Nyeoe USA: Tharollo ea American Partner's Chip Underfill
Joalo ka naha ea theknoloji e phahameng, ho na le lik'hamphani tse ngata tsa BGA, CSP kapa Flip Chip USA, ka hona, likhomaretsi tse sa tlalang li hlokoa haholo.
E mong oa bareki ba rona ba tsoang lik'hamphaning tsa theknoloji e phahameng tsa USA, ba sebelisa tharollo ea DeepMaterial underfill bakeng sa chip underfill ea bona, 'me e sebetsa hantle.
DeepMaterial e fana ka lisebelisoa tse sebetsang hantle bakeng sa Sintering and Die Attach, Surface Mount, le lits'ebetso tsa Wave Soldering. Bophara ba lihlahisoa bo kenyelletsa Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills le Edgebond, Soldering Alloys, Liquid Soldering Flux, Cord Wire, Surface Mount Adhesives, Electronic Cleaners, le Stencils.
DeepMaterial Chip Underfill Adhesive series ke karolo e le 'ngoe, lisebelisoa tse phekolehang mocheso. Lisebelisoa li ntlafalitsoe bakeng sa ho se be le capillary underfill le reworkability. Lisebelisoa tsena tse thehiloeng ho epoxy li ka tsamaisoa ka mathōko a lisebelisoa tsa BGA, CSP kapa Flip Chip. Boitsebiso bona bo tla phalla ho tlatsa sebaka se ka tlas'a likarolo tsena.
Joalo ka ha e na le karolo e le 'ngoe ea capillary underfill e etselitsoeng ts'ireletso ea liphutheloana tse kopaneng tsa chip holim'a liboto tsa potoloho tse hatisitsoeng.
Ke mocheso o phahameng oa phetoho ea khalase [Tg] le katoloso e tlase ea coefficient ea mocheso [CTE]. Likarolo tsena li etsa hore ho be le tharollo e phahameng ea ho tšepahala.
Litlhahiso tsa Mesebetsi
· E fana ka tšireletso e felletseng ea likarolo ha e tšeloa holim'a substrate e futhumetseng ka 70 - 100 ° C.
· Litekanyetso tse phahameng tsa Tg le Low CTE li ntlafatsa haholo bokhoni ba ho feta tekong ea Thermal Cycling Test.
· Ts'ebetso e ntle ea Thermal Cycling Test
· Halogen ha e na Halogen mme e lumellana le RoHS Directive 2015/863/EU
Underfill Bakeng sa ho hanyetsa Mokhathala o ikhethang oa Thermal
Likopano tsa thekiso ea SAC li le mong likopanong tsa BGA le tsa CSP li na le tšekamelo ea ho thekesela lits'ebetsong tse matla tsa likoloi. Tg e phahameng le e tlase ea CTE [UF] ke tharollo ea matlafatso. Joalo ka ha rework ha se tlhokahalo, sena se lumella litaba tsa ho tlatsa tse holimo ka har'a moralo ho nts'etsapele litšoaneleho tse joalo.
DeepMaterial Chip Underfill Adhesive series e na le Tg e phahameng ea 165 ° C le CTE1 / CTE2 e tlaase ea 31 ppm / 105 ppm, ha e kopane 'me e lekoa ho feta 5000 cycles -40 +125 ° C teko ea mocheso oa libaesekele. Bakeng sa sekhahla se betere sa phallo, futhumatsa li-substrates nakong ea ho fana.
Re ntse re batlana le balekane ba lefats'e ka bophara ba lihlahisoa tse khomarelang tsa DeepMaterial, haeba u batla ho ba moemeli oa DeepMaterial's:
Morekisi oa sekhomaretsi oa sekhomaretsi Amerika,
Morekisi oa sekhomaretsi oa sekhomaretsi Europe,
Morekisi oa sekhomaretsi oa sekhomaretsi oa indasteri UK,
Morekisi oa sekhomaretsi oa sekhomaretsi oa indasteri India,
Morekisi oa sekhomaretsi oa liindasteri oa Australia,
Morekisi oa sekhomaretsi oa sekhomaretsi naheng ea Canada,
Morekisi oa sekhomaretsi oa liindasteri Afrika Boroa,
Morekisi oa sekhomaretsi oa liindasteri oa Japane,
Morekisi oa sekhomaretsi oa sekhomaretsi Europe,
Morekisi oa sekhomaretsi oa sekhomaretsi oa indasteri Korea,
Morekisi oa sekhomaretsi oa sekhomaretsi oa indasteri naheng ea Malaysia,
Morekisi oa sekhomaretsi oa sekhomaretsi naheng ea Philippines,
Morekisi oa sekhomaretsi oa liindasteri oa Vietnam,
Morekisi oa sekhomaretsi oa sekhomaretsi Indonesia,
Morekisi oa sekhomaretsi oa sekhomaretsi naheng ea Russia,
Morekisi oa sekhomaretsi oa sekhomaretsi naheng ea Turkey,
......
Iteanye le rona hona joale!
