho tlatsa lekhalo lipakeng tsa element le substrate, hangata e leng boto ea potoloho e hatisitsoeng (PCB). E atisa ho sebelisoa ho theknoloji ea flip-chip, moo chip e behoang sefahleho fatše holim'a substrate ho ntlafatsa ts'ebetso ea mocheso le motlakase.

Morero oa mantlha oa ho tlatsa li-epoxy underfill ke ho fana ka matlafatso ea mochini ho sephutheloana sa flip-chip, ho ntlafatsa ho hanyetsa likhatello tsa mochini joalo ka ho palama baesekele e futhumetseng, ho tsukutloa ha mochini le ho thothomela. E boetse e thusa ho fokotsa kotsi ea ho hloleha ha manonyeletso a solder ka lebaka la mokhathala le katoloso ea mocheso, e ka bang teng nakong ea ts'ebetso ea sesebelisoa sa elektroniki.

Lisebelisoa tsa epoxy underfill hangata li entsoe ka li-resin tsa epoxy, li-agent, le li-filler ho fihlela thepa e batloang ea mochini, e futhumatsang le ea motlakase. Li etselitsoe ho ba le sekhomaretsi se setle ho semiconductor die le substrate, coefficient e tlase ea ho atolosa mocheso (CTE) ho fokotsa khatello ea mocheso, le conductivity e phahameng ea mocheso ho tsamaisa mocheso ho tloha mochine.

Underfill Epoxy e sebelisetsoa eng?

Underfill epoxy ke sekhomaretsi sa epoxy resin se sebelisoang lits'ebetsong tse fapaneng ho fana ka matlafatso le ts'ireletso ea mochini. Mona ke tse ling tsa ts'ebeliso e tloaelehileng ea underfill epoxy:

Sephutheloana sa Semiconductor: Underfill epoxy hangata e sebelisoa ka har'a semiconductor packaging ho fana ka ts'ehetso ea mochini le ts'ireletso ho likarolo tse bobebe tsa elektroniki, joalo ka li-microchips, tse behiloeng holim'a liboto tsa potoloho tse hatisitsoeng (PCBs). E tlatsa lekhalo pakeng tsa chip le PCB, ho thibela khatello ea kelello le tšenyo ea mechine e bakoang ke ho atolosoa ha mocheso le ho fokotseha nakong ea ts'ebetso.

Flip-Chip Bonding: Underfill epoxy e sebelisoa ho flip-chip bonding, e hokahanyang li-semiconductor chips ka kotloloho ho PCB ntle le libonto tsa terata. Epoxy e tlatsa lekhalo pakeng tsa chip le PCB, e fana ka matlafatso ea mochini le ho kenya motlakase ha e ntse e ntlafatsa ts'ebetso ea mocheso.

Tlhahiso ea Pontšo: Underfill epoxy e sebelisoa ho etsa liponts'o, joalo ka li-liquid crystal displays (LCDs) le organic light-emitting diode (OLED) shows. E sebelisetsoa ho kopanya le ho matlafatsa likarolo tse bonojoana, joalo ka bakhanni ba bonts'ang le li-sensorer tsa ho ama, ho netefatsa botsitso ba mochini le ho tšoarella.

Lisebelisoa tsa Optoelectronic: Underfill epoxy e sebelisoa lisebelisoa tsa optoelectronic, tse kang li-transceivers tsa optical, lasers, le photodiodes, ho fana ka tšehetso ea mechine, ho ntlafatsa ts'ebetso ea mocheso, le ho sireletsa likarolo tse hlokolosi ho tsoa linthong tsa tikoloho.

Motlakase oa Likoloi: Underfill epoxy e sebelisoa ho lisebelisoa tsa elektroniki tsa likoloi, joalo ka likarolo tsa taolo ea elektroniki (ECUs) le li-sensor, ho fana ka matlafatso le ts'ireletso khahlanong le mocheso o feteletseng, ho thothomela le maemo a thata a tikoloho.

Lisebelisoa tsa Aerospace le Tšireletso: Underfill epoxy e sebelisoa lits'ebetsong tsa aerospace le ts'ireletso, joalo ka li-avionics, litsamaiso tsa radar, le lisebelisoa tsa elektroniki tsa sesole, ho fana ka botsitso ba mochini, ts'ireletso khahlanong le ho fetoha ha mocheso, le ho hanyetsa ho ts'oha le ho thothomela.

Consumer Electronics: Underfill epoxy e sebelisoa mefuteng e fapaneng ea elektroniki ea bareki, ho kenyeletsoa li-smartphones, matlapa le li-consoles tsa lipapali, ho fana ka matlafatso ea mochini le ho sireletsa lisebelisoa tsa elektroniki hore li se ke tsa senyeha ka lebaka la libaesekele tse futhumetseng, tšusumetso le likhatello tse ling.

Lisebelisoa tsa Bongaka: Underfill epoxy e sebelisoa lisebelisoa tsa bongaka, joalo ka lisebelisoa tse kenngoeng, lisebelisoa tsa tlhahlobo le lisebelisoa tsa ho beha leihlo, ho fana ka matlafatso ea mochini le ho sireletsa lisebelisoa tse bobebe tsa elektroniki ho tsoa tikolohong e thata ea 'mele.

Sephutheloana sa LED: Underfill epoxy e sebelisoa ho pakang light-emitting diodes (LEDs) ho fana ka ts'ehetso ea mochini, taolo ea mocheso, le ts'ireletso khahlanong le mongobo le lintho tse ling tsa tikoloho.

Kakaretso ea Elektronike: Underfill epoxy e sebelisoa mefuteng e mengata ea lisebelisoa tsa elektroniki tse akaretsang moo ho hlokahalang matla le ts'ireletso ea likarolo tsa elektroniki, joalo ka lisebelisoa tsa motlakase tsa motlakase, li-automation tsa indasteri le lisebelisoa tsa mehala.

Underfill Material Bakeng sa Bga ke Eng?

Sesebediswa sa underfill bakeng sa BGA (Ball Grid Array) ke epoxy kapa polymer-based material e sebelisoang ho tlatsa lekhalo pakeng tsa sephutheloana sa BGA le PCB (Printed Circuit Board) ka mor'a ho soasoa. BGA ke mofuta oa sephutheloana sa holim'a thaba se sebelisoang lisebelisoa tsa elektroniki se fanang ka likhokahano tse phahameng lipakeng tsa potoloho e kopaneng (IC) le PCB. Thepa e sa tsitsang e ntlafatsa ho ts'epahala ha manonyeletso a BGA le matla a mochini, ho fokotsa kotsi ea ho hloleha ka lebaka la khatello ea mochini, ho palama libaesekele le lintlha tse ling tsa tikoloho.

Lisebelisoa tsa underfill hangata li na le metsi 'me li phalla ka tlas'a sephutheloana sa BGA ka ketso ea capillary. E ntan'o kena ts'ebetsong ea ho folisa ho tiisa le ho theha khokahano e thata lipakeng tsa BGA le PCB, hangata ka mocheso kapa khanya ea UV. Thepa ea underfill e thusa ho tsamaisa likhatello tsa mochini tse ka bang teng nakong ea libaesekele tse futhumetseng, ho fokotsa kotsi ea ho phatloha hoa solder le ho ntlafatsa ts'epo ka kakaretso ea sephutheloana sa BGA.

Thepa e sa tlalang bakeng sa BGA e khethiloe ka hloko ho latela lintlha tse kang moralo o ikhethileng oa sephutheloana sa BGA, lisebelisoa tse sebelisoang ho PCB le BGA, tikoloho ea ts'ebetso, le ts'ebeliso e reriloeng. Lisebelisoa tse ling tse tloaelehileng tsa ho tlatsa BGA li kenyelletsa epoxy-based, no-flow, le underfill tse nang le lisebelisoa tse fapaneng tsa ho tlatsa joalo ka silika, alumina, kapa likaroloana tsa conductive. Ho khethoa ha thepa e loketseng ea underfill ho bohlokoa ho netefatsa ts'epo le ts'ebetso ea nako e telele ea liphutheloana tsa BGA lisebelisoa tsa elektroniki.

