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  5. Buuxinta Chip-ku-salaysan Epoxy iyo Qalabka Koobidda ee COB

Buuxinta Chip-ku-salaysan Epoxy iyo Qalabka Koobidda ee COB

DeepMaterial waxay bixisaa qulqulo cusub oo xididada hoose oo loogu talagalay chip flip, CSP iyo aaladaha BGA. DeepMaterial's cusub ee qulqulka xididada hoostooda ayaa ah dareere sare, nadiif sare, agab dheri ka kooban hal qayb oo samaysa labbis, lakabyo aan faaruq lahayn oo wanaajinaya isku halaynta iyo sifooyinka farsamada ee qaybaha iyada oo meesha laga saarayo walbahaarka ay keenaan alaabta alxanka. DeepMaterial waxay bixisaa habayn loogu talagalay buuxinta degdega ah ee qaybo aad u fiican, awood daaweyn degdeg ah, shaqo dheer iyo cimri dherer, iyo sidoo kale dib u shaqaynta. Dib-u-shaqayntu waxay badbaadisaa kharashaadka iyadoo u oggolaanaysa ka saarida buuxinta si dib loogu isticmaalo guddiga.

Isku-dubbaridka jajabku wuxuu u baahan yahay dhimista walaaca ee tolidda alxanka mar labaad gabownimada kulaylka dheer iyo nolosha wareegga. CSP ama kulanka BGA wuxuu u baahan yahay isticmaalka hoos-u-buuxinta si loo hagaajiyo daacadnimada makaanikada ee golaha inta lagu jiro rogrogmida, gariirka ama tijaabada dhibicda.

Buuxinta DeepMaterial's flip-chip-hoosaadka ayaa leh waxyaabo buuxinaya heer sare iyadoo lagu ilaalinayo qulqulka degdega ah ee meelaha yar yar, iyada oo awood u leh in ay yeelato heerkul sare oo dhalada ah iyo modules sare. Buuxintayada CSP-ga hoose waxaa lagu heli karaa heerar buuxin oo kala duwan, oo loo xushay heerkulka kala-guurka dhalada iyo moduleska codsiga loogu talagalay.

COB encapsulant waxaa loo isticmaali karaa isku xidhka siliga si loo bixiyo ilaalinta deegaanka loona kordhiyo xoogga farsamada. Xiritaanka difaaca ee chips-ku-xidhan ee siliga ku xidhan waxa ka mid ah xidhidaynta sare, sanduuqa kaydinta, iyo buuxinta faraqa. Xabagyada leh hab-socodka qulqulka hagaajinta ayaa loo baahan yahay, sababtoo ah awooddooda qulqulka waa inay hubisaa in fiilooyinka la duubo, oo koollada kama soo baxayso chip-ka, oo ay xaqiijiyaan in loo isticmaali karo haad aad u fiican.

Xabagta DeepMaterial ee COB waxay noqon kartaa kuleyl ahaan ama UV la daaweeyay DeepMaterial's COB koollada koollada waxaa lagu daaweeyaa kulaylka ama UV-lagu daaweeyay isku halaynta sare iyo bararka kulaylka hooseeya, iyo sidoo kale heerkulka beddelka dhalada sare iyo nuxurka ion hooseeya. DeepMaterial's COB koollada koofiyadu waxay ka ilaalisaa sunta rasaasta iyo plumbum, chrome iyo silikoon waferrada deegaanka dibadda, burburka farsamada iyo daxalka.

DeepMaterial COB koollada koodhadhka leh waxaa lagu sameeyay epoxy kulayl-daaweeya, akril UV-curing, ama kimistari silikoon ah oo dahaaran koronto oo wanaagsan. DeepMaterial COB koollada koodhadhka leh waxay bixiyaan xasillooni heerkul sare oo wanaagsan iyo caabbinta shoogga kulaylka, guryaha korantada ka ilaaliya kala duwanaanshiyaha heerkul ballaadhan, iyo yaraanta hoose, walbahaarka hoose, iyo caabbinta kiimikaad marka la daweeyo.

