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Yakanakisa underfill epoxy adhesive mugadziri uye mutengesi

Shenzhen DeepMaterial Technologies Co., Ltd is flip chip bga underfill epoxy material uye epoxy encapsulant inogadzira muchina, inogadzira underfill encapsulants,smt pcb underfill epoxy,chimwe chikamu epoxy underfill compounds,flip chip underfill epoxy uye so on csp uye bga.

Underfill ndeye epoxy zvinhu inozadza mapundu pakati pe chip nemutakuri wayo kana pasuru yapera uye PCB substrate. Underfill inodzivirira zvigadzirwa zvemagetsi kubva mukuvhunduka, kudonha, uye kuzununguka uye inoderedza kuomarara pane isina kusimba solder yekubatanidza inokonzerwa nemusiyano wekuwedzera kwekupisa pakati pesilicon chip uye mutakuri (zvinhu zviviri zvakasiyana).

Mune capillary underfill application, iyo chaiyo vhoriyamu ye underfill zvinhu inopihwa padivi pe chip kana pasuru kuyerera nepasi kuburikidza necapillary chiito, ichizadza mhepo migero yakatenderedza mabhora ekutengesa anobatanidza chip mapakeji kuPCB kana akaturikidzana machipisi mune akawanda-chip mapakeji. Kwete-kuyerera underfill zvinhu, dzimwe nguva zvinoshandiswa pakuzadza pasi, zvinoiswa pane substrate chip kana pasuru isati yabatanidzwa uye kuyerera. Molded underfill ndiyo imwe nzira inosanganisira kushandisa resin kuzadza mapundu pakati pe chip ne substrate.

Pasina underfill, hupenyu hwehupenyu hwechigadzirwa hwaizodzikiswa zvakanyanya nekuda kwekutsemuka kwezvibatanidza. Underfill inoshandiswa pamatanho anotevera ekugadzirwa kwekugadzira kuvandudza kuvimbika.

Complete Guide Of Underfill Epoxy:

Chii chinonzi Epoxy Underfill?

Underfill imhando ye epoxy zvinhu iyo inoshandiswa kuzadza mapundu pakati pe semiconductor chip nemutakuri wayo kana pakati pepasuru yakapedzwa uye yakadhindwa yedunhu bhodhi (PCB) substrate mumidziyo yemagetsi. Inowanzo shandiswa mumhando yepamusoro semiconductor yekurongedza matekinoroji, senge flip-chip uye chip-scale mapakeji, kuwedzera kuvimbika kwemuchina uye kupisa kwemidziyo.

Epoxy underfill inowanzo gadzirwa ne epoxy resin, thermosetting polymer ine yakanakisa mechaniki uye kemikari zvivakwa, zvichiita kuti ive yakakodzera kushandiswa mukuda kwemagetsi maapplication. Iyo epoxy resin inowanzo sanganiswa nezvimwe zvinowedzerwa, senge zvinoomesa, mafirita, uye modhifita, kuti iwedzere kuita kwayo uye kugadzirisa zvivakwa zvayo kuti isangane nezvinodiwa.

Epoxy underfill imvura kana semi-mvura zvinhu zvinopihwa pane substrate isati yafa semiconductor yaiswa pamusoro. Iyo inobva yaporeswa kana kusimbiswa, kazhinji kuburikidza nekupisa kwekushisa, kuumba ganda rakaoma, rinodzivirira rinoputira semiconductor kufa uye rinozadza mukaha pakati pekufa uye substrate.

Epoxy underfill chinhu chakasarudzika chekunamira chinoshandiswa mukugadzira zvemagetsi kuvhara nekuchengetedza zvinhu zvakatetepa, senge microchips, nekuzadza mukaha uripo pakati pechinhu uye substrate, kazhinji yakadhindwa redunhu bhodhi (PCB). Iyo inowanzoshandiswa muflip-chip tekinoroji, uko iyo chip inoiswa yakatarisana-pasi pane substrate kuti ivandudze kupisa uye magetsi kuita.

Chinangwa chekutanga che epoxy underfills ndechekupa simbi yekusimbisa kune iyo flip-chip package, ichivandudza kuramba kwayo kumichina inoshushikana senge thermal cycling, mechanical shocks, uye vibrations. Inobatsirawo kuderedza dambudziko rekukundikana kwejoint solder nekuda kwekuneta uye kusawirirana kwekuwedzera kwekushisa, izvo zvinogona kuitika panguva yekushanda kwechigadzirwa chemagetsi.

Epoxy underfill zvinhu zvinowanzogadzirwa ne epoxy resins, kurapa maajenti, uye mafirita kuti awane chinodiwa chemuchina, chinopisa, uye magetsi. Izvo zvakagadzirirwa kuve nekunamatira kwakanaka kune semiconductor kufa uye substrate, yakaderera coefficient yekupisa kwekuwedzera (CTE) kuderedza kushushikana kwekupisa, uye yakakwirira yekupisa conductivity kufambisa kupisa kubva pachigadzirwa.

Chii chinonzi Underfill Epoxy Inoshandiswa?

Underfill epoxy ndeye epoxy resin adhesive inoshandiswa mune dzakasiyana siyana maapplication kupa mechanic kusimbiswa uye kudzivirira. Heano mamwe akajairika kushandiswa kwe underfill epoxy:

Semiconductor Packaging: Underfill epoxy inowanzoshandiswa mu semiconductor packaging kupa tsigiro yemuchina uye kudzivirira kune dzakapfava zvemagetsi zvikamu, senge microchips, yakaiswa pamabhodhi edunhu akadhindwa (PCBs). Iyo inozadza mukaha pakati pe chip nePCB, kudzivirira kushushikana uye kukuvadzwa kwemagetsi kunokonzerwa nekuwedzera kwekupisa uye kuputika panguva yekushanda.

Flip-Chip Bonding: Underfill epoxy inoshandiswa muflip-chip bonding, iyo inobatanidza semiconductor machipisi zvakananga kuPCB isina waya mabhondi. Iyo epoxy inozadza mukaha pakati pe chip nePCB, ichipa kusimbaradza kwemakanika uye magetsi ekudzivirira uku uchivandudza mashandiro ekupisa.

Display Manufacturing: Underfill epoxy inoshandiswa kugadzira zviratidziro, senge liquid crystal displays (LCDs) uye organic light-emitting diode (OLED) inoratidza. Inoshandiswa kubatanidza uye kusimbisa zvinhu zvakapfava, senge madhiraivha ekuratidzira uye ma sensors ekubata, kuve nechokwadi chekugadzikana kwemechani uye kusimba.

Optoelectronic Devices: Underfill epoxy inoshandiswa mune optoelectronic madivayiri, senge optical transceivers, lasers, uye photodiodes, kupa tsigiro yemuchina, kuvandudza mashandiro ekupisa, uye kudzivirira zvinhu zvinonzwisisika kubva kune zvakatipoteredza.

Zvemagetsi zvemotokari: Underfill epoxy inoshandiswa mumagetsi emotokari, akadai semagetsi ekudzora mayunitsi (ECUs) uye masensa, kupa kusimbaradza kwemakanika uye kudzivirira kubva kune tembiricha yakanyanyisa, vibrations, uye hutsinye hwemamiriro ekunze.

Aerospace uye Defense Application: Underfill epoxy inoshandiswa mune aerospace uye kudzivirira zvikumbiro, senge avionics, radar masisitimu, uye zvemagetsi zvechiuto, kupa kugadzikana kwemuchina, kudzivirira kubva mukushanduka kwekushisa, uye kuramba kuvhunduka uye kuzununguka.