Ho feta moo, thepa e sa tlalang bakeng sa BGA e ka fana ka tšireletso khahlanong le mongobo, lerōle le litšila tse ling tse ka 'nang tsa phunyeletsa lekhalo pakeng tsa BGA le PCB, tse ka bakang kutu kapa lipotoloho tse khutšoanyane. Sena se ka thusa ho matlafatsa botsitso ba liphutheloana tsa BGA le ho ts'epahala maemong a thata.

Underfill Epoxy In Ic ke Eng?

Underfill epoxy ho IC (Integrated Circuit) ke thepa e khomarelang e tlatsang lekhalo pakeng tsa semiconductor chip le substrate (joaloka boto ea potoloho e hatisitsoeng) lisebelisoa tsa elektronike. E sebelisoa hangata ts'ebetsong ea tlhahiso ea li-IC ho matlafatsa matla a tsona a mochini le ho ts'epahala.

Li-IC hangata li entsoe ka semiconductor chip e nang le likarolo tse fapaneng tsa elektroniki, joalo ka transistors, resistors, le capacitor, tse hokahaneng le likhokahano tsa kantle tsa motlakase. Li-chips tsena li beoa holim'a substrate, e fanang ka tšehetso le khokahanyo ea motlakase ho sistimi eohle ea elektroniki. Leha ho le joalo, ka lebaka la ho se tšoane ha li-coefficients tsa katoloso ea mocheso (CTEs) pakeng tsa chip le substrate le khatello ea maikutlo le mathata a nang le phihlelo nakong ea ts'ebetso, khatello ea mochine, le litaba tsa ho tšepahala li ka hlaha, tse kang ho hlōleha ho bakoang ke libaesekele tse futhumatsang kapa ho phunyeha ha mechine.

Underfill epoxy e rarolla mathata ana ka ho tlatsa lekhalo pakeng tsa chip le substrate, ho theha bond e matla ea mochini. Ke mofuta oa epoxy resin e entsoeng ka thepa e khethehileng, joalo ka viscosity e tlase, matla a ho khomarela a phahameng, le thepa e ntle ea mocheso le mochini. Nakong ea ts'ebetso ea tlhahiso, epoxy e sa tlatsoang e sebelisoa ka mokhoa oa mokelikeli, ebe e phekoloa ho tiisa le ho theha maqhama a matla pakeng tsa chip le substrate. Li-IC ke lisebelisoa tse bonolo tsa elektroniki tse ka bang le khatello ea maikutlo ea mochini, ho palama baesekele, le lintlha tse ling tsa tikoloho nakong ea ts'ebetso, tse ka bakang ho hloleha ka lebaka la mokhathala o kopaneng oa solder kapa delamination lipakeng tsa chip le substrate.

The underfill epoxy e thusa ho aba hape le ho fokotsa khatello ea maikutlo le mathata nakong ea ts'ebetso mme e fana ka ts'ireletso khahlano le mongobo, litšila le lits'oants'o tsa mochini. E boetse e thusa ho ntlafatsa ts'epahalo ea libaesekele tse futhumatsang tsa IC ka ho fokotsa kotsi ea ho phatloha kapa delamination lipakeng tsa chip le substrate ka lebaka la liphetoho tsa mocheso.

Underfill Epoxy ho Smt ke Eng?

Underfill epoxy ho Surface Mount Technology (SMT) e bolela mofuta oa sekhomaretsi se sebelisetsoang ho tlatsa lekhalo lipakeng tsa semiconductor chip le substrate ea lisebelisoa tsa elektroniki joalo ka liboto tsa potoloho tse hatisitsoeng (PCBs). SMT ke mokhoa o tsebahalang oa ho bokella likarolo tsa elektronike ho li-PCB, 'me epoxy e sa tsitsang e atisa ho sebelisoa ho ntlafatsa matla a mochine le ho tšepahala ha manonyeletso a solder pakeng tsa chip le PCB.

Ha lisebelisoa tsa elektroniki li le tlas'a khatello ea libaesekele tse futhumetseng le khatello ea mochini, joalo ka nakong ea ts'ebetso kapa lipalangoang, liphapang tsa coefficient of thermal expansion (CTE) lipakeng tsa chip le PCB li ka baka khatello ho manonyeletso a solder, e leng se lebisang ho hloleheng ho ka bang teng joalo ka mapetsong. kapa delamination. Underfill epoxy e sebelisetsoa ho fokotsa litaba tsena ka ho tlatsa lekhalo pakeng tsa chip le substrate, ho fana ka tšehetso ea mechine, le ho thibela manonyeletso a solder ho ba le khatello ea kelello e feteletseng.

Underfill epoxy hangata ke thepa ea thermosetting e fanoang ka sebopeho sa mokelikeli ho PCB, 'me e phalla ka har'a lekhalo lipakeng tsa chip le substrate ka ketso ea capillary. E ntan'o phekoloa ho theha thepa e thata le e tšoarellang e kopanyang chip ho substrate, e ntlafatsang botšepehi ba mochine oa manonyeletso a solder.

Underfill epoxy e sebeletsa mesebetsi e 'maloa ea bohlokoa likopanong tsa SMT. E thusa ho fokotsa sebopeho sa mapetsong a solder kapa fractures ka lebaka la libaesekele tse futhumetseng le khatello ea mochini nakong ea ts'ebetso ea lisebelisoa tsa elektroniki. E boetse e ntlafatsa ho senyeha ha mocheso ho tloha IC ho ea ho substrate, e thusang ho ntlafatsa botšepehi le ts'ebetso ea kopano ea elektronike.

Underfill epoxy likopanong tsa SMT e hloka mekhoa e nepahetseng ea ho fana ho netefatsa tšireletso e nepahetseng le kabo e tšoanang ea epoxy ntle le ho baka tšenyo leha e le efe ho IC kapa substrate. Lisebelisoa tse tsoetseng pele tse kang ho fana ka liroboto le li-ovens tse phekolang hangata li sebelisoa ts'ebetsong ea underfill ho fihlela sephetho se ts'oanang le litlamo tsa boleng bo holimo.

The Properties Of Underfill Material ke Life?

Lisebelisoa tsa underfill hangata li sebelisoa mekhoeng ea ho etsa lisebelisoa tsa elektroniki, haholoholo, liphutheloana tsa semiconductor, ho matlafatsa ts'epahalo le ho tšoarella ha lisebelisoa tsa elektroniki joalo ka li-circuits tse kopaneng (ICs), li-ball grid arrays (BGAs), le liphutheloana tsa flip-chip. Thepa ea thepa ea underfill e ka fapana ho latela mofuta o itseng le sebopeho, empa ka kakaretso e kenyelletsa tse latelang:

Thermal conductivity: Lisebelisoa tsa underfill li lokela ho ba le conductivity e ntle ea mocheso ho qhala mocheso o hlahisoang ke sesebelisoa sa elektroniki nakong ea ts'ebetso. Sena se thusa ho thibela ho futhumala ho feteletseng, ho ka lebisang ho hloleheng ha moralo.

Tšebelisano ea CTE (Coefficient of Thermal Expansion): Lisebelisoa tse sa tlatsoang li lokela ho ba le CTE e lumellanang le CTE ea sesebelisoa sa elektronike le substrate eo e tlametsoeng ho eona. Sena se thusa ho fokotsa khatello ea mocheso nakong ea ho palama baesekele le ho thibela delamination kapa ho phatloha.

Viscosity e tlase: Lisebelisoa tsa underfill li lokela ho ba le sekhahla se tlase ho li nolofalletsa ho phalla habonolo nakong ea ts'ebetso ea encapsulation le ho tlatsa likheo lipakeng tsa sesebelisoa sa elektroniki le substrate, ho netefatsa tšireletso e tšoanang le ho fokotsa likheo.

