Chip Underfill / Baakaynta
Habka Wax-soo-saarka Chip Codsiga Alaabada Dheecaanka ah ee Dheecaanka ah
Baakadaha Semiconductor
Tignoolajiyada Semiconductor, gaar ahaan baakadaha aaladaha semiconductor, waligeed ma taaban codsiyo ka badan inta ay maanta sameyso. Maaddaama dhinac kasta oo nolol maalmeedku uu noqdo mid dhijitaal ah oo sii kordheysa - laga bilaabo baabuurta ilaa amniga guriga ilaa talefannada casriga ah iyo kaabayaasha 5G - hal-abuurka baakadaha semiconductor ayaa udub dhexaad u ah awoodaha elektarooniga ah ee jawaab-celinta, la isku halayn karo, iyo xoogga leh.
Waferrada khafiifka ah, cabbirrada yaryar, garoonnada fiican, isku dhafka xirmada, naqshadeynta 3D, tignoolajiyada heerka wafer-ka iyo dhaqaalaha miisaanka ee wax-soo-saarka tirada badan waxay u baahan yihiin agab taageeri kara hamiga hal-abuurka. Habka guud ee xalalka Henkel waxa uu ka faa'iidaysanayaa kheyraadka caalamiga ah ee ballaaran si loo bixiyo tignoolajiyada agabka baakadaha semiconductor sare iyo waxqabadka qiimaha-tartan. Laga soo bilaabo dhinta ku dheji dhejisyada baakadaha dammaanadda siliga dhaqameed ilaa hoos-u-buuxinta horumarsan iyo koofiyadaha codsiyada baakadaha horumarsan, Henkel waxay siisaa tignoolajiyada qalabka casriga ah iyo taageerada caalamiga ah ee looga baahan yahay shirkadaha microelectronics ee hormuudka ka ah.
Ku rog Chip Underfill
Buuxinta hoose waxaa loo isticmaalaa xasilloonida makaanikada ee chip flip. Tani waxay si gaar ah muhiim u tahay marka ay alxanayaan chips grid array (BGA). Si loo yareeyo isku-dhafka balaadhinta kulaylka (CTE), koollada ayaa qayb ahaan ka buuxa nanofillers.
Xabagta loo isticmaalo sida jajabka hoostiisa ayaa leh sifooyin qulqulka xididada si dhakhso ah oo sahlan loo isticmaalo. Xabag laba-daaweyn ah ayaa badanaa la isticmaalaa: aagagga cidhifyada waxaa lagu hayaa meel lagu daaweyo UV ka hor inta aan meelaha hadhsan si kulul loo bogsiin.
Deepmaterial waa heerkulka hooseeya ee daaweynta bga flip chip underfill pcb epoxy habka koollada soo saaraha alaabta koollada iyo alaab-qeybiyeyaasha heerkulka u adkaysta, waxay keenaan hal qayb oo ka mid ah xeryahooda epoxy underfill, encapsulant epixy underfill encapsulant, alaabta daboolka hooseysa ee loogu talagalay chip flip ee guddiga wareegga elektiroonigga ah ee pcb, epoxy- Qalabka ku-saleysan chip underfill iyo cob encapsulation alaabta iyo wixii la mid ah.