bixiyaha xabagta ee wax soo saarka elektiroonigga ah.
Buuxinta Chip-ku-salaysan Epoxy iyo Qalabka Koobidda ee COB
DeepMaterial waxay bixisaa qulqulo cusub oo xididada hoose oo loogu talagalay chip flip, CSP iyo aaladaha BGA. DeepMaterial's cusub ee qulqulka xididada hoostooda ayaa ah dareere sare, nadiif sare, agab dheri ka kooban hal qayb oo samaysa labbis, lakabyo aan faaruq lahayn oo wanaajinaya isku halaynta iyo sifooyinka farsamada ee qaybaha iyada oo meesha laga saarayo walbahaarka ay keenaan alaabta alxanka. DeepMaterial waxay bixisaa habayn loogu talagalay buuxinta degdega ah ee qaybo aad u fiican, awood daaweyn degdeg ah, shaqo dheer iyo cimri dherer, iyo sidoo kale dib u shaqaynta. Dib-u-shaqayntu waxay badbaadisaa kharashaadka iyadoo u oggolaanaysa ka saarida buuxinta si dib loogu isticmaalo guddiga.
Isku-dubbaridka jajabku wuxuu u baahan yahay dhimista walaaca ee tolidda alxanka mar labaad gabownimada kulaylka dheer iyo nolosha wareegga. CSP ama kulanka BGA wuxuu u baahan yahay isticmaalka hoos-u-buuxinta si loo hagaajiyo daacadnimada makaanikada ee golaha inta lagu jiro rogrogmida, gariirka ama tijaabada dhibicda.
Buuxinta DeepMaterial's flip-chip-hoosaadka ayaa leh waxyaabo buuxinaya heer sare iyadoo lagu ilaalinayo qulqulka degdega ah ee meelaha yar yar, iyada oo awood u leh in ay yeelato heerkul sare oo dhalada ah iyo modules sare. Buuxintayada CSP-ga hoose waxaa lagu heli karaa heerar buuxin oo kala duwan, oo loo xushay heerkulka kala-guurka dhalada iyo moduleska codsiga loogu talagalay.
COB encapsulant waxaa loo isticmaali karaa isku xidhka siliga si loo bixiyo ilaalinta deegaanka loona kordhiyo xoogga farsamada. Xiritaanka difaaca ee chips-ku-xidhan ee siliga ku xidhan waxa ka mid ah xidhidaynta sare, sanduuqa kaydinta, iyo buuxinta faraqa. Xabagyada leh hab-socodka qulqulka hagaajinta ayaa loo baahan yahay, sababtoo ah awooddooda qulqulka waa inay hubisaa in fiilooyinka la duubo, oo koollada kama soo baxayso chip-ka, oo ay xaqiijiyaan in loo isticmaali karo haad aad u fiican.
Xabagta DeepMaterial ee COB waxay noqon kartaa kuleyl ahaan ama UV la daaweeyay DeepMaterial's COB koollada koollada waxaa lagu daaweeyaa kulaylka ama UV-lagu daaweeyay isku halaynta sare iyo bararka kulaylka hooseeya, iyo sidoo kale heerkulka beddelka dhalada sare iyo nuxurka ion hooseeya. DeepMaterial's COB koollada koofiyadu waxay ka ilaalisaa sunta rasaasta iyo plumbum, chrome iyo silikoon waferrada deegaanka dibadda, burburka farsamada iyo daxalka.
DeepMaterial COB koollada koodhadhka leh waxaa lagu sameeyay epoxy kulayl-daaweeya, akril UV-curing, ama kimistari silikoon ah oo dahaaran koronto oo wanaagsan. DeepMaterial COB koollada koodhadhka leh waxay bixiyaan xasillooni heerkul sare oo wanaagsan iyo caabbinta shoogga kulaylka, guryaha korantada ka ilaaliya kala duwanaanshiyaha heerkul ballaadhan, iyo yaraanta hoose, walbahaarka hoose, iyo caabbinta kiimikaad marka la daweeyo.