Consumer Electronics: Underfill epoxy inoshandiswa mumhando dzakasiyana dzemagetsi evatengi, kusanganisira mafoni, mahwendefa, uye mitambo yemitambo, kupa kusimbaradza kwemakanika uye kuchengetedza zvinhu zvemagetsi kubva mukukuvadzwa nekuda kwekupisa bhasikoro, kukanganisa, uye kumwe kushushikana.

Midziyo yekurapa: Underfill epoxy inoshandiswa mumidziyo yekurapa, senge midziyo inoisirwa, midziyo yekuongorora, uye yekutarisisa michina, kupa kusimbaradza kwemakanika uye kuchengetedza dzakatetepa zvinhu zvemagetsi kubva kune dzakaomarara nharaunda.

LED Packaging: Underfill epoxy inoshandiswa mukurongedza malight-emitting diode (LEDs) kupa tsigiro yemuchina, kutonga kwekupisa, uye kudzivirira kubva mukunyoro uye zvimwe zvakatipoteredza.

General Electronics: Underfill epoxy inoshandiswa mumhando dzakasiyana siyana dzemagetsi zvikumbiro panodiwa kusimbaradzwa kwemagetsi uye kudzivirira kwezvinhu zvemagetsi, senge mumagetsi emagetsi, maindasitiri otomatiki, uye nharembozha.

Chii chinonzi Underfill Material yeBga?

Underfill zvinhu zveBGA (Ball Grid Array) ndeye epoxy kana polymer-based material inoshandiswa kuzadza gap pakati peBGA package nePCB (Printed Circuit Board) mushure mekutengesa. BGA imhando yepamusoro peseji yekumisikidza inoshandiswa mumidziyo yemagetsi inopa huwandu hwakanyanya hwekubatana pakati peiyo yakabatanidzwa dunhu (IC) nePCB. Underfill zvinhu zvinowedzera kuvimbika kweBGA solder joints uye simba remuchina, kudzikamisa njodzi yekutadza nekuda kwekunetsekana kwemichina, kupisa bhasikoro, uye zvimwe zvakatipoteredza.

Underfill zvinhu zvinowanzo mvura uye zvinoyerera pasi peBGA package kuburikidza necapillary action. Inobva yaita chirongwa chekurapa kusimbisa uye kugadzira hukama hwakaomarara pakati peBGA nePCB, kazhinji kuburikidza nekupisa kana kuratidzwa kweUV. Iyo underfill material inobatsira kugovera kushushikana kwemagetsi kunogona kuitika panguva yekupisa bhasikoro, kuderedza njodzi yekutsemura majoini nekuvandudza kuvimbika kwese kweiyo BGA package.

Underfill zvinhu zveBGA zvinonyatsosarudzwa zvichibva pazvinhu zvakaita seye BGA package dhizaini, zvinhu zvinoshandiswa muPCB neBGA, nharaunda yekushanda, uye chinangwa chekushandisa. Zvimwe zvakajairika zvekuzadza pasi zveBGA zvinosanganisira epoxy-based, hapana-kuyerera, uye underfills ane akasiyana mafiza zvinhu senge silica, alumina, kana conductive particles. Kusarudzwa kweiyo yakakodzera underfill zvinhu kwakakosha kuve nechokwadi chekuvimbika kwenguva refu uye kuita kweBGA mapakeji mumidziyo yemagetsi.

Uyezve, underfill zvinhu nokuda BGA anogona kupa dziviriro kubva mwando, huruva, uye zvimwe zvinosvibisa kuti neimwe nzira kupinda pakakoromoka pakati BGA uye PCB, zvingangokonzera ngura kana pfupi matunhu. Izvi zvinogona kubatsira kuwedzera BGA mapakeji 'kusimba uye kuvimbika munzvimbo dzakaoma.

Chii chinonzi Underfill Epoxy MuIc?

Underfill epoxy muIC (Integrated Circuit) chinhu chinonamira chinozadza mukaha uripo pakati pe semiconductor chip uye substrate (yakadai sebhodhi rakadhindwa redunhu) mumidziyo yemagetsi. Inowanzoshandiswa mukugadzira maitiro eI ICs kuwedzera simba ravo remagetsi uye kuvimbika.

ICs anowanzo kugadzirwa semiconductor chip iyo ine akasiyana emagetsi zvikamu, senge transistors, resistors, uye capacitor, ayo akabatana kune ekunze magetsi anobatika. Aya machipisi anobva aiswa pane substrate, iyo inopa rutsigiro uye yekubatanidza magetsi kune yese yemagetsi system. Zvisinei, nekuda kwekusiyana kwekoefficients yekuwedzera kwekushisa (CTEs) pakati pe chip uye substrate uye kushushikana uye matambudziko anowanikwa panguva yekushanda, mechanical stress, uye nyaya dzekuvimbika dzinogona kubuda, dzakadai semhepo inopisa-induced kukundikana kana kuputika kwemagetsi.

Underfill epoxy inogadzirisa nyaya idzi nekuzadza mukaha pakati pechip uye substrate, kugadzira chisungo chakasimba. Iyo imhando ye epoxy resin yakaumbwa ine chaiyo zvimiro, senge yakaderera viscosity, yakakwirira adhesion simba, uye yakanaka yekupisa uye michina zvinhu. Munguva yekugadzira, iyo underfill epoxy inoshandiswa mune yemvura fomu, uye ipapo inorapwa kuti isimbise uye igadzire chisungo chakasimba pakati pechip uye substrate. ICs zvigadziriso zvemagetsi zvinonzwisa tsitsi, kumhanyisa tembiricha, uye zvimwe zvinhu zvakatipoteredza panguva yekushanda, izvo zvinogona kukonzera kukundikana nekuda kwekutengesa kuneta kwakabatana kana delamination pakati pechip uye substrate.

Iyo underfill epoxy inobatsira kugovera zvakare uye kuderedza kushushikana kwemakanika uye madhiri panguva yekushanda uye inopa dziviriro kubva kune hunyoro, zvinosvibisa, uye kuvhunduka kwemakanika. Inobatsirawo kuvandudza kuvimbika kwekutenderera kweIC nekudzikisa njodzi yekutsemuka kana delamination pakati pechip uye substrate nekuda kwekushanduka kwekushisa.

Chii chinonzi Underfill Epoxy MuSmt?

Underfill epoxy muSurface Mount Technology (SMT) inoreva rudzi rwezvinonamira zvinoshandiswa kuzadza gaka pakati pe semiconductor chip uye substrate mumidziyo yemagetsi senge akadhindwa edunhu mabhodhi (PCBs). SMT inzira yakakurumbira yekuunganidza zvinhu zvemagetsi paPCBs, uye underfill epoxy inowanzoshandiswa kuvandudza simba remagetsi uye kuvimbika kwemajoini ekutengesa pakati pechip nePCB.

Kana zvigadzirwa zvemagetsi zvichiiswa pasi pekupisa bhasikoro uye kushushikana kwemagetsi, senge panguva yekushanda kana kutakura, mutsauko weiyo coefficient yekupisa kwekuwedzera (CTE) pakati pe chip nePCB inogona kukonzera kunetsa pamajoini ekutengesa, zvichiita kuti kukundikana kungangoita sekutsemuka. kana delamination. Underfill epoxy inoshandiswa kurerutsa nyaya idzi nekuzadza mukaha uripo pakati pe chip ne substrate, kupa tsigiro yemuchina, uye kudzivirira majoini anotengeswa kuti asasangana nekushushikana kwakanyanya.

Underfill epoxy inowanzova thermosetting zvinhu zvinopihwa muchimiro chemvura paPCB, uye inoyerera ichipinda pakati peiyo chip uye substrate kuburikidza necapillary chiito. Inobva yaporeswa kuti igadzire chinhu chakasimba uye chakasimba chinosunga chip kune substrate, ichivandudza iyo yese mechanical kutendeseka kwemajoini ekutengesa.

