Kiis gudaha Mareykanka ah: Xalka Chip Underfill Partner's Partner's American
Sida waddan tignoolajiyada sare leh, waxaa jira shirkado badan oo BGA, CSP ama Flip Chip ah oo ku yaal Mareykanka, sidaa darteed koollada aan buuxin ayaa baahi weyn loo qabaa.
Mid ka mid ah macaamiisheena ka socda shirkadaha teknolojiyadda sare ee Mareykanka, waxay u adeegsadaan xallinta DeepMaterial hoos-u-dhigiddooda chip-ka-buuxinta, waana shaqeyn fiican.
DeepMaterial waxay siisaa agab wax qabad sare leh oo loogu talagalay Sintering iyo Die Attach, Mount Surface, iyo codsiyada Wave Soldering. Ballaaran ee alaabooyinka waxaa ka mid ah Teknolojiyadda Silver Sinter, Xabagta Alxanka, Preforms Alxanka, Buuxinta iyo Edgebond, Alxannada Alxanka, Dareeraha Alxanka, Siliga Cored, Dusha sare ee Adhesives, Nadiifiyeyaasha Elektarooniga ah, iyo Stencils.
Taxanaha DeepMaterial Chip Underfill Xabaggu waa hal qayb, qalabka kulaylka lagu dawayn karo. Alaabta waxaa loo hagaajiyay buuxinta xididada iyo dib u shaqayntooda. Qalabkan epoxy-ka ku salaysan waxaa lagu kala bixin karaa cidhifyada BGA, CSP ama Flip Chip. Qalabkani wuxuu markaa ka dib qulquli doonaa si uu u buuxiyo booska ka hooseeya qaybahan.
Sida ay ka kooban tahay hal qayb oo ka kooban xididka hoostiisa oo loogu talagalay ilaalinta baakadaha jajabka ee la isku daray ee looxyada wareegga daabacan.
Waa heerkulka kala-guurka dhalada sare [Tg] iyo balaadhinta kulaylka oo hooseeya [CTE] hoostiisa. Tilmaamahani waxay keenaan xal isku haleyn kara oo sarreeya.
Features Product
Wuxuu bixiyaa dabool buuxa marka lagu shubo substrate preheated at 70 – 100°C
Qiimaha sare ee Tg iyo CTE ee hooseeya ayaa si weyn u wanaajiya awoodda lagu gudbinayo xaalad tijaabo ah oo kuleyl ah
Waxqabadka Tijaabada Baaskiilka Kulul ee heer sare ah
Halogen-free oo u hoggaansama Amarka RoHS 2015/863/EU
Hoos-u-buuxinta Caabbinimada Daalka Kulaylka Gaarka ah
Istaag keligaa isgoysyada alxanka SAC ee BGA iyo shirarka CSP waxay u janjeeraan inay lumiyaan codsiyada baabuurta kulul ee kulul. Tg sare iyo hoose ee CTE-buuxinta [UF] waa xal xoojin. Maaddaama dib-u-shaqayntu aanay ahayn shuruud, tani waxay u oggolaanaysaa wax-buuxiyaha sare ee qaabaynta si loo horumariyo sifaadkan.
Taxanaha DeepMaterial Chip Underfill Adhesive wuxuu leeyahay Tg sare oo ah 165°C iyo hoose CTE1/CTE2 ee 31 ppm/105 ppm, marka la isku soo ururiyey waxaana la tijaabiyey in uu dhaafo 5000 wareeg -40 +125°C tijaabada baaskiil wadida kulaylka. Si loo helo heerka socodka wanaagsan, horay u kululee substrates inta lagu jiro qaybinta.
Waxaan sidoo kale raadineynaa DeepMaterial alaabada xabagta warshadaha ee iskaashiga caalamiga ah, haddii aad rabto inaad noqoto wakiilka DeepMaterial's:
Iibiyaha xabaglaha warshadaha ee Ameerika,
Iibiyaha xabaglaha warshadaha ee Yurub,
Iibiyaha xabaglaha warshadaha ee UK,
Iibiyaha xabaglaha warshadaha ee Hindiya,
Iibiyaha xabaglaha warshadaha ee Australia,
Iibiyaha xabaglaha warshadaha ee Kanada,
Iibiyaha xabagta xabagta warshadaha ee Koonfur Afrika,
Iibiyaha xabaglaha warshadaha ee Japan,
Iibiyaha xabaglaha warshadaha ee Yurub,
Iibiyaha xabaglaha warshadaha ee Kuuriya,
Iibiyaha xabaglaha warshadaha ee Malaysia,
Iibiyaha xabaglaha warshadaha ee Filibiin,
Iibiyaha xabaglaha warshadaha ee Vietnam,
Iibiyaha xabaglaha warshadaha ee Indonesia,
Iibiyaha xabaglaha warshadaha ee Ruushka,
Iibiyaha xabaglaha warshadaha ee Turkiga,
......
Hada nala soo xiriir!