Deepmaterial waa xabagta ugu sareysa ee koollada qaab dhismeedka aan biyuhu lahayn ee caag ah ilaa birta iyo soo saaraha dhalada, soo saara koolada epoxy koollada aan lahayn ee koollada koollada ee pcb, koollada semiconductor ee golaha elektiroonigga ah, daawaynta heerkulka hooseeya bga flip chip underfill PCb epoxy geeddi-socodka koollada koollada iyo wixii la mid ah on
DeepMaterial Epoxy Resin Base Chip Bottom Buuxinta iyo Shaxda Xulashada Baakadaha Cob
Xulashada Alaabada Xabagta Xabagta ee Heerkulka Hoose
| Qalabka waxsoosaarka | magaca Product | Alaabta codsiga caadiga ah |
| Xabagta heerkulka hooseeya | DM-6108 |
Xabagta heerkulka hooseeya, codsiyada caadiga ah waxaa ka mid ah kaadhka xusuusta, CCD ama CMOS. Alaabtani waxay ku habboon tahay daaweynta heerkulka hooseeya waxayna yeelan kartaa ku dhejis wanaagsan oo qalab kala duwan ah muddo gaaban gudaheed. Codsiyada caadiga ah waxaa ka mid ah kaadhadhka xusuusta, qaybaha CCD/CMOS. Waxay si gaar ah ugu habboon tahay waqtiyada ay curiyaha kulaylka xasaasiga ah u baahan tahay in lagu daweeyo heerkul hooseeya. |
| DM-6109 |
Waa hal qaybood oo kuleyl ah oo daawaynaya resin epoxy. Alaabtani waxay ku habboon tahay daaweynta heerkulka hooseeya waxayna leedahay ku dhejis wanaagsan oo qalab kala duwan ah waqti aad u yar. Codsiyada caadiga ah waxaa ka mid ah kaadhka xusuusta, CCD/CMOS. Waxay si gaar ah ugu habboon tahay codsiyada halka heerkulka daawaynta hooseeya looga baahan yahay qaybaha kulaylka xasaasiga ah. |
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| DM-6120 |
Xabagta daweynta heerkulka-hoose ee Classic, oo loo isticmaalo kulanka moduleka iftiinka dambe ee LCD. |
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| DM-6180 |
Daawaynta degdega ah ee heerkulka hooseeya, loo isticmaalo isku xirka qaybaha CCD ama CMOS iyo matoorada VCM. Alaabtan waxaa si gaar ah loogu talagalay codsiyada xasaasiga ah ee kuleylka u baahan daaweyn heerkul hooseeya. Waxay si dhakhso ah u siin kartaa macaamiisha codsiyada wax soo saarka sare leh, sida ku dhejinta muraayadaha fidinta iftiinka iftiinka LED-yada, iyo isku-darka qalabka sawirka (oo ay ku jiraan qaybaha kamaradaha). Qalabkani waa caddaan si uu u bixiyo milicsi weyn. |
Xulashada Alaabada Epoxy Encapsulation
| Khadka wax soo saarka | Qalabka waxsoosaarka | Product Name | Colour | viscosity caadiga ah (cps) | Waqtiga hagaajinta bilowga ah / hagaajin buuxda | Habka daweynta | TG/°C | Adag/D | Bakhaar/°C/M |
| Epoxy ku salaysan | Xabagta koofiyadaha | DM-6216 | Black | 58000-62000 | 150 ° C 20min | Daawaynta kulaylka | 126 | 86 | 2-8/6M |
| DM-6261 | Black | 32500-50000 | 140°C 3H | Daawaynta kulaylka | 125 | * | 2-8/6M | ||
| DM-6258 | Black | 50000 | 120 ° C 12min | Daawaynta kulaylka | 140 | 90 | -40/6M | ||
| DM-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Daawaynta kulaylka | 137 | 90 | 2-8/6M |
Hoos-u-buuxinta Xulashada Alaabada Epoxy
| Qalabka waxsoosaarka | magaca Product | Alaabta codsiga caadiga ah |
| Buuxinta hoose | DM-6307 | Waa hal qaybood, xabagta epoxy-ga heerkulbeeye. Waa CSP (FBGA) ama buuxinta BGA ee dib loo isticmaali karo si looga ilaaliyo kala-goysyada alxanka culeyska farsamada ee aaladaha elektiroonigga ah ee gacanta lagu qaato. |
| DM-6303 | Xabagta xabagta epoxy-ka ka kooban ee hal qayb ka kooban waa xabagta buuxinta oo dib loogu isticmaali karo CSP (FBGA) ama BGA. Si dhakhso ah ayay u dawaysaa marka la kululeeyo. Waxaa loogu talagalay inay bixiso difaac wanaagsan si looga hortago fashilka sababtoo ah cadaadiska farsamada. Viscosity hoose wuxuu ogolaanayaa buuxinta daldaloolada hoos yimaada CSP ama BGA. | |