Underfill epoxy inoshanda akati wandei akakosha mabasa mumaSMT magungano. Inobatsira kuderedza kuumbwa kwe solder joint cracks kana fractures nekuda kwekupisa bhasikoro uye mechanical stress panguva yekushanda kwemagetsi. Inowedzerawo kupisa kwekushisa kubva kuIC kusvika kune substrate, iyo inobatsira kuvandudza kuvimbika uye kushanda kwegungano remagetsi.

Underfill epoxy mumagungano eSMT inoda nzira dzekugovera dzakakwana kuti ive nechokwadi chekuvhara kwakakodzera uye kugovera kwakafanana kweiyo epoxy pasina kukonzera chero kukuvara kuIC kana substrate. Midziyo yepamberi senge marobhoti ekurapa uye mahovhoni ekurapa anowanzo shandiswa mukuita underfill kuti uwane mhedzisiro inowirirana uye yemhando yepamusoro mabhondi.

Ndezvipi Zvimiro zveUnderfill Material?

Underfill zvinhu zvinowanzo shandiswa mukugadzira zvigadzirwa zvemagetsi, kunyanya, semiconductor packaging, kuwedzera kuvimbika uye kusimba kwemidziyo yemagetsi senge integrated circuits (ICs), bhora regridhi arrays (BGAs), uye flip-chip mapakeji. Izvo zvimiro zve underfill zvinhu zvinogona kusiyana zvichienderana nemhando chaiyo uye magadzirirwo asi kazhinji anosanganisira zvinotevera:

Thermal conductivity: Underfill zvinhu zvinofanirwa kunge zvine yakanaka thermal conductivity yekubvisa kupisa kunogadzirwa nemagetsi mudziyo panguva yekushanda. Izvi zvinobatsira kudzivirira overheating, izvo zvinogona kutungamirira kuronga kukundikana.

CTE (Coefficient of Thermal Expansion) kuenderana: Zvigadzirwa zvepasi pasi zvinofanira kuva neCTE inoenderana neCTE yemagetsi emagetsi uye substrate inosungirirwa. Izvi zvinobatsira kudzikisira kushushikana kwekupisa panguva yekutenderera bhasikoro uye kudzivirira delamination kana kuputika.

Low viscosity: Underfill zvinhu zvinofanirwa kunge zviine density yakaderera kuti zvikwanise kuyerera zviri nyore panguva ye encapsulation process uye kuzadza mapundu pakati pechigadzirwa chemagetsi neiyo substrate, kuve nechokwadi chekuvhara yunifomu uye kuderedza voids.

Kunamatira: Underfill zvinhu zvinofanirwa kuve nekunamira kwakanaka kune yemagetsi mudziyo uye substrate kuti ipe chisungo chakasimba uye kudzivirira delamination kana kupatsanurwa pasi pekupisa uye mechaniki kushushikana.

Electrical insulation: Underfill zvinhu zvinofanirwa kunge zvine yakakwirira magetsi ekudzivirira zvivakwa kudzivirira mapfupi maseketi uye kumwe kutadza kwemagetsi muchishandiso.

Mechanical simba: Underfill zvinhu zvinofanirwa kunge zvine simba rakakwana remuchina kuti rimire kushushikana kunowanikwa panguva yekutenderera tembiricha, kuvhunduka, kudedera, uye mamwe ma mechanic mitoro pasina kutsemuka kana kukanganisa.

Nguva yekurapa: Underfill zvinhu zvinofanirwa kuve nenguva yakakodzera yekurapa kuti ive nechokwadi chekubatana uye kurapa pasina kukonzera kunonoka mukugadzira maitiro.

Kutengesa uye reworkability: Underfill zvinhu zvinofanirwa kuenderana nemidziyo yekuparadzira inoshandiswa mukugadzira uye inobvumidza kushandazve kana kugadzirisa kana zvichidikanwa.

Unyoro nemishonga: Underfill zvinhu zvinofanira kuva zvakanaka mwando kuramba kudzivirira mwando ingress, izvo zvinogona kukonzera mudziyo kukundikana.

Shelf life: Underfill zvinhu zvinofanirwa kuve nehupenyu hurefu hwesherufu, zvichibvumira kuchengetedza kwakaringana uye kushandiswa nekufamba kwenguva.

Chii chinonzi Molded Underfill Material?

Iyo yakaumbwa underfill zvinhu inoshandiswa mumagetsi kurongedza kuvhara uye kuchengetedza semiconductor zvishandiso, senge akasanganiswa maseketi (ICs), kubva kunze kwezvakatipoteredza zvinhu uye kushushikana kwemagetsi. Iyo inowanzo shandiswa semvura kana kunamira zvinhu uye yobva yaporeswa kusimbisa uye kugadzira inodzivirira yakatenderedza semiconductor mudziyo.

Yakaumbwa underfill zvinhu zvinowanzo shandiswa muflip-chip packaging, iyo inobatanidza semiconductor zvishandiso kune yakadhindwa yedunhu bhodhi (PCB) kana substrate. Flip-chip packaging inobvumira kuti pave nepamusoro-density, high-performance interconnect scheme, apo iyo semiconductor device inosungirirwa yakatarisana-pasi pa substrate kana PCB, uye magetsi ekubatanidza anoshandiswa nesimbi bumps kana solder balls.

Iyo yakaumbwa underfill zvinhu zvinowanzo kuisirwa mune yemvura kana kunamira fomu uye inoyerera pasi peiyo semiconductor mudziyo necapillary chiito, ichizadza maburi pakati pechishandiso uye substrate kana PCB. Nyaya yacho inobva yaporeswa nekushandisa kupisa kana dzimwe nzira dzekurapa kuti dzisimbise uye dzigadzire danda rekudzivirira rinoputira mudziyo, richipa tsigiro yemuchina, kupisa kwemafuta, uye kudzivirira kubva mukunyorova, huruva, nezvimwe zvinosvibisa.

Zvinhu zvakaumbwa zvepasi pekuzadza pasi zvinowanzo kugadzirwa kuti zvive nemidziyo yakadai seyakaderera viscosity yekuparadzira zviri nyore, kugadzikana kwepamusoro kwekushisa kwekuita kwakavimbika mumhando dzakasiyana dzekushisa kwekushanda, kunamatira kwakanaka kune akasiyana substrates, yakaderera coefficient yekuwedzera kwekushisa (CTE) kuderedza kushushikana panguva yekupisa. kuchovha bhasikoro, uye yakakwirira magetsi ekudzivirira zvivakwa kudzivirira mapfupi maseketi.

Zvirokwazvo! Pamusoro pezvivakwa zvambotaurwa, zvakaumbwa underfill zvinhu zvinogona kunge zvine humwe hunhu hwakagadzirirwa kune chaiwo mashandisirwo kana zvinodiwa. Semuyenzaniso, zvimwe zvakagadziridzwa underfill zvinhu zvinogona kunge zvakawedzera kupisa conductivity kunatsiridza kupisa kupisa kubva kune semiconductor mudziyo, iyo yakakosha mumashandisirwo epamusoro-simba uko kutonga kwekupisa kwakakosha.

Unobvisa sei Underfill Material?