Ho khomarela: Lisebelisoa tsa underfill li lokela ho khomarela hantle sesebelisoa sa elektroniki le substrate ho fana ka tlamo e matla le ho thibela delamination kapa karohano tlas'a khatello ea mocheso le mochini.

Insulation ea motlakase: Lisebelisoa tsa underfill li lokela ho ba le thepa e phahameng ea ho kenya motlakase ho thibela li-circuits tse khutšoane le mefokolo e meng ea motlakase sesebelisoa.

Matla a mochini: Lisebelisoa tsa underfill li lokela ho ba le matla a lekaneng a ho mamella likhatello tse bang teng nakong ea mocheso oa libaesekele, ho makala, ho thothomela le meroalo e meng ntle le ho peperana kapa ho holofala.

Pheko nako: Lisebelisoa tsa underfill li lokela ho ba le nako e nepahetseng ea pheko ho netefatsa tlamahano e nepahetseng le pheko ntle le ho baka tieho ts'ebetsong ea tlhahiso.

Ho fana le ho sebetsa hape: Lisebelisoa tse sa tlatsoang li lokela ho lumellana le lisebelisoa tsa ho fana tse sebelisoang tlhahisong le ho lumella ho sebetsa bocha kapa ho lokisoa ha ho hlokahala.

Ho hanyetsa mongobo: Lisebelisoa tsa underfill li lokela ho ba le khanyetso e ntle ea mongobo ho thibela ho kenella ha mongobo, ho ka bakang ho hloleha ha sesebelisoa.

Bophelo bo botle: Lisebelisoa tse sa tlatsoang li lokela ho ba le nako e lekaneng ea bophelo, e lumellang polokelo e nepahetseng le ts'ebeliso ea nako.

Sesebediswa sa Molded Underfill ke Eng?

Thepa e entsoeng ka underfill e sebelisoa ka har'a liphutheloana tsa elektroniki ho koahela le ho sireletsa lisebelisoa tsa semiconductor, joalo ka li-circuits tse kopaneng (ICs), ho tsoa linthong tse kantle tsa tikoloho le likhatello tsa mochini. Hangata e sebelisoa e le ntho ea metsi kapa ea ho peista ebe e phekoloa ho tiisa le ho etsa lesela le sireletsang ho potoloha sesebelisoa sa semiconductor.

Lisebelisoa tse entsoeng ka tlas'a metsi tse bōpiloeng li atisa ho sebelisoa ka har'a liphutheloana tsa flip-chip, tse hokahanyang lisebelisoa tsa semiconductor ho boto ea potoloho e hatisitsoeng (PCB) kapa substrate. Flip-chip packaging e lumella hore ho be le sekema sa ho hokahana se phahameng haholo, se sebetsang hantle haholo, moo sesebelisoa sa semiconductor se hlonngoeng sefahleho se shebile fatše holim'a substrate kapa PCB, 'me likhokahano tsa motlakase li etsoa ka ho sebelisa likhahla tsa tšepe kapa libolo tsa solder.

Thepa e entsoeng ka underfill hangata e ajoa ka mokhoa oa mokelikeli kapa oa peista mme e phalla ka tlasa sesebelisoa sa semiconductor ka ketso ea capillary, e tlatsa likheo lipakeng tsa sesebelisoa le substrate kapa PCB. Joale thepa e phekoloa ka ho sebelisa mocheso kapa mekhoa e meng ea ho phekola ho tiisa le ho etsa lesela le sireletsang le koahelang sesebelisoa, ho fana ka tšehetso ea mechine, ho kenya mocheso oa mocheso, le tšireletso khahlanong le mongobo, lerōle le litšila tse ling.

Lisebelisoa tse entsoeng ka tlas'a metsi tse entsoeng ka tlas'a metsi li atisa ho etsoa ho ba le thepa e kang viscosity e tlaase bakeng sa ho fana habonolo, botsitso bo phahameng ba mocheso bakeng sa ts'ebetso e ka tšeptjoang ka mefuta e mengata ea mocheso o sebetsang, ho khomarela hantle ho li-substrates tse fapaneng, coefficient e tlase ea ho atolosa mocheso (CTE) ho fokotsa khatello ea kelello nakong ea mocheso. ho palama libaesekele, le thepa e phahameng ea ho kenya motlakase ho thibela li-circuits tse khutšoane.

Ka sebele! Ntle le thepa e boletsoeng pejana, lisebelisoa tse entsoeng ka underfill li ka ba le litšobotsi tse ling tse etselitsoeng lits'ebetso kapa litlhoko tse itseng. Ka mohlala, lisebelisoa tse ling tse entsoeng ka tlas'a metsi li ka 'na tsa ntlafatsa tsamaiso ea mocheso ho ntlafatsa mocheso oa mocheso ho tloha mochine oa semiconductor, o leng oa bohlokoa lits'ebetsong tsa matla a phahameng moo tsamaiso ea mocheso e leng ea bohlokoa.

U Tlosa Lintho Tse Tlatsehang Joang?

Ho tlosa thepa e sa tlatsoang hantle e ka ba phephetso, kaha e etselitsoe ho tšoarella le ho hanyetsa maemo a tikoloho. Leha ho le joalo, mekhoa e mengata e tloaelehileng e ka sebelisoa ho tlosa thepa e sa tlalang, ho latela mofuta o itseng oa underfill le sephetho se lakatsehang. Mona ke tse ling tsa likhetho:

Mekhoa ea ho futhumatsa: Lisebelisoa tsa underfill hangata li etselitsoe ho tsitsa ka mocheso, empa ka linako tse ling li ka nolofatsoa kapa tsa qhibiliha ka ho sebelisa mocheso. Sena se ka etsoa ho sebelisoa lisebelisoa tse khethehileng tse kang seteishene sa ho tsosolosa moea o chesang, tšepe ea solder e nang le lehare le futhumetseng, kapa hitara ea infrared. Tlatse e nolofalitsoeng kapa e qhibilihisitsoeng e ka hlakoloa ka hloko kapa ea phahamisoa ho sebelisoa sesebelisoa se loketseng, joalo ka polasetiki kapa scraper ea tšepe.

Mekhoa ea lik'hemik'hale: Lisebelisoa tsa lik'hemik'hale li ka qhibiliha kapa tsa nolofatsa lisebelisoa tse ling tse sa tlatsoang. Mofuta oa solvent o hlokahalang o itšetlehile ka mofuta o itseng oa thepa e sa tlatsoang. Li-solvents tse tloaelehileng bakeng sa ho tlosoa ho se nang metsi li kenyelletsa joala ba isopropyl (IPA), acetone, kapa litharollo tse khethehileng tsa ho tlosa li-underfill. Sehlahisoa se sebelisoa ka tloaelo ho thepa e sa tlatsoang ebe e lumelloa ho kenella le ho e nolofatsa, ka mor'a moo thepa e ka hlakoloa kapa ea hlakoloa ka hloko.

Mekhoa ea mechini: Thepa e sa tlalang e ka tlosoa ka mochini ho sebelisoa mekhoa e hlabang kapa ea mochini. Sena se ka kenyelletsa mekhoa e kang ho sila, ho roala lehlabathe, kapa ho sila, ho sebelisa lisebelisoa tse khethehileng kapa thepa. Ts'ebetso ea othomathike hangata e ba mabifi ho feta 'me e kanna ea tšoanela maemo ao mekhoa e meng e sa sebetseng hantle, empa e ka boela ea baka likotsi tsa ho senya karolo e ka tlase kapa likaroloana' me e lokela ho sebelisoa ka hloko.

Mekhoa ea ho kopanya: Maemong a mang, motsoako oa mekhoa o ka tlosa thepa e sa tlatsoang. Ka mohlala, mekhoa e fapa-fapaneng ea mocheso le lik'hemik'hale e ka sebelisoa, moo mocheso o sebelisoang ho nolofatsa thepa e sa tsitsang, li-solvents ho tsoela pele ho qhaqha kapa ho nolofatsa thepa, le mekhoa ea mechine ea ho tlosa masala a setseng.

