Nzira dzeKuve nechokwadi cheUniform Encapsulation ye LED Chips ine Epoxy Resin, Maitiro Matambudziko uye Solutions.

 

Nekukurumidza kukura kwe LED tekinoroji, yakashandiswa zvakanyanya munzvimbo dzakawanda dzakadai semwenje, kuratidza, mota dzemagetsi, etc. Epoxy resin, sechinhu chinowanzoshandiswa encapsulation material ye LEDs, ine yakanaka optical, insulating uye mechanical properties. Nekudaro, harisi basa riri nyore kuwana yunifomu encapsulation ye LED machipisi ane epoxy resin, iyo yakanangana neakakosha maratidziro ekuita ma LEDs, akadai seyakajeka kufanana, kupisa kupisa kwekuita uye kugadzikana kwenguva refu. Naizvozvo, zvine kukosha kukuru kudzidza maitiro ekuona iyo yunifomu encapsulation ye LED machipi ane epoxy resin uye kugadzirisa zvine chekuita nemaitiro matambudziko.

Nzira dzekusimbisa Uniform Encapsulation ye LED Chips ine Epoxy Resin

(1) Precise Bracket Design

1. Inonzwisisika Chip Kuisa Nzvimbo

Paunenge uchigadzira bhuraketi, chimiro uye saizi yenzvimbo yekuisa chip inofanira kufananidzwa neiyo LED chip, uye nzvimbo yacho inofanira kunge yakadzikama uye yakatsetseka. Izvi zvinoita kuti epoxy resin iyerere zvakaenzana kutenderedza chip panguva yekudurura, kudzivirira kuunganidzwa kwenzvimbo kana voids. Semuenzaniso, shandisa yakakwirira-chaiyo mold kugadzira iyo bracket kuve nechokwadi chekuti dimensional yechokwadi yenzvimbo yekuisa chip iri mukati mediki diki rekushivirira.

2. Dhizaini yeDrainage Structure

Misa migero yemvura kana maburi uye zvimwe zvimiro pabhuraketi kutungamira mafambiro ekuyerera kweepoxy resin, zvichiita kuti ivhare chip zvakanyanya kufanana. Aya madhiraini zvimiro anogona kugadziridzwa zvinoenderana nechimiro uye chinzvimbo chechip kuti ive nechokwadi chekuti epoxy resin inogona kunyatsovhara zvikamu zvese zvechip.

(2) Kudzora Kwazvo Kwekudurura Maitiro

1. Kusarudzwa Kwekupa kana Kudurura Equipment

Shandisa yakakwirira-chaiyo yekuparadzira michina kana midziyo yekudira, iyo inogona kunyatso kudzora huwandu hwekudira uye kumhanya kweepoxy resin. Semuenzaniso, screw-mhando yekuparadzira muchina ine yakakwirira-chaiyo metering uye kutonga mabasa, inogonesa diki uye yunifomu kudururwa kweepoxy resin. Panguva imwecheteyo, dhizaini yemuromo wemidziyo yakakoshawo. Yakakodzera mhuno chimiro uye saizi inogona kuita epoxy resin kuyerera kunze pamwero wekuyerera wakafanana.

2. Kuronga Kwekudurura Nzira

Zvinoenderana nechimiro chechip uye bracket, ronga inonzwisisika yekudira nzira. Multi-point kudira kana point-by-point nzira dzekudira dzinogona kugamuchirwa kuti ive nechokwadi chekuti epoxy resin inoyerera zvakaenzana yakananga kune chip kubva kwakasiyana nzira. Munguva yekudurura, teerera kutevedzana kwekudira uye nguva yekuvharira kudzivirira kuunganidza kwakanyanya kana kusafamba zvakanaka kwe epoxy resin mune imwe nzvimbo.