Kubvisa zvinhu zvisina kuzara kunogona kuve kwakaoma, sezvo yakagadzirirwa kuve yakasimba uye inoshingirira kune zvakatipoteredza zvinhu. Nekudaro, dzinoverengeka nzira dzakajairwa dzinogona kushandiswa kubvisa underfill zvinhu, zvichienderana nemhando chaiyo yekuzara uye mhedzisiro yaunoda. Hedzino dzimwe sarudzo:

Thermal nzira: Underfill zvinhu zvinowanzogadzirwa kuti zvigadzikane nekushisa, asi dzimwe nguva zvinogona kupfaviswa kana kunyungudutswa nekuisa kupisa. Izvi zvinogona kuitwa uchishandisa midziyo yakasarudzika senge inopisa mhepo rework station, simbi yekunyungudutsa ine blade inopisa, kana infrared heater. Iyo yakapfava kana yakanyungudutswa underfill inogona kubva yanyatso kukweshwa kana kusimudzwa nemudziyo wakakodzera, senge purasitiki kana simbi scraper.

Kemikari nzira: Kemikari zvinonyungudutsa zvinogona kunyungudutsa kana kupfavisa zvimwe zvinhu zvisina kuzara. Mhando yezvinonyungudutsa inodiwa zvinoenderana nemhando chaiyo ye underfill material. Mafungiro ezvinonyungudutsa ekubvisa underfill anosanganisira isopropyl alcohol (IPA), acetone, kana specialised underfill ekubvisa mhinduro. Iyo solvent inowanzo shandiswa kune iyo underfill zvinhu uye inobvumirwa kupinda nekunyorovesa iyo, mushure mezvo izvo zvinhu zvinogona kukweshwa kana kupukuta.

Mechanical nzira: Underfill zvinhu zvinogona kubviswa zvemagetsi uchishandisa abrasive kana mechanic nzira. Izvi zvinogona kusanganisira hunyanzvi hwakadai sekukuya, jecha, kana kugaya, kushandisa maturusi ehunyanzvi kana midziyo. Otomatiki maitiro anowanzo kuve ane hukasha uye anogona kunge akakodzera kune dzimwe nzira dzisiri kushanda, asi anogona zvakare kuunza njodzi yekukuvadza iri pasi pe substrate kana zvikamu uye zvinofanirwa kushandiswa nekuchenjerera.

Kusanganiswa nzira: Mune zvimwe zviitiko, musanganiswa wehunyanzvi unogona kubvisa underfilled material. Semuenzaniso, akasiyana-siyana ekupisa uye emakemikari maitiro anogona kushandiswa, uko kupisa kunoshandiswa kupfavisa underfill zvinhu, zvinonyungudutsa kuti zviwedzere kunyungudika kana kupfavisa zvinhu, uye nzira dzemakanika kubvisa zvakasara.

Nzira Yekuzadza Underfill Epoxy

Heino nhanho-ne-nhanho gwara rekuita underfill epoxy:

Danho 1: Unganidza Zvishandiso uye Zvishandiso

Underfill epoxy zvinhu: Sarudza yemhando yepamusoro underfill epoxy material inoenderana nezvinhu zvemagetsi zvauri kushanda nazvo. Tevedzera mirairo yemugadziri yekusanganisa nekurapa nguva.

Midziyo yekuparadzira: Iwe unozoda sisitimu yekuparadzira, senge sirinji kana dispenser, kuti uise epoxy nemazvo uye zvakafanana.

Heat source (optional): Zvimwe zvisina kuzadzwa epoxy zvinhu zvinoda kurapwa nekupisa, saka ungangoda sosi yekupisa, senge oveni kana ndiro inopisa.

Zvishandiso zvekuchenesa: Iva ne-isopropyl doro kana yakafanana yekuchenesa mumiriri, ma-lint-free wipes, uye magurovhosi ekuchenesa uye kubata iyo epoxy.

Danho 2: Gadzirira Zvigadzirwa

Chenesa zvikamu: Ita shuwa kuti zvinhu zvinofanirwa kuzadzwa zvishoma zvakachena uye hazvina chero zvinosvibisa, zvakaita seguruva, girisi, kana mwando. Vachenese zvakakwana uchishandisa isopropyl doro kana yakafanana yekuchenesa mumiririri.

Isa adhesive kana flux (kana zvichidikanwa): Zvichienderana ne underfill epoxy material uye zvinhu zviri kushandiswa, ungangoda kuisa adhesive kana flux kune zvikamu usati waisa epoxy. Tevera mirairo yemugadziri wechinhu chaicho chiri kushandiswa.

Danho 3: Sanganisa iyo epoxy

Tevedzera mirairo yemugadziri kusanganisa underfill epoxy material nemazvo. Izvi zvinogona kusanganisira kubatanidza maviri kana anopfuura epoxy zvikamu mune chaiyo ratios uye nekuimisa zvakakwana kuti iwane musanganiswa une homogeneous. Shandisa mudziyo wakachena uye wakaoma pakusanganisa.

Nhanho 4: Isa iyo Epoxy

Isa iyo epoxy mune yekuparadzira system: Zadza iyo yekuparadzira sisitimu, senge sirinji kana dispenser, ine yakasanganiswa epoxy zvinhu.

Isa iyo epoxy: Bvisa iyo epoxy zvinhu panzvimbo inoda kuzadzwa. Iva nechokwadi chekushandisa epoxy nenzira yakafanana uye inodzorwa kuti uve nechokwadi chekuvharwa kwakakwana kwezvikamu.

Dzivisa mabhuru emhepo: Dzivisa kuteya mabhuru emhepo muepoxy, sezvo anogona kukanganisa mashandiro uye kuvimbika kweiyo underfilled components. Shandisa nzira dzakakwana dzekuparadzira, dzakadai sedzinononoka uye dzakatsiga kudzvanywa, uye zvinyoro bvisa chero mabhubhu emhepo akavharirwa nevacuum kana kubata musangano.

Nhanho 5: Rapa iyo Epoxy

Kurapa iyo epoxy: Tevedzera mirairo yemugadziri yekurapa underfill epoxy. Zvichienderana ne epoxy zvinhu zvinoshandiswa, izvi zvinogona kusanganisira kugadzirisa pamhepo tembiricha kana kushandisa sosi yekupisa.

Bvumira nguva yakakodzera yekurapa: Ipa epoxy nguva yakakwana yekurapa zvizere usati wabata kana kuenderera mberi nekugadzirisa zvikamu. Zvichienderana ne epoxy zvinhu uye kurapa mamiriro, izvi zvinogona kutora maawa akawanda kusvika mazuva mashoma.

Danho rechitanhatu: Chenesa uye Ongorora

Chenesa iyo yakawandisa epoxy: Kana iyo epoxy yapora, bvisa chero yakawandisa epoxy uchishandisa nzira dzakakodzera dzekuchenesa, dzakadai sekukwenya kana kucheka.

Ongorora zvikamu zvisina kuzadzwa: Ongorora izvo zvisina kuzara pasi kune chero chakakanganisika, senge voids, delamination, kana kufukidzwa kusina kukwana. Kana chero kukanganisa kunowanikwa, tora matanho ekugadzirisa akakodzera, akadai sekuzadzazve kana kuporesa zvakare, sezvinodiwa.

Iwe Unozadza rini Underfill Epoxy

Iyo nguva yekuzadza underfill epoxy application ichaenderana neiyo chaiyo maitiro uye mashandisiro. Underfill epoxy inowanzo shandiswa mushure mekunge microchip yaiswa pabhodhi redunhu uye majoini ekutengesa akaumbwa. Uchishandisa dispenser kana sirinji, iyo underfill epoxy inozopihwa mune diki gap pakati peiyo microchip uye redunhu bhodhi. Iyo epoxy inobva yaporeswa kana kuomeswa, kazhinji ichiipisa kune imwe tembiricha.

Iyo chaiyo nguva ye underfill epoxy application inogona kuenderana nezvinhu zvakaita semhando ye epoxy inoshandiswa, saizi uye geometry yegeji rekuzadzwa, uye chaiyo kurapa maitiro. Kutevera mirairo yemugadziri uye yakakurudzirwa nzira yeiyo epoxy iri kushandiswa yakakosha.

