Xirmada BGA Hoos-u-buuxinta Epoxy

Dheecaan sare

Daacadnimo Sare

Caqabadaha
Alaabooyinka elektiroonigga ah ee hawada iyo navigation, baabuurta, baabuurta, iftiinka LED dibadda, tamarta qoraxda iyo shirkadaha militariga oo leh shuruudaha la isku halleyn karo oo sare, alxanka kubadda array (BGA/CSP/WLP/POP) iyo qalabka gaarka ah ee looxyada wareegyada oo dhan ayaa wajahaya microelectronics. Isbeddelka yaraynta, iyo PCB-yada dhuuban ee leh dhumuc ka yar 1.0mm ama qalabyada isku-dhafka cufnaanta sare ee dabacsan, kala-goysyada alxanka ee u dhexeeya qalabka iyo substrates waxay noqdaan kuwo jilicsan marka la eego cadaadiska farsamada iyo kulaylka.

Solutions
Baakadaha BGA, DeepMaterial waxay ku siinaysaa xal hab-socodka hoos-u-dhaca - qulqulka qulqulka xididka hal-abuurka leh. Buuxiyaha waxaa loo qaybiyaa oo lagu dabaqaa cidhifka aaladda la soo ururiyey, iyo "saamaynta capillary" ee dareeraha waxaa loo isticmaalaa in lagu sameeyo koollada oo buuxisa gunta hoose ee chip, ka dibna la kululeeyo si loogu daro filler iyo substrate chip. kala goysyada alxanka iyo substrate PCB.

Faa'iidooyinka habka buuxinta DeepMaterial
1. Dheecaan sare, nadiif sare, hal qayb, buuxin degdeg ah iyo awoodda bogsashada degdega ah ee qaybaha aadka u fiican;
2. Waxay samayn kartaa lakabka hoose ee buuxinta labbiska iyo faaruqinta, kaas oo baabi'in kara walbahaarka uu keeno walxaha alxanka, hagaajinta isku halaynta iyo sifooyinka farsamada ee qaybaha, iyo bixinta ilaalinta wanaagsan ee alaabta ka soo dhacaya, maroojin, gariir, qoyaan. iwm.
3. Nidaamka waa la hagaajin karaa, guddiga wareegga dib ayaa loo isticmaali karaa, taas oo aad u badbaadisa kharashka.

Deepmaterial waa heerkulka hooseeya ee daaweynta bga flip chip underfill pcb epoxy habka koollada soo saaraha alaabta koollada iyo alaab-qeybiyeyaasha heerkulka u adkaysta, waxay keenaan hal qayb oo ka mid ah xeryahooda epoxy underfill, encapsulant epixy underfill encapsulant, alaabta daboolka hooseysa ee loogu talagalay chip flip ee guddiga wareegga elektiroonigga ah ee pcb, epoxy- Qalabka ku-saleysan chip underfill iyo cob encapsulation alaabta iyo wixii la mid ah.

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