Codsiga Isku-xidhka Module Camera ee Qalabka DeepMaterial Camera moduleka koolada Alaabta
Dhinaca qalabka elektiroonigga ah, koollada ayaa si gaar ah loogu isticmaalaa qalabka kamaradaha ee taleefanka gacanta iyo casriga ah. Tan waxaa ka mid ah isku xidhka qaybaha gaarka ah - sida muraayada-lenska korka ama muraayada korka-ilaa-kameerada -, ilaalinta chips kamarada looxyada wareegyada (dhiman lifaaqa), iyadoo la isticmaalayo koollo sida chip underfill, Xidhmada hoose ee shaandhada iyo xabagta moduleka kamarada la shiiday galay hoyga qalabka.
Xabagta khaaska ah waxay awood u siinaysaa isku xidhka saxda ah iyo isku xidhka joogtada ah ee qaybaha yar ee kamaradaha Xabagta la isticmaalo waxay ku habboon tahay wax soo saarka ballaaran ee qaybaha kamaradaha waxayna si degdeg ah u daaweysaa heerkulka hooseeya.
Xabagta Module Camera
Qaybaha kamaradaha ayaa si isa soo taraysa loogu isticmaalaa aaladaha nagu wareegsan. Kordhinta baahida macaamiisha ee badbaadada ayaa keentay baahida horumarinta nidaamyada kaalmada darawalnimada horumarsan (ADAS) ee baabuurta. Taleefannada casriga ah waxay u guurayaan laba, saddex ama xitaa afar nidaam kamarado ah hal qalab si ay u bixiyaan sifooyinka isticmaalaha markii hore oo kaliya oo la heli karo iyada oo loo marayo qalabka sawir-qaadista ee sare. Fidinta aaladaha guriga ee caqliga leh ayaa sidoo kale nolosheena ku soo kordhiyay kamarado badan - albaabbada smart, nidaamyada amniga, xarumaha guriga iyo xitaa alaab-qeybiyeyaasha daweynta eyda ayaa hadda leh kamarado loogu talagalay baahinta tooska ah. Baahida loo qabo in la yareeyo qaybaha kamaradaha lana wanaajiyo isku halaynta, soosaarayaasha moduleka kamaradaha ayaa si isa soo taraya u dalbanaya agabka isku imaatinkooda. Chemence's portfolio ee UV iyo koollada dual-cure waxaa loogu talagalay in lagu daboolo baahiyaha soosaarayaasha ee codsiyada badankooda, oo ay ku jiraan xoojinta FPC, isku xidhka dareemayaasha sawirka, isku xidhka shaandhada IR, isku xidhka muraayadaha iyo korka muraayadda muraayadda, kulanka VCM iyo xitaa toosinta Firfircoon.
Toosin Firfircoon
Baahida loo qabo in la bixiyo awood muuqaal oo tayo sare leh waxay u baahan tahay meelaynta moduleka kamarad aad u sax ah oo la isku halayn karo iyo xallinta hagaajinta. Deepmaterial dual-cure xabagta oo loogu talagalay isku xidhka toosinta firfircoon. Xabaggeena UV iyo kuleyliyaha kuleyliyaha ayaa bixiya bixinta fudud, meel aad u degdeg badan iyo daawaynta kulaylka la isku halayn karo ee meelaha hadhsan. Alaab kasta oo toosan oo firfircooni waxay bixisaa ku dheggan heersare ah oo ku saabsan substrates muhiimka ah oo leh sifooyin gaas oo aad u hooseeya, hubinta isku halaynta qaybaha muddada-dheer.
Isku xidhka muraayadaha
Isku-xidhka muraayadaha iyo isku xidhka foostada muraayadaha waxay u baahan yihiin xabagyo leh sifooyin hawleed aad u khaas ah. Substrates-ka saxda ah ayaa tilmaamaya in habaynta heerkulka hooseeya ay muhiim u tahay si loo yareeyo qallooca substrate-ka. Intaa waxaa dheer, index thxotropic sare iyo soo saarid hoose ayaa muhiim ah si loo hubiyo in koollada aysan u guurin meelaha aan loo baahnayn oo ay wasakheeyaan qaybaha. Marka lagu daro bixinta dhejinta heer sare ah ee substrates sida LCP iyo PA iyo nuugista naxdinta leh ee la xoojiyey iyo iska caabbinta saamaynta, dhejisyada lens-ka Deepmaterial ayaa sidoo kale buuxiya shuruudahan waxqabadka.
Ruggedization FPC
Qaybaha kamaradaha waxaa badanaa lagu xiraa kulankooda ugu dambeeya iyadoo loo sii marayo wareeg daabacan oo dabacsan (FPC). Marka lagu daro iska caabbinta diirka oo aad u fiican, dabacsanaan, iyo iska caabin biyaha, Deepmaterial UV-la daawayn karo adhesives waxay siisay adhesion aad u fiican substrates FPC sida polyimide iyo polyesterka.
DeepMaterial waa alaab-qeybiyeyaasha koollada indhaha ee hooseeya iyo soo saaraha xabagta polymers epoxy adhesives koollada, koollada ugu fiican ee kamaradda amniga, soo-saarka koollada indhaha ee epoxy koollada dhejiska ah ee moduleka kamaradda vcm & taabashada dareenka taabashada, isku-dubbaridka moduleka kamaradaha iyo pcb shirka camera ee habka wax soo saarka kamarada