Heano mamwe mamiriro emazuva ese kana underfill epoxy inogona kuiswa:

Flip-chip bonding: Underfill epoxy inowanzoshandiswa muflip-chip bonding, nzira yekubatanidza semiconductor chip yakananga kuPCB isina waya yekubatanidza. Mushure mekunge flip-chip yanamirwa kuPCB, underfill epoxy inowanzo shandiswa kuzadza gaka riri pakati pechip nePCB, ichipa kusimbaradza kwemuchina uye kudzivirira chip kubva kune zvakatipoteredza zvinhu senge unyoro uye tembiricha shanduko.

Surface mount tekinoroji (SMT): Underfill epoxy inogona zvakare kushandiswa musurface mount tekinoroji (SMT) maitiro, uko zvinhu zvemagetsi zvakaita seyakabatanidzwa maseketi (ICs) uye zvinopikisa zvinoiswa zvakananga pamusoro pePCB. Underfill epoxy inogona kushandiswa kusimbisa nekudzivirira izvi zvikamu mushure mekutengeswa paPCB.

Chip-on-board (COB) musangano: Mumusangano we chip-on-board (COB), isina semiconductor machipisi anonamirwa zvakananga kuPCB achishandisa zvinonamira zvinobatisa, uye underfill epoxy inogona kushandiswa kuvharidzira nekusimbisa machipisi, kuvandudza kugadzikana kwavo kwemuchina uye kuvimbika.

Kugadziriswa kwechikamu-chikamu: Underfill epoxy inogona zvakare kushandiswa muchikamu-chikamu chekugadzirisa maitiro, uko kwakakuvadzwa kana kukanganisa emagetsi zvikamu paPCB zvinotsiviwa nezvitsva. Underfill epoxy inogona kuiswa kune inotsiva chikamu kuti ive nechokwadi chekunamatira kwakaringana uye kugadzikana kwemichina.

Is Epoxy Filler Mvura

Ehe, iyo epoxy filler kazhinji haina mvura kana yapora. Epoxy mafirita anozivikanwa nekunamira kwawo kwakanaka uye kuramba kwemvura, zvichiita kuti ive sarudzo yakakurumbira kune akasiyana maapplication ayo anoda yakasimba uye isina mvura bond.

Kana ichishandiswa sekuzadza, epoxy inogona kunyatsozadza makatsemuka uye maburi muzvinhu zvakasiyana siyana, zvinosanganisira huni, simbi, uye kongiri. Kana yangorapwa, inogadzira nzvimbo yakaoma, yakasimba inoshingirira kumvura nehunyoro, zvichiita kuti ive yakakodzera kushandiswa munzvimbo dzine mvura kana hunyoro hwepamusoro.

Nekudaro, zvakakosha kuti uzive kuti haasi ese epoxy mafirita akagadzirwa akaenzana, uye mamwe anogona kunge aine mazinga akasiyana ekudzivirira mvura. Iri zano rakanaka nguva dzose kutarisa zita rechigadzirwa kana kubvunza mugadziri kuti uone kuti chakakodzera purojekiti yako uye chinangwa chekushandisa.

Kuti uve nechokwadi chemibairo yakanaka, zvakakosha kuti ugadzirire zvakanaka pamusoro usati waisa epoxy filler. Izvi zvinowanzobatanidza kuchenesa nzvimbo yacho zvakakwana uye kubvisa chero chinhu chakasununguka kana chakakanganisika. Kana iyo yepamusoro ichinge yagadzirirwa nemazvo, iyo epoxy filler inogona kusanganiswa uye kuiswa zvinoenderana nemirairo yemugadziri.

Izvo zvakakoshawo kuziva kuti haasi ese epoxy mafirita akagadzirwa akaenzana. Zvimwe zvigadzirwa zvinogona kunge zvakanyatsokodzera kune chaiwo maapplication kana nzvimbo kupfuura zvimwe, saka kusarudza chigadzirwa chakakodzera chebasa kwakakosha. Pamusoro pezvo, mamwe epoxy fillers angangoda mamwe mabhanhire kana zvisimbiso kuti ape kuchengetedzwa kwekugara kwenguva refu kwekudzivirira mvura.

Epoxy mafirita ane mukurumbira nekuda kwekudzivirira kwawo mvura uye kugona kugadzira yakasimba uye yakasimba chisungo. Nekudaro, kutevedzera nzira dzekushandisa uye kusarudza chigadzirwa chakakodzera kwakakosha kuti uve nechokwadi chemhedzisiro yakanaka.

Underfill Epoxy Flip Chip Maitiro

Heano matanho ekuita underfill epoxy flip chip process:

Kuchenesa: Iyo substrate uye flip chip zvinocheneswa kubvisa chero guruva, marara, kana zvinosvibisa zvinogona kukanganisa iyo underfilled epoxy bond.

Dispensing: Iyo underfilled epoxy inoparadzirwa pane substrate nenzira inodzorwa, uchishandisa dispenser kana tsono. Maitiro ekugovera anofanirwa kuve akajeka kudzivirira chero mafashama kana voids.

Kugadziriswa: Iyo flip chip inozoenderana neiyo substrate uchishandisa maikorosikopu kuve nechokwadi chekuiswa kwayo.

Reflow: Iyo flip chip inofambiswa patsva uchishandisa choto kana hovhoni kunyungudutsa mabumps e solder uye kubatanidza chip kune substrate.

Kurapa: Iyo underfilled epoxy inorapwa nekuipisa muchoto pane imwe tembiricha nenguva. Iyo nzira yekurapa inobvumira epoxy kuyerera uye kuzadza chero mapeji pakati peflip chip uye substrate.

Kuchenesa: Mushure mekurapa, chero epoxy yakawandisa inobviswa kubva kumicheto yechip uye substrate.

Inspection: Danho rekupedzisira nderekuongorora flip chip pasi pemaikorosikopu kuti uone kuti hapana mavhodhi kana maburi muepoxy isina kuzadzwa.

Mushure mekurapa: Mune zvimwe zviitiko, mushure mekurapa maitiro angave akadikanwa kuti uvandudze mechanical uye thermal properties ye underfilled epoxy. Izvi zvinosanganisira kudziyisa chip zvakare pane tembiricha yepamusoro kwenguva yakawedzerwa kuti uwane yakawedzera kuyambuka-inobatanidza epoxy.

Kuedza kwemagetsi: Mushure meiyo underfill epoxy flip-chip process, chishandiso chinoedzwa kuti chione kuti chinoshanda nemazvo. Izvi zvinogona kusanganisira kutarisa zvikabudura kana kuvhura mudunhu uye kuyedza maitiro emagetsi emudziyo.

kavha: Kana mudziyo uchinge waedzwa uye wakasimbiswa, unogona kuiswa mukati uye kutumirwa kune mutengi. Iyo yekurongedza inogona kusanganisira yekuwedzera dziviriro, senge yekudzivirira yekuvhara kana encapsulation, kuve nechokwadi chekuti mudziyo hauna kukuvara panguva yekufambisa kana kubata.