Deepmaterial waa xabagta ugu sareysa ee koollada qaab dhismeedka aan biyuhu lahayn ee caag ah ilaa birta iyo soo saaraha dhalada, soo saara koolada epoxy koollada aan lahayn ee koollada koollada ee pcb, koollada semiconductor ee golaha elektiroonigga ah, daawaynta heerkulka hooseeya bga flip chip underfill PCb epoxy geeddi-socodka koollada koollada iyo wixii la mid ah on

DeepMaterial Epoxy Resin Base Chip Bottom Buuxinta iyo Shaxda Xulashada Baakadaha Cob
Xulashada Alaabada Xabagta Xabagta ee Heerkulka Hoose

Taxanaha Alaabta magaca Product Alaabta codsiga caadiga ah
Xabagta heerkulka hooseeya DM-6108

Xabagta heerkulka hooseeya, codsiyada caadiga ah waxaa ka mid ah kaadhka xusuusta, CCD ama CMOS. Alaabtani waxay ku habboon tahay daaweynta heerkulka hooseeya waxayna yeelan kartaa ku dhejis wanaagsan oo qalab kala duwan ah muddo gaaban gudaheed. Codsiyada caadiga ah waxaa ka mid ah kaadhadhka xusuusta, qaybaha CCD/CMOS. Waxay si gaar ah ugu habboon tahay waqtiyada ay curiyaha kulaylka xasaasiga ah u baahan tahay in lagu daweeyo heerkul hooseeya.
DM-6109

Waa hal qaybood oo kuleyl ah oo daawaynaya resin epoxy. Alaabtani waxay ku habboon tahay daaweynta heerkulka hooseeya waxayna leedahay ku dhejis wanaagsan oo qalab kala duwan ah waqti aad u yar. Codsiyada caadiga ah waxaa ka mid ah kaadhka xusuusta, CCD/CMOS. Waxay si gaar ah ugu habboon tahay codsiyada halka heerkulka daawaynta hooseeya looga baahan yahay qaybaha kulaylka xasaasiga ah.
DM-6120

Xabagta daweynta heerkulka-hoose ee Classic, oo loo isticmaalo kulanka moduleka iftiinka dambe ee LCD.
DM-6180

Daawaynta degdega ah ee heerkulka hooseeya, loo isticmaalo isku xirka qaybaha CCD ama CMOS iyo matoorada VCM. Alaabtan waxaa si gaar ah loogu talagalay codsiyada xasaasiga ah ee kuleylka u baahan daaweyn heerkul hooseeya. Waxay si dhakhso ah u siin kartaa macaamiisha codsiyada wax soo saarka sare leh, sida ku dhejinta muraayadaha fidinta iftiinka iftiinka LED-yada, iyo isku-darka qalabka sawirka (oo ay ku jiraan qaybaha kamaradaha). Qalabkani waa caddaan si uu u bixiyo milicsi weyn.

Xulashada Alaabada Epoxy Encapsulation

Khadka wax soo saarka Taxanaha Alaabta Product Name Colour viscosity caadiga ah (cps) Waqtiga hagaajinta bilowga ah / hagaajin buuxda Habka daweynta TG/°C Adag/D Bakhaar/°C/M
Epoxy ku salaysan Xabagta koofiyadaha DM-6216 Black 58000-62000 150 ° C 20min Daawaynta kulaylka 126 86 2-8/6M
DM-6261 Black 32500-50000 140°C 3H Daawaynta kulaylka 125 * 2-8/6M
DM-6258 Black 50000 120 ° C 12min Daawaynta kulaylka 140 90 -40/6M
DM-6286 Black 62500 120°C 30min1 150°C 15min Daawaynta kulaylka 137 90 2-8/6M

