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5. Epoxy-Based Chip Underfill Le COB Encapsulation Materials

Epoxy-Based Chip Underfill Le COB Encapsulation Materials

DeepMaterial e fana ka li-capillary flow underfill tse ncha bakeng sa flip chip, CSP le lisebelisoa tsa BGA. DeepMaterial's new capillary flow underfills ke metsi a mangata, bohloeki bo phahameng, lisebelisoa tsa pitsa tse nang le karolo e le 'ngoe tse etsang liaparo tse sa tšoaneng, tse se nang letho tse nang le lisebelisoa tse ntlafatsang ho tšepahala le mekhoa ea mechine ea likarolo ka ho felisa khatello ea kelello e bakoang ke lisebelisoa tsa solder. DeepMaterial e fana ka liforomo bakeng sa ho tlatsa ka potlako likarolo tse ntle haholo tsa molumo, bokhoni ba ho fola ka potlako, ho sebetsa nako e telele le nako ea bophelo, hammoho le ho sebetsa hape. Reworkability e boloka litšenyehelo ka ho lumella ho tlosoa ha underfill bakeng sa tšebeliso ea boto hape.

Kopano ea Flip chip e hloka ho imolla khatello ea seam hape bakeng sa ho tsofala ha mocheso le bophelo ba potoloho. Kopano ea CSP kapa ea BGA e hloka tšebeliso ea underfill ho ntlafatsa botsitso ba mochini oa kopano nakong ea tlhahlobo ea flex, vibration kapa drop.

DeepMaterial's flip-chip underfill e na le litaba tse ngata tsa li-filler ha e ntse e boloka phallo e potlakileng ka har'a li-pitch tse nyane, ka bokhoni ba ho ba le mocheso o phahameng oa phetoho ea likhalase le modulus e phahameng. Li-underfill tsa rona tsa CSP li fumaneha ka maemo a fapaneng a li-filler, tse khethiloeng bakeng sa mocheso oa phetoho ea khalase le modulus bakeng sa ts'ebeliso e reriloeng.

COB encapsulant e ka sebelisoa bakeng sa ho kopanya terata ho fana ka tšireletso ea tikoloho le ho eketsa matla a mochini. Ho tiisoa ha tšireletso ea lichifi tse kentsoeng ka terata ho kenyelletsa encapsulation e holimo, cofferdam, le ho tlatsa lekhalo. Li-adhesives tse nang le ts'ebetso ea phallo e ntle e hlokahalang, hobane bokhoni ba tsona ba ho phalla bo tlameha ho etsa bonnete ba hore lithapo li koaletsoe, 'me sekhomaretsi se ke ke sa phalla ho tsoa ka har'a chip,' me se etsa bonnete ba hore se ka sebelisoa bakeng sa lisebelisoa tse ntle haholo.

Likhomaretsi tsa COB tsa DeepMaterial's COB e ka ba sekhomaretsi sa thermally kapa sa UV se ka folisoang ka mocheso kapa sa phekoloa ke UV ka ts'epo e phahameng le coefficient e tlase ea ho ruruha, hammoho le mocheso o phahameng oa phetoho ea likhalase le li-ion tse tlase. Likhomaretsi tsa DeepMaterial's COB tse koahelang li sireletsa li-lead le plumbum, li-chrome le li-silicon wafers tse tsoang tikolohong e kantle, tšenyo ea mochini le ho bola.

Likhomaretsi tsa DeepMaterial COB li entsoe ka epoxy e phekolang mocheso, UV-curing acrylic, kapa silicone chemistries bakeng sa ho kenya motlakase hantle. Likhomaretsi tse koahelang tsa DeepMaterial COB li fana ka botsitso bo botle ba mocheso o phahameng le ho hanyetsa mocheso oa mocheso, thepa ea ho sireletsa motlakase holim'a mefuta e mengata ea mocheso, le ho fokotseha ho fokolang, khatello e tlaase, le khanyetso ea lik'hemik'hale ha e phekoloa.

Deepmaterial ke sekhomaretsi se setle ka ho fetesisa se sa keneleng metsi bakeng sa polasetiki ho moetsi oa tšepe le oa khalase, fana ka sekhomaretsi se se nang conductive epoxy adhesive sealant bakeng sa likaroloana tsa elektroniki tsa pcb, likhomaretsi tsa semiconductor bakeng sa kopano ea elektroniki, pheko e tlase ea mocheso oa bga flip chip underfill pcb epoxy process sekhomaretsi sekhomaretsi joalo-joalo. ho

DeepMaterial Epoxy Resin Base Chip Tlatsa Tlase le Letlapa la Khetho ea Lintho tsa Cob
Mocheso o Motla o Phekola Khetho ea Sehlahisoa sa Epoxy Adhesive

Khetho ea Sehlahisoa sa Encapsulation Epoxy

Tlatsa khetho ea Sehlahisoa sa Epoxy

DeepMaterial Epoxy Based Chip Underfill Le COB Packaging Material Data Sheet
Leqephe la Boitsebiso ba Lintlha tsa Mocheso o Tlase oa Epoxy Adhesive Product

Leqephe la Lintlha tsa Sehlahisoa sa Epoxy Adhesive Encapsulated

Tlatsa Leqephe la Lintlha tsa Sehlahisoa sa Epoxy Adhesive