Epoxy Underfill Bga Nzira

Maitiro acho anosanganisira kuzadza nzvimbo pakati peBGA chip uye bhodhi redunhu ne epoxy, iyo inopa yakawedzera mechanical rutsigiro uye inovandudza mashandiro ekupisa kwekubatanidza. Heano matanho anobatanidzwa mune epoxy underfill BGA nzira:

• Gadzirira BGA pasuru uye PCB nokuzvichenesa ne solvent kubvisa zvinosvibisa zvinogona kukanganisa chisungo.
• Isa diki diki yekuyerera kusvika pakati peiyo BGA package.
• Isa pasuru yeBGA paPCB uye shandisa ovheni yekuyerera kuti utengese pasuru yacho pabhodhi.
• Isa shoma shoma epoxy underfill kukona yeBGA package. Iyo underfill inofanirwa kuiswa pakona iri padyo nepakati pepakeji, uye haifanirwe kuvhara chero mabhora ekutengesa.
• Shandisa capillary chiito kana vacuum kudhirowa underfill pasi peBGA package. Iyo underfill inofanira kuyerera ichitenderedza solder mabhora, ichizadza chero voids uye kugadzira yakasimba chisungo pakati peBGA nePCB.
• Poresa underfill maererano nemirairo yemugadziri. Izvi zvinowanzobatanidza kudziyisa gungano kune imwe tembiricha yenguva yakati.
• Chenesa gungano nesolvent kubvisa chero yakawandisa flux kana underfill.
• Ongorora iyo underfill yezvivharo, mabubble, kana zvimwe zvinokanganisa zvinogona kukanganisa kuita kweBGA chip.
• Chenesa chero yakawandisa epoxy kubva kuBGA chip uye redunhu bhodhi uchishandisa solvent.
• Edza iyo BGA chip kuti uone kuti iri kushanda nemazvo.

Epoxy underfill inopa akati wandei mabhenefiti eBGA mapakeji, anosanganisira yakagadziridzwa simba remagetsi, kuderedzwa kushushikana pamajoini ekutengesa, uye kuwedzera kuramba kune inopisa bhasikoro. Nekudaro, kutevera mirairo yemugadziri nekungwarira kunovimbisa yakasimba uye yakavimbika chisungo pakati peBGA package nePCB.

Maitiro ekugadzira Underfill Epoxy Resin

Underfill epoxy resin imhando yekunamira inoshandiswa kuzadza mapundu uye kusimbisa zvinhu zvemagetsi. Heano maitiro akajairwa ekugadzira underfilled epoxy resin:

• Ingredients:
• Epoxy nebwe
• Hardener
• Filler zvinhu (senge silica kana girazi bead)
• Solvents (zvakadai seacetone kana isopropyl doro)
• Catalysts (kusarudza)

matanho:

Sarudza yakakodzera epoxy resin: Sarudza epoxy resin inokodzera application yako. Epoxy resins inouya mumhando dzakasiyana-siyana dzine zvinhu zvakasiyana-siyana. Nezve underfill applications, sarudza resin ine simba rakawanda, yakaderera shrinkage, uye yakanaka kunamatira.

Sanganisa epoxy resin uye yakaoma: Mazhinji underfill epoxy resins anouya mune maviri-chikamu kit, ine resin uye hardener yakaputirwa zvakasiyana. Sanganisa zvikamu zviviri pamwe chete maererano nemirairo yemugadziri.

Wedzera filler zvinhu: Wedzera zvigadziriso zvekuzadza kune epoxy resin musanganiswa kuti uwedzere viscosity yayo uye nekupa imwe tsigiro yezvimiro. Silika kana girazi mabheji anowanzoshandiswa sekuzadza. Wedzera mafiritsi zvishoma nezvishoma uye nyatso sanganisa kusvikira kuwirirana kunodiwa kwaitwa.

Wedzera solvents: Solvents inogona kuwedzerwa kune epoxy resin musanganiswa kuti ivandudze kuyerera kwayo uye kunyorova zvivakwa. Acetone kana isopropyl doro zvinowanzoshandiswa zvinonyungudutsa. Wedzera zvinonyungudutsa zvishoma nezvishoma uye nyatsosanganisa kusvikira kuwirirana kunodiwa kwaitwa.

Chiita sarudzo: Wedzera catalysts: Catalysts inogona kuwedzerwa kune epoxy resin musanganiswa kuti ikurumidze kurapa. Nekudaro, zvinokonzeresa zvinogona zvakare kuderedza hupenyu hwehari yemusanganiswa, saka shandisa iwo zvishoma. Tevedzera mirairo yemugadziri wehuwandu hwakakodzera hwekatani kuwedzera.

Isa iyo underfill epoxy resin kuzadza iyo epoxy resin musanganiswa kune gap kana mubatanidzwa. Shandisa sirinji kana dispenser kuisa musanganiswa nemazvo uye kudzivirira mabhuru emhepo. Ita shuwa kuti musanganiswa wakagovaniswa zvakaenzana uye unovhara nzvimbo dzese.

Kurapa iyo epoxy resin: Iyo epoxy resin inogona kurapa maererano nemirairo yemugadziri. Mazhinji underfill epoxy resins anorapa pane tembiricha yekamuri, asi mamwe angangoda tembiricha yakakwira kukurumidza kuporeswa.

 Pane Chero Zvipingamupinyi Kana Matambudziko Anoenderana NeEpoxy Underfill?

Ehe, pane zvisingakwanisi uye matambudziko ane chekuita ne epoxy underfill. Zvimwe zvezvipingamupinyi zvakajairika uye matambudziko ndeaya:

Thermal kuwedzera kusawirirana: Epoxy underfills ine coefficient of thermal expansion (CTE) iyo yakasiyana neCTE yezvikamu zvinoshandiswa kuzadza. Izvi zvinogona kukonzera kushushikana kwekushisa uye zvinogona kukonzera kukanganisa kwechikamu, kunyanya munzvimbo dzekupisa kwepamusoro.

Kugadzirisa matambudziko: Epoxy inozadza yakasarudzika michina yekugadzirisa uye matekiniki, anosanganisira kugovera uye kurapa michina. Kana zvisina kuitwa nemazvo, iyo underfill inogona kusanyatso kuzadza mapundu pakati pezvikamu kana kuti inogona kukonzera kukanganisa kune zvikamu.

Kunzwa kunyorova: Epoxy underfills inonzwa kune hunyoro uye inogona kutora unyoro kubva kunharaunda. Izvi zvinogona kukonzera nyaya nekunamatira uye zvinogona kukonzera kukanganisa kwechikamu.

Kemikari kuenderana: Epoxy underfills inogona kuita nezvimwe zvinhu zvinoshandiswa muzvikamu zvemagetsi, senge solder masks, zvinonamira, uye fluxes. Izvi zvinogona kukonzera nyaya nekunamatira uye zvinogona kukonzera kukanganisa kwechikamu.

Mariro: Epoxy underfills inogona kudhura kupfuura zvimwe zvinhu zvisina underfill, senge capillary underfills. Izvi zvinogona kuita kuti dzisanyanya kukwezva kuti ishandiswe munzvimbo dzekugadzirwa kwepamusoro.

Zvinonetsa nezvezvakatipoteredza: Epoxy underfill inogona kuve nemakemikari ane njodzi uye zvinhu, senge bisphenol A (BPA) uye phthalates, izvo zvinogona kuisa njodzi kuhutano hwevanhu uye nharaunda. Vagadziri vanofanirwa kutora matanho akakodzera kuti vaone kuti zvinhu izvi zvakabatwa zvakachengeteka uye kuraswa.

 Nguva yekuzorora: Epoxy underfill inoda imwe nguva yenguva yekurapa isati yashandiswa mukushandisa. Nguva yekurapa inogona kusiyana zvichienderana nekuumbwa kweiyo underfill, asi inowanzobva pamaminetsi akati wandei kusvika maawa akati wandei. Izvi zvinogona kudzikisira nzira yekugadzira uye kuwedzera iyo yakazara nguva yekugadzira.

Nepo epoxy underfills ichipa akawanda mabhenefiti, anosanganisira kuvandudzwa kuvimbika uye kusimba kwezvikamu zvemagetsi, ivo vanopawo mamwe matambudziko uye zvipimo zvinofanirwa kunyatso tariswa zvisati zvashandiswa.