Mokhoa oa ho tlatsa Epoxy ka tlase

Mona ke tataiso ea mohato ka mohato mabapi le mokhoa oa ho tlatsa epoxy:

Mohato oa 1: Bokella Lisebelisoa le Lisebelisoa

Tlatsa lisebelisoa tsa epoxy: Khetha thepa ea boleng bo holimo ea underfill epoxy e tsamaellanang le likarolo tsa elektroniki tseo u sebetsang le tsona. Latela litaelo tsa moetsi bakeng sa ho kopanya le ho phekola linako.

Lisebelisoa tsa ho fafatsa: U tla hloka sistimi ea ho fana, joalo ka seringe kapa sesebelisoa, ho sebelisa epoxy ka nepo le ka mokhoa o ts'oanang.

Mohloli oa mocheso (boikhethelo): Lisebelisoa tse ling tsa epoxy tse tlatsitsoeng ka tlase li hloka ho phekoloa ka mocheso, kahoo u ka hloka mohloli oa mocheso, joalo ka onto kapa poleiti e chesang.

Lisebelisoa tsa ho hloekisa: E-ba le joala ba isopropyl kapa ntho e tšoanang ea ho hloekisa, li-wipes tse se nang lesela, le liatlana bakeng sa ho hloekisa le ho tšoara epoxy.

Mohato oa 2: Lokisetsa Likarolo

Hloekisa likaroloana: Netefatsa hore likarolo tse tla tlatsoa li hloekile ebile ha li na litšila tse kang lerole, mafura kapa mongobo. Li hloekise hantle u sebelisa joala ba isopropyl kapa ntho e tšoanang ea ho hloekisa.

Sebelisa sekhomaretsi kapa flux (haeba ho hlokahala): Ho itšetlehile ka thepa ea epoxy e sa tlatsoang le likarolo tse sebelisoang, ho ka 'na ha hlokahala hore u sebelise sekhomaretsi kapa ho phalla ho likarolo pele u sebelisa epoxy. Latela litaelo tsa moetsi bakeng sa thepa e khethehileng e sebelisoang.

Mohato oa 3: Kopanya epoxy

Latela litaelo tsa moetsi ho kopanya thepa ea epoxy e sa tlalang hantle. Sena se ka kenyelletsa ho kopanya likarolo tse peli kapa ho feta tsa epoxy ka li-ratios tse khethehileng le ho li susumetsa ka botlalo ho fihlela motsoako o tšoanang. Sebelisa sejana se hloekileng le se omeletseng ho kopanya.

Mohato oa 4: Sebelisa Epoxy

Kenya epoxy ho sistimi ea phepelo: Tlatsa sistimi ea ho fana, joalo ka seringe kapa sesebelisoa, ka thepa e tsoakiloeng ea epoxy.

Sebelisa epoxy: Abela lisebelisoa tsa epoxy sebakeng se hlokang ho tlatsoa hanyane. Etsa bonnete ba hore o sebelisa epoxy ka mokhoa o ts'oanang le o laoloang ho etsa bonnete ba ho koahela likarolo tse feletseng.

Qoba lipululoana tsa moea: Qoba ho tšoasa li-bubble tsa moea ka har'a epoxy, kaha li ka ama ts'ebetso le ts'epahalo ea likarolo tse sa tlatsoang. Sebelisa mekhoa e nepahetseng ea ho fana, joalo ka khatello e liehang le e tsitsitseng, 'me ka bonolo u felise lipululana tsa moea tse qabeletsoeng ka vacuum kapa u tlanye kopano.

Mohato oa 5: Phekola Epoxy

Ho phekola epoxy: Latela litaelo tsa moetsi bakeng sa ho phekola epoxy e sa tlalang. Ho itšetlehile ka thepa ea epoxy e sebelisoang, sena se ka kenyelletsa ho lokisa mocheso oa kamore kapa ho sebelisa mohloli oa mocheso.

Lumella nako e nepahetseng ea phekolo: Fana ka epoxy nako e lekaneng ea ho fola ka botlalo pele o sebetsana kapa o tsoela pele ho sebetsana le likarolo. Ho ipapisitse le thepa ea epoxy le maemo a pheko, sena se ka nka lihora tse 'maloa ho isa matsatsing a' maloa.

Mohato oa 6: Hloekisa 'me u hlahlobe

Hloekisa epoxy e feteletseng: Hang ha epoxy e folile, tlosa epoxy leha e le efe e feteletseng ka mekhoa e nepahetseng ea ho hloekisa, e kang ho senya kapa ho itšeha.

Lekola likarolo tse tlatsitsoeng hanyane: Lekola likarolo tse sa tlatsoang hantle bakeng sa mefokolo leha e le efe, joalo ka li-voids, delamination, kapa tšireletso e sa fellang. Haeba ho na le bofokoli leha e le bofe, nka mehato e nepahetseng ea ho lokisa, joalo ka ho tlatsa hape kapa ho phekola hape, ha ho hlokahala.

U Tlatsa neng ho Tlatsa Epoxy

Nako ea kopo ea underfill epoxy e tla ipapisa le ts'ebetso le ts'ebeliso e ikhethileng. Ka kakaretso epoxy ea underfill e sebelisoa ka mor'a hore microchip e kenngoe holim'a boto ea potoloho 'me manonyeletso a solder a thehiloe. U sebelisa sesebelisoa kapa syringe, epoxy e sa tlaleng e kenngoa ka lekhalo le lenyenyane pakeng tsa microchip le boto ea potoloho. Joale epoxy e ea phekoloa kapa ea thatafala, hangata e futhumatsa mocheso o itseng.

Nako e nepahetseng ea kopo ea underfill epoxy e ka ipapisa le lintlha tse kang mofuta oa epoxy e sebelisitsoeng, boholo le geometry ea lekhalo le lokelang ho tlatsoa, ​​le mokhoa o ikhethileng oa ho folisa. Ho bohlokoa ho latela litaelo tsa moetsi le mokhoa o khothaletsoang bakeng sa epoxy e itseng e sebelisoang.

Mona ke maemo a mang a letsatsi le letsatsi ha underfill epoxy e ka sebelisoa:

Flip-chip bonding: Underfill epoxy hangata e sebelisoa ho flip-chip bonding, e leng mokhoa oa ho hokela chip ea semiconductor ka kotloloho ho PCB ntle le khokahanyo ea mohala. Ka mor'a hore flip-chip e khomarele PCB, epoxy ea underfill e atisa ho sebelisoa ho tlatsa lekhalo pakeng tsa chip le PCB, ho fana ka matlafatso ea mochine le ho sireletsa chip linthong tsa tikoloho tse kang mongobo le liphetoho tsa mocheso.

Theknoloji ea Surface mount technology (SMT): Underfill epoxy e ka boela ea sebelisoa lits'ebetsong tsa theknoloji ea holim'a metsi (SMT), moo likarolo tsa elektroniki tse kang li-circuits (ICs) le li-resistors li kenngoeng ka kotloloho holim'a PCB. Underfill epoxy e ka sebelisoa ho matlafatsa le ho sireletsa likarolo tsena ka mor'a hore li rekisoe ho PCB.

Kopano ea chip-on-board (COB): Kopanong ea chip-on-board (COB), li-chips tsa semiconductor tse se nang letho li hokelloa ka kotloloho ho PCB li sebelisa likhomaretsi tse tsamaisang, 'me epoxy e sa tlalang e ka sebelisoa ho koahela le ho matlafatsa lichifi, ho ntlafatsa botsitso le ts'epahalo ea tsona.

Tokiso ea boemo ba karolo: Underfill epoxy e ka boela ea sebelisoa lits'ebetsong tsa tokiso ea likarolo, moo likarolo tsa elektroniki tse senyehileng kapa tse fosahetseng ho PCB li nkeloang sebaka ke tse ncha. Underfill epoxy e ka sebelisoa ho karolo e ncha ho netefatsa ho khomarela hantle le botsitso ba mochini.