Hoos-u-buuxinta Xulashada Alaabada Epoxy

Taxanaha Alaabta magaca Product Alaabta codsiga caadiga ah
Buuxinta hoose DM-6307 Waa hal qaybood, xabagta epoxy-ga heerkulbeeye. Waa CSP (FBGA) ama buuxinta BGA ee dib loo isticmaali karo si looga ilaaliyo kala-goysyada alxanka culeyska farsamada ee aaladaha elektiroonigga ah ee gacanta lagu qaato.
DM-6303 Xabagta xabagta epoxy-ka ka kooban ee hal qayb ka kooban waa xabagta buuxinta oo dib loogu isticmaali karo CSP (FBGA) ama BGA. Si dhakhso ah ayay u dawaysaa marka la kululeeyo. Waxaa loogu talagalay inay bixiso difaac wanaagsan si looga hortago fashilka sababtoo ah cadaadiska farsamada. Viscosity hoose wuxuu ogolaanayaa buuxinta daldaloolada hoos yimaada CSP ama BGA.
DM-6309 Waa daaweyn degdeg ah, dareeraha dareeraha ah ee epoxy resin-ka degdega ah ee loogu talagalay buuxinta qulqulka qulqulka xididada xirmooyinka cabbirka chip, waa in la hagaajiyo xawaaraha geeddi-socodka ee wax soo saarka iyo naqshadeynta naqshadeeda rheological, u oggolow inay gasho nadiifinta 25μm, yareyso walbahaarka, hagaajinta waxqabadka baaskiilka, oo leh iska caabin kiimiko heer sare ah.
DM- 6308 Buuxinta caadiga ah, viscosity ultra-hooseeya oo ku habboon inta badan codsiyada buuxinta.
DM-6310 Epoxy primer dib loo isticmaali karo waxaa loogu talagalay codsiyada CSP iyo BGA. Si dhakhso ah ayaa loo daweyn karaa heerkul dhexdhexaad ah si loo yareeyo cadaadiska qaybaha kale. Daawaynta ka dib, maaddadu waxay leedahay sifooyin farsamo oo aad u fiican waxayna ilaalin kartaa kala-goysyada alxanka inta lagu jiro baaskiil wadida kulaylka.
DM-6320 Buuxinta dib loo isticmaali karo waxaa si gaar ah loogu talagalay codsiyada CSP, WLCSP iyo BGA. Nadaafadeedu waa in si degdeg ah lagu daweeyo heerkul dhexdhexaad ah si loo yareeyo walbahaarka qaybaha kale. Maaddadu waxay leedahay heerkul sare oo kala-guurka dhalada ah iyo adkaanta jabka sare, waxayna siin kartaa difaac wanaagsan oo loogu talagalay kala-goysyada alxanka inta lagu jiro baaskiil wadida kulaylka.

DeepMaterial Epoxy Ku Salaysan Chip Hoos-u-buuxinta iyo Baakadaha COB ee Xaashida Xogta Agabka
Xabashida Xogta Alaabada Xabagta Xabagta ah ee lagu daaweynayo Heerkulka Hoose

Khadka wax soo saarka Taxanaha Alaabta Product Name Colour viscosity caadiga ah (cps) Waqtiga hagaajinta bilowga ah / hagaajin buuxda Habka daweynta TG/°C Adag/D Bakhaar/°C/M
Epoxy ku salaysan Heerkul hoose oo daawaynaya DM-6108 Black 7000-27000 80°C 20min 60°C 60min Daawaynta kulaylka 45 88 -20/6M
DM-6109 Black 12000-46000 80°C 5-10min Daawaynta kulaylka 35 88A -20/6M
DM-6120 Black 2500 80°C 5-10min Daawaynta kulaylka 26 79 -20/6M
DM-6180 White 8700 80 ° C 2min Daawaynta kulaylka 54 80 -40/6M

Xaashiyaha Xogta Alaabada Xabagta Epoxy ee la duubay

Khadka wax soo saarka Taxanaha Alaabta Product Name Colour viscosity caadiga ah (cps) Waqtiga hagaajinta bilowga ah / hagaajin buuxda Habka daweynta TG/°C Adag/D Bakhaar/°C/M
Epoxy ku salaysan Xabagta koofiyadaha DM-6216 Black 58000-62000 150 ° C 20min Daawaynta kulaylka 126 86 2-8/6M
DM-6261 Black 32500-50000 140°C 3H Daawaynta kulaylka 125 * 2-8/6M
DM-6258 Black 50000 120 ° C 12min Daawaynta kulaylka 140 90 -40/6M
DM-6286 Black 62500 120°C 30min1 150°C 15min Daawaynta kulaylka 137 90 2-8/6M

Hoos-u-buuxi xaashida Xogta Alaabta Xabagta Epoxy

Khadka wax soo saarka Taxanaha Alaabta Product Name Colour viscosity caadiga ah (cps) Waqtiga hagaajinta bilowga ah / hagaajin buuxda Habka daweynta TG/°C Adag/D Bakhaar/°C/M
Epoxy ku salaysan Buuxinta hoose DM-6307 Black 2000-4500 120°C 5min 100°C 10min Daawaynta kulaylka 85 88 2-8/6M
DM-6303 Dareeraha jaalaha ah ee kareemka ah 3000-6000 100°C 30min 120°C 15min 150°C 10min Daawaynta kulaylka 69 86 2-8/6M
DM-6309 dareere madow 3500-7000 165°C 3min 150°C 5min Daawaynta kulaylka 110 88 2-8/6M
DM-6308 dareere madow 360 130°C 8min 150°C 5min Daawaynta kulaylka 113 * -20/6M
DM-6310 dareere madow 394 130 ° C 8min Daawaynta kulaylka 102 * -20/6M
DM-6320 dareere madow 340 130°C 10min 150°C 5min 160°C 3min Daawaynta kulaylka 134 * -20/6M