Ndezvipi Zvakanakira Kushandisa Epoxy Underfill?

Heano mamwe emabhenefiti ekushandisa epoxy underfill:

Danho 1: Kuwedzera kuvimbika

Imwe yemabhenefiti akakosha ekushandisa epoxy underfill ndeyekuwedzera kuvimbika. Zvinhu zvemagetsi zviri panjodzi yekukuvadzwa nekuda kwekupisa uye kushushikana kwemagetsi, senge thermal cycling, vibration, uye kuvhunduka. Epoxy underfill inobatsira kuchengetedza majoini ekutengesa pane zvemagetsi zvikamu kubva mukukuvadzwa nekuda kwekunetseka uku, izvo zvinogona kuwedzera kuvimbika uye hupenyu hwechigadzirwa chemagetsi.

Danho rechipiri: Kuvandudzwa kwekuita

Nekudzikisa njodzi yekukuvadzwa kwezvinhu zvemagetsi, epoxy underfill inogona kubatsira kuvandudza mashandiro echigadzirwa chose. Zvisina kusimbiswa nemazvo zvemagetsi zvikamu zvinogona kutambura nekuderedzwa kwekushanda kana kutadza zvachose, uye epoxy underfills inogona kubatsira kudzivirira nyaya idzi, zvichitungamira kune yakavimbika uye yepamusoro-inoita mudziyo.

Danho rechitatu: Zvirinani kutonga kwekushisa

Epoxy underfill ine yakanakisa thermal conductivity, iyo inobatsira kubvisa kupisa kubva kune zvemagetsi zvikamu. Izvi zvinogona kuvandudza kutungamira kwekupisa kwechigadzirwa uye kudzivirira kupisa. Kupisa zvakanyanya kunogona kukonzera kukuvadzwa kwezvinhu zvemagetsi uye kutungamirira kumatambudziko ekuita kana kutadza zvachose. Nekupa hunoshanda hwekupisa manejimendi, epoxy underfill inogona kudzivirira matambudziko aya uye kugadzirisa mashandiro ese uye hupenyu hwechishandiso.

Danho rechina: Kuwedzerwa simba remagetsi

Epoxy underfill inopa imwe tsigiro yemagetsi kune zvikamu zvemagetsi, izvo zvinogona kubatsira kudzivirira kukuvara nekuda kwekudengenyeka kana kuvhunduka. Zvisizvo zvakasimbiswa zvakakwana zvikamu zvemagetsi zvinogona kutambura kubva kune mechanical stress, zvichiita kuti kukuvara kana kukundikana zvachose. Epoxy inogona kubatsira kudzivirira nyaya idzi nekupa imwe simba remuchina, inotungamira kune imwe yakavimbika uye yakasimba mudziyo.

Nhanho 5: Yakaderedzwa warpage

Epoxy underfill inogona kubatsira kuderedza iyo PCB's warpage panguva yekushambadzira, izvo zvinogona kutungamira mukuvandudzwa kwekuvimbika uye nani solder joint quality. PCB warpage inogona kukonzera nyaya nekurongeka kwezvinhu zvemagetsi, zvichitungamira kune zvakajairika solder defects izvo zvinogona kukonzera nyaya dzekuvimbika kana kutadza zvachose. Epoxy underfill inogona kubatsira kudzivirira nyaya idzi nekudzikisa warpage panguva yekugadzira.

Epoxy Underfill Inoshandiswa Sei Mukugadzirwa Kwemagetsi?

Heano matanho anobatanidzwa mukushandisa epoxy underfill mukugadzira zvemagetsi:

Kugadzirira zvikamu: Izvo zvikamu zvemagetsi zvinofanirwa kugadzirwa usati waisa epoxy underfill. Izvo zvikamu zvinocheneswa kubvisa chero tsvina, guruva, kana marara zvinogona kukanganisa kunamatira kwe epoxy. Izvo zvikamu zvinoiswa paPCB uye zvinobatwa uchishandisa adhesive yenguva pfupi.

Kugovera epoxy: Iyo epoxy underfill inopihwa paPCB uchishandisa muchina wekuparadzira. Muchina wekuparadzira unoyerwa kuburitsa iyo epoxy muhuwandu chaihwo uye nzvimbo. Iyo epoxy inoparadzirwa murukova runoramba ruri pamucheto wechikamu. Rukova rwe epoxy runofanira kunge rwakareba zvakakwana kuvhara gaka rese pakati pechinhu nePCB.

Kuparadzira epoxy: Mushure mekuiparadzira, inofanira kupararira kuvhara mukaha uri pakati pechikamu nePCB. Izvi zvinogona kuitwa nemaoko uchishandisa bhurashi diki kana otomatiki yekuparadzira muchina. Iyo epoxy inoda kuparadzirwa zvakaenzana pasina kusiya chero voids kana mabhuru emhepo.

Kugadzirisa epoxy: Iyo epoxy underfill inozogadziriswa kuomesa uye kugadzira chisungo chakasimba pakati pechikamu nePCB. Kurapa kunogona kuitwa nenzira mbiri: inopisa kana UV. Mukurapa kwekupisa, PCB inoiswa muovheni uye inopisa kune imwe tembiricha yeimwe nguva. Mukurapa kweUV, iyo epoxy inoratidzwa kune ultraviolet mwenje kuti itange maitiro ekurapa.

Kuchenesa: Mushure mekunge epoxy underfills yapora, yakawandisa epoxy inogona kubviswa uchishandisa scraper kana solvent. Izvo zvakakosha kuti ubvise chero yakawandisa epoxy kudzivirira kuti irege kukanganisa kushanda kwechikamu chemagetsi.

Ndeapi Mamwe Manyorerwo Ekushandisa Epoxy Underfill?

Heano mamwe akajairika mashandisirwo epoxy underfill:

Semiconductor kurongedza: Epoxy underfill inoshandiswa zvakanyanya mukurongedza kwesemiconductor zvishandiso, senge microprocessors, integrated circuits (ICs), uye flip-chip mapakeji. Muchishandiso ichi, epoxy underfill inozadza mukaha uripo pakati pe semiconductor chip uye substrate, ichipa kusimbaradza kwemakanika uye kuwedzera kupisa conductivity kubvisa kupisa kunogadzirwa panguva yekushanda.

Yakadhindwa redunhu bhodhi (PCB) gungano: Epoxy underfill inoshandiswa mumuviri wePCB kuwedzera kuvimbika kwemajoini ekutengesa. Iyo inoshandiswa kune yepasi pezvikamu zvakaita sebhora grid array (BGA) uye chip scale package (CSP) midziyo isati yave reflow soldering. Iyo epoxy underfills inoyerera ichipinda mumagapu ari pakati pechikamu nePCB, ichigadzira chisungo chakasimba chinobatsira kudzivirira kutadza kwemajoini ekutengesa nekuda kwekunetsekana kwemagetsi, senge thermal cycling uye shock/vibration.

Optoelectronics: Epoxy underfill inoshandiswawo mukurongedza optoelectronic zvishandiso, senge light-emitting diodes (LEDs) uye laser diode. Midziyo iyi inogadzira kupisa panguva yekushanda, uye epoxy underfills inobatsira kudzima kupisa uku uye kugadzirisa iyo yese yekupisa kuita kwemudziyo. Pamusoro pezvo, epoxy underfill inopa simbi yekusimbisa kuchengetedza yakatetepa optoelectronic zvikamu kubva kumakanika kushushikana uye zvakatipoteredza zvinhu.