(3) Degassing Treatment

1. Vacuum Degassing

Mushure mekunge epoxy resin yasanganiswa, isa mumushini wevacuum degassing wekurapa degassing. Munzvimbo yevacuum, mabhuru ari mu epoxy resin anosimuka uye anoputika nekuda kwekusiyana kwemukati nekunze kwekumanikidza, nekudaro kubvisa mabhuru. Iyo degassing nguva uye vacuum degree inoda kugadziridzwa zvine musoro zvichienderana nehunhu uye dosage ye epoxy resin. Kazhinji, iyo vacuum degree inodzorwa pakati -0.08MPa ne -0.1MPa, uye nguva yekubvisa i10 - 20 maminetsi.

2. Centrifugal Degassing

Mukuwedzera kune vacuum degassing, centrifugal degassing inogona kushandiswa zvakare. Isa iyo yakasanganiswa epoxy resin mumudziyo we centrifugal, uye simba re centrifugal rinogadzirwa ne-high-speed rotation rinoita kuti mabubbles atarise pamusoro pe epoxy resin, uye obva abvisa nzvimbo yepamusoro ine mabhubhu. Iko kumhanya uye nguva ye centrifugal degassing inodawo kugadziriswa maererano nemamiriro chaiwo.

(4) Kudzora kweKurapa Maitiro

1. Uniform Temperature Distribution

Munguva yekurapa maitiro, zvakakosha kuve nechokwadi chekugovera tembiricha yakafanana muchoto chekurapa. Iyo yakakwirira-chaiyo tembiricha yekudzora dhizaini uye yakanaka dhizaini yekupisa inogona kushandiswa kugonesa epoxy resin kuti ive yakaenzana kupisa panguva yekurapa. Semuyenzaniso, shandisa choto chinopisa chine mhepo inopisa inotenderera, iyo inogona kuita kuti tembiricha muchoto iwedzere yunifomu uye kudzivirira kusakwana kurapa kwe epoxy resin nekuda kwekunyanya kupisa kana kuderera kwenzvimbo.

2. Yakakodzera Kurapa Speed

Kudzora kumhanya kwekuporesa kunogona kukanganisawo yunifomu encapsulation mhedzisiro ye epoxy resin. Kukurumidza kurapa kumhanyisa kunogona kuita kuti epoxy resin irape isati yanyatsoyerera uye yakavharira chip, ukuwo kunonoka kurapa kunokanganisa kushanda zvakanaka kwekugadzira. Zvinoenderana nemagadzirirwo uye maitiro eepoxy resin, sarudza yakakodzera kurapa tembiricha curve uye nguva yekugonesa epoxy resin kupedzisa kurapa mukati menguva yakakodzera uye zvakafanana encapsulate chip.

 

Common Process Matambudziko

(1) Dambudziko reBubble

1. Zvikonzero zveBubble Generation

Mabhabhu anogona kugadzirwa panguva yekusanganisa, kudurura uye kurapa maitiro epoxy resin. Semuenzaniso, kusaenzana kubvongodza panguva yekusanganiswa kuchaunza mhepo uye kuumba mabhubhu; Kukurumidza kudururira kukurumidza kana nzira yekudurura isina kufanira ichaunzawo mweya mu epoxy resin; uyezve, kushushikana kwepamusoro uye viscosity maitiro eepoxy resin pachayo zvinokanganisa chizvarwa uye kubviswa kwemabhuru.

2. Mhedzisiro yeBubbles pane Uniform Encapsulation

Kuvepo kwemabhuru kunoparadza kufanana kweiyo epoxy resin, zvichikonzera voids kana cavities kumativi chip, kukanganisa optical performance uye kupisa kupisa kushanda kwe LED. Panguva imwecheteyo, mabhuru anogona kuwedzera kana kuputika panguva yekurapa, zvichiwedzera kukanganisa encapsulation effect uye encapsulation quality ye epoxy resin.