Ke Epoxy Filler e sa keneleng metsi

Ee, epoxy filler hangata ha e kenelle metsi hang ha e folile. Li-filler tsa epoxy li tsebahala ka ho khomarela hantle le ho hanyetsa metsi, e leng se etsang hore e be khetho e tsebahalang bakeng sa mefuta e fapaneng ea lisebelisoa tse hlokang tlamo e tiileng le e sa keneleng metsi.

Ha e sebelisoa e le ho tlatsa, epoxy e ka tlatsa mapetsong le likheo ka mokhoa o nepahetseng oa lisebelisoa tse fapaneng, ho kenyeletsoa lehong, tšepe le konkreite. Ha e se e phekotsoe, e etsa sebaka se thata, se tšoarellang se sa keneleng metsi le mongobo, se etsa hore e be se loketseng ho sebelisoa libakeng tse nang le metsi kapa mongobo o phahameng.

Leha ho le joalo, ho bohlokoa ho hlokomela hore ha se li-filler tsa epoxy kaofela tse entsoeng li lekana, 'me tse ling li ka ba le maemo a fapaneng a ho hanyetsa metsi. Kamehla ke mohopolo o motle ho sheba leibole ea sehlahisoa se itseng kapa ho buisana le moetsi ho netefatsa hore se loketse morero oa hau le ts'ebeliso e reriloeng.

Ho netefatsa liphetho tse ntle, ho bohlokoa ho lokisa bokantle pele o sebelisa epoxy filler. Hangata sena se kenyelletsa ho hloekisa sebaka hantle le ho tlosa thepa leha e le efe e hlephileng kapa e senyehileng. Hang ha bokaholimo bo lokisitsoe ka nepo, epoxy filler e ka tsoakoa mme ea sebelisoa ho latela litaelo tsa moetsi.

Ho bohlokoa hape ho hlokomela hore ha se li-filler tsohle tsa epoxy tse entsoeng li lekana. Lihlahisoa tse ling li ka ba tse loketseng lits'ebetso tse itseng kapa bokaholimo ho feta tse ling, kahoo ho bohlokoa ho khetha sehlahisoa se nepahetseng bakeng sa mosebetsi. Ho phaella moo, li-fillers tse ling tsa epoxy li ka 'na tsa hloka liaparo tse eketsehileng kapa li-sealers ho fana ka tšireletso ea nako e telele ea ho thibela metsi.

Li-filler tsa epoxy li tumme ka thepa ea tsona ea ho thibela metsi le bokhoni ba ho theha maqhama a matla le a tšoarellang. Leha ho le joalo, ho latela mekhoa e nepahetseng ea kopo le ho khetha sehlahisoa se nepahetseng ke tsa bohlokoa ho netefatsa litholoana tse ntle.

Ts'ebetso ea Underfill Epoxy Flip Chip

Mehato ea ho etsa ts'ebetso ea underfill epoxy flip chip ke ena:

Ho hloekisa: Substrate le flip chip lia hloekisoa ho tlosa lerōle leha e le lefe, lithōle, kapa litšila tse ka sitisang bond ea epoxy e sa tlatsoang.

Ho fana ka: Epoxy e sa tlatsoang e tšeloa holim'a substrate ka mokhoa o laoloang, ho sebelisoa mochine kapa nale. Mokhoa oa ho fana o tlameha ho ba o nepahetseng ho qoba ho tlala kapa likheo.

Tlhaloso: Joale flip chip e tsamaisana le substrate ho sebelisa microscope ho netefatsa hore e behiloe ka nepo.

Hlahisa hape: Flip chip e tšeloa hape ho sebelisoa sebōpi kapa ontong ho qhibilihisa maqhubu a solder le ho kopanya chip ho substrate.

Ho folisa: Epoxy e sa tlatsoang hantle e phekoloa ka ho e futhumatsa ka ontong ka mocheso le nako e itseng. Mokhoa oa ho phekola o lumella epoxy ho phalla le ho tlatsa likheo leha e le life pakeng tsa flip chip le substrate.

Ho hloekisa: Ka mor'a ts'ebetso ea ho folisa, epoxy leha e le efe e feteletseng e tlosoa metseng ea chip le substrate.

tlhahlobo: Mohato oa ho qetela ke ho hlahloba flip chip ka tlas'a microscope ho netefatsa hore ha ho likheo kapa likheo ka har'a epoxy e sa tlatsoang.

Ka mor'a pheko: Maemong a mang, ts'ebetso ea ka mor'a phekolo e ka 'na ea hlokahala ho ntlafatsa thepa ea mochine le ea mocheso oa epoxy e sa tlatsoang. Sena se kenyelletsa ho futhumatsa chip hape ka mocheso o phahameng ka nako e telele ho fihlela kamano e felletseng ea epoxy.

Teko ea motlakase: Kamora ts'ebetso ea underfill epoxy flip-chip, sesebelisoa se lekoa ho netefatsa hore se sebetsa hantle. Sena se ka kenyelletsa ho hlahloba lifupi kapa ho bula potolohong le ho hlahloba litšobotsi tsa motlakase tsa sesebelisoa.

ambalaji: Hang ha sesebelisoa se lekoa 'me se netefalitsoe, se ka kenngoa le ho romelloa ho moreki. Sephutheloana se ka kenyelletsa tšireletso e eketsehileng, joalo ka seaparo se sireletsang kapa encapsulation, ho netefatsa hore sesebelisoa ha se senyehe nakong ea lipalangoang kapa ho sebetsana.

Epoxy Underfill Bga Mokhoa

Ts'ebetso ena e kenyelletsa ho tlatsa sebaka se pakeng tsa chip ea BGA le boto ea potoloho ka epoxy, e fanang ka tšehetso e eketsehileng ea mochini le ho ntlafatsa ts'ebetso ea mocheso oa ho hokahanya. Mona ke mehato e amehang ho epoxy underfill mokhoa oa BGA:

• Lokisetsa sephutheloana sa BGA le PCB ka ho li hloekisa ka solvent ho tlosa litšila tse ka amang bond.
• Kenya palo e nyane ea phallo bohareng ba sephutheloana sa BGA.
• Beha sephutheloana sa BGA holim'a PCB 'me u sebelise ontong ea reflow ho rekisa sephutheloana holim'a boto.
• Kenya karolo e nyane ea epoxy underfill hukung ea sephutheloana sa BGA. Tlatsetso e tlase e lokela ho sebelisoa hukung e haufi haholo le bohareng ba sephutheloana, 'me ha ea lokela ho koahela leha e le efe ea libolo tsa solder.
• Sebelisa ketso ea capillary kapa vacuum ho hula underfill tlasa sephutheloana sa BGA. The underfill lokela ho phalla ho pota-pota libolo tsa solder, ho tlatsa voids leha e le efe le ho theha maqhama a tiileng pakeng tsa BGA le PCB.
• Phekola ho tlatsa ho latela litaelo tsa moetsi. Hangata sena se kenyelletsa ho futhumatsa kopano mochesong o itseng ka nako e itseng.
• Hloekisa kopano ka solvent ho tlosa flux efe kapa efe e feteletseng kapa underfill.
• Lekola botlaaseng bakeng sa li-voids, bubble, kapa likoli tse ling tse ka sitisang ts'ebetso ea chip ea BGA.
• Hloekisa epoxy efe kapa efe e feteletseng ho chip ea BGA le boto ea potoloho u sebelisa solvent.
• Lekola chip ea BGA ho netefatsa hore e sebetsa hantle.

Epoxy underfill e fana ka melemo e mengata bakeng sa liphutheloana tsa BGA, ho kenyelletsa le matla a ntlafalitsoeng a mochini, ho fokotsa khatello ea maikutlo manonyeletsong a solder, le ho eketseha ha khanyetso ho baesekele e futhumetseng. Leha ho le joalo, ho latela litaelo tsa moetsi ka hloko ho tiisa maqhama a tiileng le a ka tšeptjoang pakeng tsa sephutheloana sa BGA le PCB.