Zvemagetsi zvemotokari: Epoxy underfill inoshandiswa mumagetsi emotokari kune akasiyana maapplication, senge injini yekudzora zvikamu (ECUs), transmission control units (TCUs), uye masensa. Izvi zvikamu zvemagetsi zvinoiswa pasi pemamiriro ekunze akaomarara, anosanganisira kupisa kwakanyanya, humidity, uye vibration. Epoxy underfill inodzivirira kubva kune aya mamiriro, kuve nechokwadi chekuita kwakavimbika uye kusimba kwenguva refu.

Consumer electronics: Epoxy underfill inoshandiswa mumhando dzakasiyana dzemagetsi evatengi, zvinosanganisira mafoni, mahwendefa, mitambo yemitambo, uye zvinopfekwa. Inobatsira kuvandudza izvi zvishandiso 'mechanical kutendeseka uye kupisa kwekuita, kuve nechokwadi chekushanda kwakavimbika pasi pemamiriro akasiyana ekushandisa.

Aerospace uye kudzivirira: Epoxy underfill inoshandiswa mune zvemuchadenga uye zvekudzivirira zvikumbiro, uko zvinhu zvemagetsi zvinofanirwa kushingirira nharaunda dzakanyanya, senge tembiricha yepamusoro, kukwirisa, uye kudengenyeka kwakanyanya. Epoxy underfill inopa kugadzikana kwemuchina uye kudziya kwekutonga, zvichiita kuti ive yakakodzera kune dzakaoma uye dzinoda nharaunda.

Ndeapi Matanho Ekuporesa Epoxy Underfill?

Iyo yekurapa maitiro epoxy underfill inosanganisira anotevera matanho:

Dispensing: Epoxy underfill inowanzo kupihwa sechinhu chemvura pane substrate kana chip uchishandisa dispenser kana jetting system. Iyo epoxy inoshandiswa nenzira chaiyo kuvhara nzvimbo yose inoda kuderedzwa.

Encapsulation: Kana iyo epoxy ichinge yapihwa, iyo chip inowanzoiswa pamusoro peiyo substrate, uye iyo epoxy underfill inoyerera ichitenderedza uye pasi peiyo chip, ichiiputira. Iyo epoxy zvinhu zvakagadzirirwa kuyerera zviri nyore uye kuzadza mapundu pakati pe chip uye substrate kuita yunifomu layer.

Pre-curing: Iyo epoxy underfill inowanzo rapwa isati yapora kana kuti zvishoma kune gel-kufanana kuenderana mushure mekuvhara. Izvi zvinoitwa nekuisa gungano kune yakaderera-tembiricha yekurapa maitiro, senge oven kubika kana infrared (IR). Iyo yekutanga-yekurapa nhanho inobatsira kudzikisa epoxy's viscosity uye inodzivirira kuti irege kuyerera ichibva munzvimbo isina kuzara panguva dzinotevera dzekurapa matanho.

Post-kupora: Kana iyo epoxy underfills isati yapora, gungano rinoiswa pasi pepamusoro-tembiricha yekurapa maitiro, kazhinji muhovhoni yekugezera kana mukamuri yekurapa. Iyi nhanho inozivikanwa se-post-kuporesa kana kurapa kwekupedzisira, uye inoitwa kurapa zvizere epoxy zvinhu uye kuzadzisa iyo yakanyanya mechanical uye yekupisa zvimiro. Iyo nguva uye tembiricha yemashure-ekurapa maitiro anodzorwa nekuchenjera kuti ave nechokwadi chekurapa kwakazara kweiyo epoxy underfill.

Kutonhora: Mushure mekugadzirisa-post-curing process, gungano rinowanzobvumidzwa kutonhora kusvika kukamuri tembiricha zvishoma nezvishoma. Kukurumidza kutonhora kunogona kukonzera kushushikana kwemafuta uye kukanganisa kutendeseka kweiyo epoxy underfill, saka inodzorwa kutonhora kwakakosha kudzivirira chero zvingangoitika.

Inspection: Kana iyo epoxy underfills yanyatsopora, uye gungano ratonhora pasi, rinowanzo tariswa chero hurema kana voids mune underfill material. X-ray kana dzimwe nzira dzisiri dzekuparadza dzekuyedza dzinogona kushandiswa kutarisa kunaka kweiyo epoxy underfill uye kuona kuti yakasunga zvakakwana chip uye substrate.

Ndeapi Mhando Akasiyana Epoxy Underfill Materials Anowanikwa?

Mhando dzinoverengeka dze epoxy underfill zvinhu zviripo, imwe neimwe iine yayo zvimiro uye maitiro. Mamwe emhando dzakajairika epoxy underfill zvinhu ndeaya:

Capillary Underfill: Capillary underfill zvinhu zvakaderera-viscosity epoxy resins inoyerera ichipinda mumipata yakamanikana pakati pe semiconductor chip uye substrate yayo panguva yekuzara kwekuita. Iwo akagadzirirwa kuve neakaderera viscosity, achivabvumira kuyerera zviri nyore mumakapu madiki kuburikidza necapillary chiito, uyezve kurapa kuumba yakaoma, thermosetting zvinhu zvinopa mechaniki kusimbiswa kune chip-substrate musangano.

No-Flow Underfill: Sezvinoratidzwa nezita racho, hapana-kuyerera underfill zvinhu hazviyerere panguva ye underfill process. Iwo anowanzo kugadzirwa ne-high-viscosity epoxy resins uye anoshandiswa seasati apihwa epoxy paste kana firimu pane substrate. Munguva yegungano, iyo chip inoiswa pamusoro peiyo-isina-kuyerera underfill, uye gungano rinoiswa pasi pekupisa uye kumanikidzwa, zvichiita kuti epoxy irape uye igadzire chinhu chakaomarara chinozadza mikaha pakati pechip uye substrate.

Molded Underfill: Yakaumbwa underfill zvinhu ndeye pre-yakaumbwa epoxy resins inoiswa pane substrate uye yobva yapiswa kuyerera uye yakavharira chip panguva ye underfill process. Iwo anowanzo shandiswa mumashandisirwo uko yakakwirira-vhoriyamu kugadzira uye chaiyo kudzora kwe underfill zvinhu kuiswa kunodiwa.

Wafer-Level Underfill: Wafer-level underfill zvinhu ndeye epoxy resin inoiswa kune yese wafer pamusoro pese machipisi asati aiswa. Iyo epoxy inobva yaporeswa, ichigadzira chinhu chakasimba chinopa underfill dziviriro kune ese machipisi pawafer. Wafer-level underfill inowanzo shandiswa muwafer-level packaging (WLP) maitiro, uko akawanda machipisi anorongedzerwa pamwechete pane imwechete wafer isati yapatsanurwa mumapakeji ega.

Encapsulant Underfill: Encapsulant underfill zvinhu ndeye epoxy resins inoshandiswa kuvhara iyo yese chip uye substrate musangano, ichigadzira chinodzivirira chakatenderedza zvikamu. Iwo anowanzo shandiswa mumashandisirwo anoda yakakwira mechani simba, kuchengetedzwa kwezvakatipoteredza, uye kuwedzeredzwa kuvimbika.

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RUGWARO RWEKUMUKA
Deepmaterial yakatsunga kuve mutungamiri mune yemagetsi underfill epoxy indasitiri, mhando ndiyo tsika yedu!

FACTORY WOSEALE MUTENGO
Isu tinovimbisa kurega vatengi kuwana zvakanyanya-inodhura-inoshanda epoxy adhesive zvigadzirwa

VANHU VANOGADZIRIRA
Iine yemagetsi underfill epoxy adhesive seyakanyanya, yekubatanidza chiteshi uye matekinoroji

RUVIMBISO YEBASA RWEKUVIMBIKA
Ipa epoxy adhesives OEM, ODM, 1 MOQ.Yakazara Seti yeSitifiketi