(2) Fluidity Dambudziko reEpoxy Resin

1. Zvikonzero zvekusakwana Fluidity

Iyo fluidity ye epoxy resin inobatwa nezvinhu zvakawanda, zvakadai sekushisa, viscosity, kuumbwa, nezvimwewo. Kana iyo viscosity ye epoxy resin yakanyanya, zvichava zvakaoma kuyerera zvakaenzana zvakapoteredza chip panguva yekudurura, zvichiita kuti kusaenzana encapsulation. Uye zvakare, yakaderera tembiricha ye ambient zvakare inoderedza kuyerera kweiyo epoxy resin, zvichiita kuti zviome kuzadza zvizere maburi pakati pe chip uye bracket.

2. Matambudziko eFluidity kune Uniform Encapsulation

Kusakwana kwemvura kunokonzeresa kuti epoxy resin iumbe kuunganidzwa kwenzvimbo yakatenderedza chip kana kutadza kuvhara zvachose chip. Dambudziko iri rakanyanya kusimba kunyanya kune mamwe machipisi kana mabhureki ane zvakaomarara zvimiro. Izvi hazvizongokanganisa maoptical performance ye LED, asi zvakare zvinotungamira kune isina kuenzana bonding simba pakati pe chip uye epoxy resin, kuderedza kuvimbika kweiyo encapsulation.

(3) Chip Position Kutsauka

1. Zvikonzero Zvekutsauka Kwenzvimbo

Munguva yekudira epoxy resin, chip inogona kutsauka kubva pachinzvimbo chayo nekuda kwesimba rekuita remvura kana tension yepasi. Uye zvakare, iyo yekurapa shrinkage kana kusaenzana kweanofa bonding adhesive panguva yekufa bonding process inogonawo kukonzera shanduko yechinzvimbo chechip.

2. Impact yePosition Kutsauka paUniform Encapsulation

Kutsauka kweiyo chip chinzvimbo kuchaita kuti epoxy resin ive isina kuvharwa yakatenderedza chip. Zvinogona kutungamira kune epoxy resin kuve yakakora mune dzimwe nzvimbo uye yakatetepa kana kutotadza kuvhara mune zvimwe zvikamu. Izvi zvichakanganisa zvakanyanya kutaridzika uye magetsi eiyo LED uye kuderedza kuenderana uye kuvimbika kwechigadzirwa.

(4) Kusaenzana Kurapa kweEpoxy Resin

1. Zvikonzero Zvokusakwana Kurapa

Kurapa kusina kuenzana kunogona kukonzerwa nekusaenzana kwekugovera tembiricha muchoto chekubika, kugadzirwa kusina kuenzana kweepoxy resin kana kudzora kusiri iko kwekumhanya kwekurapa. Uye zvakare, mutsauko mukupisa kwekupisa pakati pechip uye bracket unogona zvakare kutungamira kune kwakasiyana kurapa kumhanya kweiyo epoxy resin muzvikamu zvakasiyana.

2. Mhedzisiro yekusaenzana Kurapa kweUniform Encapsulation

Kurapa kusina kuenzana kuchaita kuti epoxy resin iite kuoma kwakasiyana uye kuwanda kwakatenderedza chip, ichikanganisa kudzivirira kwayo uye kutsigira mhedzisiro pane chip. Panguva imwecheteyo, zvinogonawo kutungamirira kune simba risingapindirani rekubatanidza pakati pe epoxy resin uye chip uye bracket, uye zvinetso zvakadai sekuputika kana kupemha zvinogona kuitika munguva yekushandiswa kwenguva refu.

 

Solutions

(1) Mhinduro kune Dambudziko reBubble

1. Optimize The Mixing Process

Pakusanganisa epoxy resin, shandisa nzira yakakodzera yekukuchidzira uye nekumhanyisa kuona kuti epoxy resin inosanganiswa zvakakwana pasina kuunza mhepo yakawandisa. Nzira yepasi-speed yekukuchidzira nekuwedzera nguva yekunyandura inogona kugamuchirwa, uye edza kudzivirira zviito zvinokurudzira zvine chisimba panguva yekukurudzira. Mukuwedzera, zvikamu zve epoxy resin zvinogona kupiswa zvisati zvasanganiswa kuti zvideredze viscosity yayo uye kuvandudza maitiro ekusanganisa.