Mokhoa oa ho etsa Underfill Epoxy Resin

Underfill epoxy resin ke mofuta oa sekhomaretsi o sebelisetsoang ho tlatsa likheo le ho matlafatsa likarolo tsa elektroniki. Mehato e akaretsang ea ho etsa epoxy resin e sa tlatsoang ke ena:

• Lijo:
• Epoxy lehoakhoa
• Thatafatsa
• Lisebelisoa tsa ho tlatsa (tse kang silica kapa likhaba tsa khalase)
• Li-solvents (tse kang acetone kapa isopropyl alcohol)
• Li-Catalysts (ho ikhethela)

mehato:

Khetha epoxy resin e loketseng: Khetha epoxy resin e loketseng kopo ea hau. Li-resin tsa epoxy li tla ka mefuta e fapaneng e nang le thepa e fapaneng. Bakeng sa lits'ebetso tse sa tlalang, khetha resin e nang le matla a phahameng, ho honyela ho tlase le ho khomarela hantle.

Kopanya epoxy resin le harderer: Boholo ba li-resin tsa epoxy tse senyehileng li tla ka khiti e nang le likarolo tse peli, 'me resin le harderer li phuthetsoe ka thoko. Kopanya likarolo tse peli hammoho ho latela litaelo tsa moetsi.

Kenya lisebelisoa tsa ho tlatsa: Eketsa lisebelisoa tsa ho tlatsa motsoako oa epoxy resin ho eketsa viscosity ea eona le ho fana ka tšehetso e eketsehileng ea sebopeho. Lifaha tsa silika kapa tsa khalase hangata li sebelisoa e le li-fillers. Eketsa li-filler butle-butle 'me u kopanye ka botlalo ho fihlela ho finyelloa ho lumellana ho lakatsehang.

Kenya li-solvents: Li-solvents li ka kenyelletsoa motsoako oa epoxy resin ho ntlafatsa phallo ea eona le thepa ea ho koloba. Acetone kapa joala ba isopropyl hangata bo sebelisoa ke solvents. Eketsa li-solvents butle-butle 'me u kopanye ka botlalo ho fihlela ts'ebetso e lakatsehang e finyelloa.

boikhethelo: Eketsa li-catalysts: Li-Catalysts li ka kenyelletsoa motsoako oa epoxy resin ho potlakisa mokhoa oa ho folisa. Leha ho le joalo, lintho tse susumetsang li ka boela tsa fokotsa bophelo ba pitsa ea motsoako, kahoo li sebelise ka mokhoa o fokolang. Latela litaelo tsa moetsi bakeng sa palo e loketseng ea catalyst ho eketsa.

Sebelisa underfill epoxy resin ho tlatsa motsoako oa epoxy resin ho lekhalo kapa lenonyeletso. Sebelisa syringe kapa dispenser ho sebelisa motsoako ka nepo le ho qoba lipudula tsa moea. Etsa bonnete ba hore motsoako o arotsoe ka ho lekana 'me o koahela libaka tsohle.

Ho phekola epoxy resin: Epoxy resin e ka phekola ho latela litaelo tsa moetsi. Boholo ba li-resin tsa epoxy tse sa tlalang li phekola mocheso oa kamore, empa tse ling li ka hloka mocheso o phahameng bakeng sa ho fola kapele.

 Na ho na le Meeli Kapa Liphephetso Tse Amanang le Epoxy Underfill?

E, ho na le mefokolo le liphephetso tse amanang le epoxy underfill. Tse ling tsa mefokolo le mathata a tloaelehileng ke:

Phapang ea katoloso ea mocheso: Li-epoxy underfills li na le coefficient of thermal expansion (CTE) e fapaneng le CTE ea likarolo tse sebelisetsoang ho tlatsa. Sena se ka baka khatello ea mocheso 'me se ka baka ho hloleha ha likarolo, haholo-holo libakeng tse nang le mocheso o phahameng.

Ho sebetsana le mathata: Epoxy e nyenyefatsa lisebelisoa le mekhoa e khethehileng ea ts'ebetso, ho kenyelletsa le lisebelisoa tsa ho abela le ho phekola. Haeba e sa etsoa ka nepo, ho tlatsa fatše ho ka 'na ha se ke ha tlatsa likheo hantle pakeng tsa likarolo kapa ho ka baka tšenyo ho likarolo.

Kutloelo-bohloko ea mongobo: Li-underfill tsa epoxy li na le maikutlo a mongobo 'me li ka monya mongobo o tsoang tikolohong. Sena se ka baka mathata ka ho khomarela 'me se ka lebisa ho hloleheng ha likarolo.

Tšebelisano ea lik'hemik'hale: Li-epoxy underfill li ka sebetsana le lisebelisoa tse ling tse sebelisoang likarolong tsa elektroniki, joalo ka limaske tsa solder, li-adhesives le fluxes. Sena se ka baka mathata ka ho khomarela 'me se ka lebisa ho hloleheng ha likarolo.

Litšenyehelo: Li-underfill tsa epoxy li ka ba theko e boima ho feta lisebelisoa tse ling tse sa tlalang, joalo ka li-capillary underfill. Sena se ka etsa hore li se ke tsa khahleha haholo bakeng sa ho sebelisoa libakeng tse phahameng tsa tlhahiso.

Mathata a tikoloho: Epoxy underfill e ka ba le lik'hemik'hale le lisebelisoa tse kotsi, joalo ka bisphenol A (BPA) le phthalates, tse ka behang bophelo ba batho kotsing le tikolohong. Baetsi ba tlameha ho nka mehato e nepahetseng ho netefatsa hore thepa ena e sebetsa ka mokhoa o sireletsehileng le ho lahloa.

 Nako ea ho fepa: Epoxy underfill e hloka nako e itseng ea ho fola pele e ka sebelisoa ts'ebelisong. Nako ea ho folisa e ka fapana ho ea ka sebopeho se ikhethileng sa underfill, empa hangata e tloha ho metsotso e mengata ho isa ho lihora tse 'maloa. Sena se ka fokotsa ts'ebetso ea tlhahiso le ho eketsa nako eohle ea tlhahiso.

Le hoja li-epoxy underfills li fana ka melemo e mengata, ho kenyelletsa le ho tšepahala ho ntlafetseng le ho tšoarella ha likarolo tsa elektronike, li boetse li hlahisa mathata le mefokolo e lokelang ho nahanoa ka hloko pele e sebelisoa.

Melemo ea ho sebelisa Epoxy Underfill ke efe?

Mona ke tse ling tsa melemo ea ho sebelisa epoxy underfill:

Mohato oa 1: Ho tšepahala ho eketsehileng

E 'ngoe ea melemo ea bohlokoa ka ho fetisisa ea ho sebelisa epoxy underfill ke ho tšepahala ho eketsehileng. Likarolo tsa elektronike li kotsing ea ho senyeha ka lebaka la khatello ea mocheso le mechine, joalo ka ho palama baesekele e chesang, ho sisinyeha le ho makala. Epoxy underfill e thusa ho sireletsa manonyeletso a solder ho likarolo tsa elektronike ho senyeha ka lebaka la likhatello tsena, tse ka eketsang botšepehi le bophelo ba sesebelisoa sa elektronike.

Mohato oa 2: Ts'ebetso e ntlafetseng

Ka ho fokotsa kotsi ea tšenyo ea likarolo tsa elektronike, epoxy underfill e ka thusa ho ntlafatsa ts'ebetso ea kakaretso ea sesebelisoa. Likarolo tsa elektronike tse sa matlafalitsoeng ka nepo li ka ba le bothata ba ts'ebetso e fokotsehileng kapa esita le ho hloleha ho felletseng, 'me li-epoxy underfill li ka thusa ho thibela litaba tsena, tse lebisang ho sesebelisoa se tšepahalang le se sebetsang hantle.