| DM-6309 | Waa daaweyn degdeg ah, dareeraha dareeraha ah ee epoxy resin-ka degdega ah ee loogu talagalay buuxinta qulqulka qulqulka xididada xirmooyinka cabbirka chip, waa in la hagaajiyo xawaaraha geeddi-socodka ee wax soo saarka iyo naqshadeynta naqshadeeda rheological, u oggolow inay gasho nadiifinta 25μm, yareyso walbahaarka, hagaajinta waxqabadka baaskiilka, oo leh iska caabin kiimiko heer sare ah. | |
| DM- 6308 | Buuxinta caadiga ah, viscosity ultra-hooseeya oo ku habboon inta badan codsiyada buuxinta. | |
| DM-6310 | Epoxy primer dib loo isticmaali karo waxaa loogu talagalay codsiyada CSP iyo BGA. Si dhakhso ah ayaa loo daweyn karaa heerkul dhexdhexaad ah si loo yareeyo cadaadiska qaybaha kale. Daawaynta ka dib, maaddadu waxay leedahay sifooyin farsamo oo aad u fiican waxayna ilaalin kartaa kala-goysyada alxanka inta lagu jiro baaskiil wadida kulaylka. | |
| DM-6320 | Buuxinta dib loo isticmaali karo waxaa si gaar ah loogu talagalay codsiyada CSP, WLCSP iyo BGA. Nadaafadeedu waa in si degdeg ah lagu daweeyo heerkul dhexdhexaad ah si loo yareeyo walbahaarka qaybaha kale. Maaddadu waxay leedahay heerkul sare oo kala-guurka dhalada ah iyo adkaanta jabka sare, waxayna siin kartaa difaac wanaagsan oo loogu talagalay kala-goysyada alxanka inta lagu jiro baaskiil wadida kulaylka. |
DeepMaterial Epoxy Ku Salaysan Chip Hoos-u-buuxinta iyo Baakadaha COB ee Xaashida Xogta Agabka
Xabashida Xogta Alaabada Xabagta Xabagta ah ee lagu daaweynayo Heerkulka Hoose
| Khadka wax soo saarka | Qalabka waxsoosaarka | Product Name | Colour | viscosity caadiga ah (cps) | Waqtiga hagaajinta bilowga ah / hagaajin buuxda | Habka daweynta | TG/°C | Adag/D | Bakhaar/°C/M |
| Epoxy ku salaysan | Heerkul hoose oo daawaynaya | DM-6108 | Black | 7000-27000 | 80°C 20min 60°C 60min | Daawaynta kulaylka | 45 | 88 | -20/6M |
| DM-6109 | Black | 12000-46000 | 80°C 5-10min | Daawaynta kulaylka | 35 | 88A | -20/6M | ||
| DM-6120 | Black | 2500 | 80°C 5-10min | Daawaynta kulaylka | 26 | 79 | -20/6M | ||
| DM-6180 | White | 8700 | 80 ° C 2min | Daawaynta kulaylka | 54 | 80 | -40/6M |
Xaashiyaha Xogta Alaabada Xabagta Epoxy ee la duubay
| Khadka wax soo saarka | Qalabka waxsoosaarka | Product Name | Colour | viscosity caadiga ah (cps) | Waqtiga hagaajinta bilowga ah / hagaajin buuxda | Habka daweynta | TG/°C | Adag/D | Bakhaar/°C/M |
| Epoxy ku salaysan | Xabagta koofiyadaha | DM-6216 | Black | 58000-62000 | 150 ° C 20min | Daawaynta kulaylka | 126 | 86 | 2-8/6M |
| DM-6261 | Black | 32500-50000 | 140°C 3H | Daawaynta kulaylka | 125 | * | 2-8/6M | ||
| DM-6258 | Black | 50000 | 120 ° C 12min | Daawaynta kulaylka | 140 | 90 | -40/6M | ||
| DM-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Daawaynta kulaylka | 137 | 90 | 2-8/6M |
Hoos-u-buuxi xaashida Xogta Alaabta Xabagta Epoxy
| Khadka wax soo saarka | Qalabka waxsoosaarka | Product Name | Colour | viscosity caadiga ah (cps) | Waqtiga hagaajinta bilowga ah / hagaajin buuxda | Habka daweynta | TG/°C | Adag/D | Bakhaar/°C/M |
| Epoxy ku salaysan | Buuxinta hoose | DM-6307 | Black | 2000-4500 | 120°C 5min 100°C 10min | Daawaynta kulaylka | 85 | 88 | 2-8/6M |
| DM-6303 | Dareeraha jaalaha ah ee kareemka ah | 3000-6000 | 100°C 30min 120°C 15min 150°C 10min | Daawaynta kulaylka | 69 | 86 | 2-8/6M | ||
| DM-6309 | dareere madow | 3500-7000 | 165°C 3min 150°C 5min | Daawaynta kulaylka | 110 | 88 | 2-8/6M | ||
| DM-6308 | dareere madow | 360 | 130°C 8min 150°C 5min | Daawaynta kulaylka | 113 | * | -20/6M | ||
| DM-6310 | dareere madow | 394 | 130 ° C 8min | Daawaynta kulaylka | 102 | * | -20/6M | ||
| DM-6320 | dareere madow | 340 | 130°C 10min 150°C 5min 160°C 3min | Daawaynta kulaylka | 134 | * | -20/6M |
