Xirmada BGA Hoos-u-buuxinta Epoxy: Kobcinta Isku-kalsoonida Elektarooniga
Xirmada BGA Underfill Epoxy: Kor-u-qaadista Isku-kalsoonida Elektarooniga Adduunka sida dhaqsaha leh u kobcaya ee qalabka elektaroonigga ah, xirmooyinka Ball Grid Array (BGA) ayaa door muhiim ah ka ciyaara hagaajinta waxqabadka aaladaha casriga ah. Tiknoolajiyada BGA waxay bixisaa hab kooban, hufan, oo la isku halayn karo oo ku xidhida chips looxyada wareegyada daabacan (PCBs). Si kastaba ha ahaatee, sida ...