Mohato oa 3: Tsamaiso e ntle ea mocheso

Epoxy underfill e na le conductivity e ntle ea mocheso, e thusang ho theola mocheso ho tsoa likarolong tsa elektroniki. Sena se ka ntlafatsa tsamaiso ea mocheso oa sesebelisoa le ho thibela ho chesa haholo. Ho chesa haholo ho ka baka tšenyo ea likarolo tsa elektronike 'me ho lebisa mathateng a ts'ebetso kapa esita le ho hlōleha ho feletseng. Ka ho fana ka tsamaiso e sebetsang ea mocheso, epoxy underfill e ka thibela mathata ana le ho ntlafatsa ts'ebetso ea kakaretso le nako ea bophelo ea sesebelisoa.

Mohato oa 4: Matla a ntlafalitsoeng a mochini

Epoxy underfill e fana ka ts'ehetso e eketsehileng ea mochini ho likarolo tsa elektroniki, tse ka thusang ho thibela tšenyo ka lebaka la ho thothomela kapa ho ts'oha. Likarolo tsa elektronike tse sa matlafalitsoeng ka ho lekaneng li ka ba le khatello ea kelello ea mochine, e lebisang ho tsoa kotsi kapa ho hlōleha ka ho feletseng. Epoxy e ka thusa ho thibela mathata ana ka ho fana ka matla a eketsehileng a mochine, a lebisang ho sesebelisoa se ka tšeptjoang le se tšoarellang.

Mohato oa 5: Leqephe la ntoa le fokotsehile

Epoxy underfill e ka thusa ho fokotsa warpage ea PCB nakong ea ts'ebetso ea soldering, e leng se ka lebisang ho ts'epahalo e ntlafetseng le boleng bo botle bo kopanetsoeng ba solder. PCB warpage e ka baka mathata ka ho tsamaisana ha likarolo tsa elektronike, e leng se lebisang ho liphoso tse tloaelehileng tsa solder tse ka bakang mathata a ho tšepahala kapa ho hlōleha ka ho feletseng. Epoxy underfill e ka thusa ho thibela litaba tsena ka ho fokotsa warpage nakong ea tlhahiso.

Epoxy Underfill e sebelisoa Joang ho Tlhahiso ea Elektronike?

Mehato e amehang ho sebelisa epoxy underfill ho tlhahiso ea lisebelisoa tsa elektroniki ke ena:

Ho lokisa likaroloana: Likarolo tsa elektroniki li tlameha ho raloa pele u sebelisa epoxy underfill. Likarolo li hloekisoa ho tlosa litšila, lerōle kapa litšila tse ka sitisang ho khomarela epoxy. Joale likarolo li behoa ho PCB ebe li tšoaroa ka sekhomaretsi sa nakoana.

Ho hlahisa epoxy: Epoxy underfill e fetisetsoa ho PCB ho sebelisoa mochini o fehlang. Mochini o tsamaisang thepa o lekantsoe ho fana ka epoxy ka bongata le sebaka se nepahetseng. Epoxy e ajoa ka molapo o tsoelang pele haufi le moeli oa motsoako. Phallo ea epoxy e lokela ho ba nako e telele ho lekana ho koahela lekhalo lohle pakeng tsa element le PCB.

Ho jala epoxy: Ka mor'a ho fana ka eona, e tlameha ho ajoa ho koala lekhalo pakeng tsa motsoako le PCB. Sena se ka etsoa ka letsoho ho sebelisa borashe bo bonyenyane kapa mochini o hasoang o ikemetseng. Epoxy e hloka ho hasana ka mokhoa o ts'oanang ntle le ho siea li-void kapa li-bubble tsa moea.

Ho phekola epoxy: Epoxy underfill e ntan'o lokisoa ho thatafatsa le ho theha maqhama a tiileng lipakeng tsa karolo le PCB. Mokhoa oa ho folisa o ka etsoa ka litsela tse peli: mocheso kapa UV. Ha ho phekoloa ka mocheso, PCB e behoa ka ontong 'me e futhumetse mocheso o itseng ka nako e itseng. Ka pheko ea UV, epoxy e pepesetsoa leseli la ultraviolet ho qala ts'ebetso ea ho folisa.

Ho hloekisa: Ka mor'a hore epoxy underfills e phekoloe, epoxy e feteletseng e ka tlosoa ho sebelisoa scraper kapa solvent. Ho bohlokoa ho tlosa epoxy efe kapa efe e feteletseng ho e thibela ho kena-kenana le ts'ebetso ea karolo ea elektroniki.

Ke Lisebelisoa life tse Tloaelehileng tsa Epoxy Underfill?

Mona ke tse ling tsa lits'ebetso tse tloaelehileng tsa underfill ea epoxy:

Sephutheloana sa semiconductor: Epoxy underfill e sebelisoa haholo ho paka lisebelisoa tsa semiconductor, joalo ka li-microprocessors, li-circuits tse kopaneng (ICs), le liphutheloana tsa flip-chip. Ts'ebetsong ena, epoxy underfill e tlatsa lekhalo pakeng tsa chip ea semiconductor le substrate, e fana ka matlafatso ea mochini le ho matlafatsa conductivity ea mocheso ho qhala mocheso o hlahisoang nakong ea ts'ebetso.

Kopano ea Boto ea potoloho e hatisitsoeng (PCB): Epoxy underfill e sebelisoa 'meleng oa li-PCB ho matlafatsa ts'epahalo ea manonyeletso a solder. E sebelisoa karolong e ka tlaase ea likarolo tse kang ball grid array (BGA) le lisebelisoa tsa chip scale package (CSP) pele ho reflow soldering. Li-epoxy underfills li phalla ka har'a likheo tse pakeng tsa karolo le PCB, li theha maqhama a matla a thusang ho thibela ho hloleha ha manonyeletso a solder ka lebaka la khatello ea mochini, joalo ka libaesekele tse futhumetseng le ho ts'oha / ho sisinyeha.

Optoelectronics: Epoxy underfill e boetse e sebelisoa ho paka lisebelisoa tsa optoelectronic, tse kang light-emitting diodes (LED) le laser diode. Lisebelisoa tsena li hlahisa mocheso nakong ea ts'ebetso, 'me li-epoxy underfill li thusa ho felisa mocheso ona le ho ntlafatsa ts'ebetso ea mocheso oa sesebelisoa. Ho feta moo, epoxy underfill e fana ka matlafatso ea mochini ho sireletsa likarolo tse bobebe tsa optoelectronic khatellong ea mochini le maemo a tikoloho.

Lisebelisoa tsa elektroniki tsa likoloi: Epoxy underfill e sebelisoa ho lisebelisoa tsa elektroniki tsa likoloi bakeng sa lits'ebetso tse fapaneng, joalo ka likarolo tsa taolo ea enjene (ECUs), li-transmission control units (TCUs), le li-sensor. Likaroloana tsena tsa elektroniki li tlas'a maemo a thata a tikoloho, ho kenyelletsa mocheso o phahameng, mongobo le ho thothomela. Epoxy underfill e sireletsa khahlanong le maemo ana, e netefatsa ts'ebetso e tšepahalang le ho tšoarella ha nako e telele.

Consumer electronics: Epoxy underfill e sebelisoa lisebelisoa tse fapaneng tsa elektroniki tsa bareki, ho kenyeletsoa li-smartphones, matlapa, li-consoles tsa lipapali le lisebelisoa tse ka roaloang. E thusa ho ntlafatsa ts'ebetso ea mochini oa lisebelisoa tsena le ts'ebetso ea mocheso, ho netefatsa ts'ebetso e tšepahalang tlasa maemo a fapaneng a ts'ebeliso.

Sepakapaka le tšireletso: Epoxy underfill e sebelisoa sebakeng sa sefofane le lits'ireletso, moo lisebelisoa tsa elektroniki li tlamehang ho mamella maemo a feteletseng, joalo ka mocheso o phahameng, bophahamo bo phahameng le ho thothomela ho matla. Epoxy underfill e fana ka botsitso ba mochini le taolo ea mocheso, e e etsa hore e tšoanele libaka tse matsaranka le tse hlokang.