2. Kuvandudza Kudira Kwacho

Paunenge uchidira epoxy resin, dzora kumhanya kwekudira kuti udzivise kuunza mweya mukati nekuda kwekukurumidza kudururira. Nzira yekudira inononoka uye yakafanana inogona kugamuchirwa, uye kumbomira zvakakodzera panguva yekudira kuti ubvumire epoxy resin kuyerera zvizere uye kuburitsa mabhuru. Panguva imwecheteyo, sarudza midziyo yekudira yakakodzera uye nozzles kuti uve nechokwadi chekuti epoxy resin inogona kuyerera zvakanaka ichitenderedza chip.

3. Simbisa iyo Degassing Treatment

Kuwedzera kune yakambotaurwa vacuum degassing uye centrifugal degassing, chiyero chakakodzera che defoamer chinogonawo kuwedzerwa kune epoxy resin. Iyo defoamer inogona kuderedza tension yepasi ye epoxy resin, zvichiita kuti zvive nyore kuti mabubbles aputika uye abviswa. Zvisinei, teerera kuhuwandu hwe defoamer yakawedzerwa, sezvo yakawandisa defoamer inogona kukanganisa kushanda kwe epoxy resin.

(2) Mhinduro kune Fluidity Dambudziko reEpoxy Resin

1. Gadzirisa iyo Epoxy Resin Kugadzira

Rongedza kuumbwa kweiyo epoxy resin kuderedza viscosity yayo uye kugadzirisa fluidity yayo. Nhamba yakakodzera ye diluent inogona kuwedzerwa kana yakaderera-viscosity epoxy resin matrix inogona kusarudzwa. Asi kana uchigadzirisa kuumbwa, teerera kuchengetedza zvimwe zvimiro zveepoxy resin, senge optical, mechanical uye kuporesa zvinhu.

2. Dzora Tembiricha yeAmbient

Usati wadira epoxy resin, preheat epoxy resin uye encapsulation environment kusvika kune yakakodzera tembiricha kuti uvandudze fluidity ye epoxy resin. Kazhinji kutaura, kuwedzera kwekushisa kunoderedza viscosity ye epoxy resin uye kuwedzera fluidity yayo. Asi chenjerera kudzora tembiricha mukati mehumwe hunyoro kuti udzivise kurapa nguva isati yakwana kana kushatisa kwekuita kwe epoxy resin nekuda kwekunyanya kupisa.

3. Gadzirisa Chimiro cheBracket

Gadzirisa chimiro chebhureki kuti uderedze kuramba kuyerera kwe epoxy resin. Semuenzaniso, dzikisa makona akapinza uye maprotrusions pabhuraketi kuti epoxy resin ifambe zvakanaka. Panguva imwecheteyo, mamwe ekubatsira kuyerera zvimiro, senge diversion grooves kana maburi, anogona kusetwa pachibhuraketi.

(3) Mhinduro kuChip Position Deviation Problem

1. Kuvandudza Die Bonding Process

Kuvandudza iko kurongeka uye kugadzikana kweiyo kufa bonding process kuti uve nechokwadi chekuti chip chakanyatso kugadzika pabhuraketi. Shandisa yakakwirira-chaiyo die bonders uye emhando yepamusoro kufa bonding adhesives, dzora huwandu hwekugovera uye chinzvimbo chefa bonding adhesive, uye simbisa iyo chaiyo chinzvimbo chechip usati wadira epoxy resin. Pamusoro pezvo, kurapa kwakakodzera kwekurapa kunogona kuitwa mushure mekufa kusungirirana kusimbisa simba rekufa kunonamira uye kudzivirira chip kubva pakutsauka panguva dzinotevera maitiro.