Mekhoa ea ho folisa bakeng sa ho se be le epoxy underfill ke efe?

Ts'ebetso ea ho phekola epoxy underfill e kenyelletsa mehato e latelang:

Ho fana ka: Epoxy underfill hangata e ajoa e le sesebelisoa sa metsi holim'a substrate kapa chip ho sebelisoa sesebelisoa sa jetting kapa jetting system. Epoxy e sebelisoa ka mokhoa o nepahetseng ho koahela sebaka sohle se hlokang ho tlatsoa.

Khokahano: Hang ha epoxy e fanoe, hangata chip e behoa ka holim'a substrate, 'me epoxy underfill e phalla ho pota-pota le ka tlas'a chip, e e koahela. Thepa ea epoxy e etselitsoe ho phalla habonolo le ho tlatsa likheo pakeng tsa chip le substrate ho etsa lera le ts'oanang.

Phekolo ea pele: Epoxy underfill hangata e phekoleha esale pele kapa e phekoleha ka mokhoa o sa tsitsang ho ba boits'oaro bo kang ba gel kamora ho koaheloa. Sena se etsoa ka ho kenya kopano tšebetsong ea ho folisa mocheso o tlase, joalo ka ho baka ka ontong kapa ka infrared (IR). Mohato oa pele oa ho folisa o thusa ho fokotsa viscosity ea epoxy le ho e thibela ho phalla ho tsoa sebakeng sa underfill nakong ea mehato e latelang ea ho phekola.

Ka mor'a ho phekola: Hang ha li-epoxy underfill li se li phekotsoe, kopano e kenngoa ts'ebetsong ea ho folisa mocheso o phahameng, hangata ka ontong ea convection kapa phaposing ea pheko. Mohato ona o tsejoa e le ho phekola ka mor'a ho phekola kapa ho phekola ho qetela, 'me o etsoa ho phekola ka botlalo thepa ea epoxy le ho finyella boholo ba eona ba mechine le mocheso. Nako le mocheso oa ts'ebetso ea ka mor'a ho phekola li laoloa ka hloko ho etsa bonnete ba hore pholiso e feletseng ea epoxy underfill.

Ho pholile: Ka mor'a ts'ebetso ea morao-rao, kopano e atisa ho lumelloa ho pholile ho fihlela mocheso oa kamore butle-butle. Pholiso e potlakileng e ka baka khatello ea mocheso 'me ea ama botšepehi ba epoxy underfill, kahoo ho pholisa ho laoloang ho bohlokoa ho qoba mathata leha e le afe a ka bang teng.

tlhahlobo: Hang ha li-epoxy underfill li se li folile ka botlalo, 'me kopano e se e theohile, hangata e hlahlojoa ho bona hore na ho na le mefokolo kapa likheo tsa thepa e sa tlalang. X-ray kapa mekhoa e meng e sa senyeheng ea tlhahlobo e ka sebelisoa ho lekola boleng ba epoxy underfill le ho netefatsa hore e hokahane le chip le substrate ka mokhoa o lekaneng.

Ke mefuta efe e fapaneng ea lisebelisoa tsa epoxy underfill tse teng?

Ho na le mefuta e 'maloa ea lisebelisoa tsa underfill ea epoxy, e' ngoe le e 'ngoe e na le thepa le litšobotsi tsa eona. E meng ea mefuta e tloaelehileng ea lisebelisoa tsa underfill ea epoxy ke:

Capillary Underfill: Lisebelisoa tsa capillary underfill ke li-resin tsa epoxy tse tlase-viscosity tse phallang ka har'a likheo tse moqotetsane pakeng tsa chip ea semiconductor le substrate ea eona nakong ea ts'ebetso ea ho tlatsa. Li etselitsoe ho ba le viscosity e tlase, e li lumellang hore li phalle habonolo likheong tse nyane ka ts'ebetso ea capillary, ebe li phekola ho theha thepa e thata, ea thermosetting e fanang ka matlafatso ea mochini ho kopano ea chip-substrate.

No-Flow Under Fill: Joalo ka ha lebitso le fana ka maikutlo, lisebelisoa tse se nang phallo ea metsi ha li phalle nakong ea ts'ebetso ea underfill. Ka tloaelo li entsoe ka li-resin tsa epoxy tse nang le viscosity e phahameng 'me li sebelisoa e le pente ea epoxy e fanoeng esale pele kapa filimi holim'a substrate. Nakong ea ts'ebetso ea kopano, chip e behoa ka holim'a ho se be le phallo e tlaase, 'me kopano e kenngoa mocheso le khatello, e leng se etsang hore epoxy e phekole le ho etsa thepa e thata e tlatsang likheo pakeng tsa chip le substrate.

Molded Underfill: Lisebelisoa tse entsoeng ka underfill ke li-resin tsa epoxy tse bōpiloeng esale pele tse behiloeng holim'a substrate ebe li futhumatsoa ho phalla le ho koahela chip nakong ea ts'ebetso ea underfill. Hangata li sebelisoa lits'ebetsong moo tlhahiso ea boleng bo phahameng le taolo e nepahetseng ea ho beoa ha thepa e sa tlalang ho hlokahalang.

Tlatsetso ea Boemo ba Wafer: Lisebelisoa tsa ho tlatsa li-wafer-level ke li-resin tsa epoxy tse kenngoeng holim'a bokaholimo bohle ba li-wafer pele li-chips li aroloa. Joale epoxy e ea phekoloa, 'me e etsa thepa e thata e fanang ka tšireletso e sa lekaneng ho li-chips tsohle tse holim'a sephaphatha. Sehlahisoa sa Wafer-level underfill hangata se sebelisoa lits'ebetsong tsa liphutheloana tsa "wafer-level packaging" (WLP), moo li-chips tse ngata li bokelloang hammoho holim'a sephutheloana se le seng pele li aroloa ka liphutheloana ka bomong.

Encapsulant Underfill: Lisebelisoa tsa ho tlatsa li-encapsulant ke li-resin tsa epoxy tse sebelisetsoang ho koahela kopano eohle ea chip le substrate, ho etsa mokoallo o sireletsang ho potoloha likarolo. Hangata li sebelisoa lits'ebetsong tse hlokang matla a phahameng a mochini, ts'ireletso ea tikoloho, le ts'epo e ntlafalitsoeng.

Mehloli e Amanang ka Epoxy Adhesive Glue:

Epoxy Encapsulant

Likhomaretsi tsa boemo ba chip li epoxy ka tlase

Sekhomaretsi sa Epoxy sa likarolo tse peli

Karolo e le 'ngoe ea Epoxy Underfill Encapsulant

Mocheso o tlase Pheko BGA Flip Chip Underfill PCB Epoxy

Epoxy-Based Chip Underfill Le COB Encapsulation Materials

Flip-Chip Le BGA e Utlafatsa Sekhomaretsi sa Epoxy Adhesive

Melemo le Likopo tsa li-Epoxy Encapsulants tse sa Tlatsehang ho Electronics

Mokhoa oa ho sebelisa sekhomaretsi sa smt underfill epoxy lits'ebetsong tse fapaneng

Litharollo tse ntle ka ho fetisisa tsa sekhomaretsi sa epoxy underfill bakeng sa ts'ebetso e ntle ea karolo ea SMT

TIISETSO PHAHAMENG
Deepmaterial e ikemiselitse ho ba moetapele indastering ea epoxy underfill ea elektroniki, boleng ke moetlo oa rona!

THEKO THEKO EA FACTORY
Re ts'episa ho tlohella bareki ho fumana lihlahisoa tsa likhomaretsi tsa epoxy tse jang chelete e ngata

MOEKETSI MOEKETSI
Ka sekhomaretsi sa epoxy sa underfill e le setsi sa mantlha, se kopanyang liteishene le mahlale

TŠEBELETSO TŠEBELETSO
Fana ka li-adhesives tsa epoxy OEM, ODM, 1 MOQ. Sehlopha se feletseng sa Setifikeiti