2. Optimize Kudurura Maitiro

Paunenge uchidira epoxy resin, dzora kumhanya kwekudira uye gwara kuti uderedze simba rekuita remvura pachip. Multi-point kudira kana nhanho-ne-nhanho nzira dzekudira dzinogona kugamuchirwa kuita kuti epoxy resin igovane zvakaenzana kutenderedza chip uye kudzivirira kutsauka kwechip kunokonzerwa nekudzvinyirira kwakanyanya kwenzvimbo. Panguva imwecheteyo, kona yebhureketi inogona kugadziridzwa zvakafanira panguva yekudurura kuitira kuti epoxy resin ifambe zvakajairika kutenderedza chip.

(4) Mhinduro kune Kusaenzana Kurapa Dambudziko reEpoxy Resin

1. Optimize The Curing Equipment

Shandisa yakakwirira-chaiyo yekurapa michina kuti uve nechokwadi chekugovera tembiricha yakafanana muchoto chekurapa. Choto chekurapa chine tembiricha sensor uye mhinduro yekudzora system inogona kushandiswa kutarisa uye kugadzirisa tembiricha muchoto munguva chaiyo. Panguva imwecheteyo, gara uchichengetedza uye kuenzanisa michina yekurapa kuti ive nechokwadi cheiyo tembiricha kutonga kwayo.

2. Gadzirisa iyo Epoxy Resin Kugadzira

Gadzirisa kuumbwa kwe epoxy resin kuita kuti maitiro ekurapa awedzere kufanana. Mumiririri wekurapa ane kukurumidza kugadzikana kwekurapa anogona kusarudzwa, uye huwandu hweanorapa hunogona kugadziriswa zvine musoro. Pamusoro pezvo, zvimwe zvekuwedzera zvinokurudzira kurapa kwakafanana, senge latent kurapa maajenti kana coupling agents, zvinogonawo kuwedzerwa.

3. Dzora Kurapa Maitiro

Munguva yekurapa, nyatso kudzora tembiricha yekurapa uye nguva, uye shanda zvinoenderana nekupora curve ye epoxy resin. Iyo yakakamurwa kurapa nzira inogona kugamuchirwa, tanga waita kurapa kune yakaderera tembiricha kuitira kuti epoxy resin itange kuporeswa uye kuumba rimwe simba, uye wobva waita kurapa kwakazara patembiricha yakakwira kuti uve nechokwadi chekuti epoxy resin inoporeswa zvakafanana kutenderedza chip.

mhedziso

Kusimbisa yunifomu encapsulation ye LED machipisi ane epoxy resin chinhu chakakosha chinongedzo muiyo LED encapsulation process, iyo inobata zvakananga kuita uye kuvimbika kwe LEDs. Kuburikidza nenzira dzakadai seyakanyatso dhizaini dhizaini, kutonga kwekudurura, kurapwa kwe degassing uye kutonga kwemaitiro ekurapa, kufanana kwe epoxy resin encapsulation kunogona kuvandudzwa. Panguva imwecheteyo, kune zvakajairika maitiro ematambudziko, akadai sebubble matambudziko, fluidity matambudziko epoxy resin, chip chinzvimbo kutsauka uye kusaenzana kurapa, mhinduro dzinoenderana dzinogona kugamuchirwa kuti dziwedzere kunatsiridza encapsulation mhando. Mukugadzirwa chaiko, zvinodikanwa kuenderera mberi nekukwenenzvera nzira yekuisa uye kusimbisa kudzora kwemhando kusangana nemusika kudiwa kwemhando yepamusoro zvigadzirwa zve LED uye kusimudzira kusimukira kwakasimba kweindasitiri yeLED. Mune ramangwana, nekuenderera mberi kwekuenderera mberi kwehunyanzvi hweLED uye nekuenderera mberi kwekuwedzera kweminda yekushandisa, izvo zvinodikanwa zveepoxy resin encapsulation process zvichakwira nepamusoro. Kuenderera mberi tekinoroji innovation uye tsvagiridzo inodiwa kuti ienderane nezvinodiwa zvebudiriro zveindasitiri.

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